• Korean Journal of Materials Research
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• v.17 no.4
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• pp.222-226
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• 2007

[ $SiO_2$ ]thin films containing Si-nanocrystals and $Er^{3+}$ were fabricated by the RF-sputtering method. Intense emission of $Er^{3+}$ was observed at 1530 nm region after the annealing of the film at $1050^{circ}C$ for 5 min. Channel waveguides were fabricated using such films for the core. The films containing Si higher than 2.4 at% exhibited the change in stress from compression to tension after annealing, which induced the fatal loss-increase in waveguide. The optical gain might be attained by the Er-doped waveguide with Si lower than 2.4 at% by a visible-light-excitation.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.116-121
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• 2003

Ti-Si-N coating layers were deposited onto WC-Co substrates by a hybrid system of arc ion plating (AIP) and sputtering techniques. The tribological behaviors of Ti-Si-N coating layers with various Si contents were investigated by the dry sliding wear experiments, which were conducted at three different sliding speeds, 0.1, 0.3, 0.5 m/s, against the steel and alumina balls. In the case of steel ball, the average friction coefficient slightly decreased with increasing the sliding speed regardless of Si content due to adhesive wear behavior between coating layer and steel ball. At constant sliding speed, the average friction coefficient decreased with increase of Si content. On the contrary, in the case of alumina ball, the average friction coefficient increased with increasing the sliding speed regardless of Si content, indicating that the abrasive wear behavior was more dominant when the coating layers slide against alumina ball. Through these experimental results, it was found that the tribological behaviors of Ti-Si-N coating layers were effected by factors such as Si content, sliding speed, and kinds of counterpart materials rather than the hardness of coating layer.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.38-39
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• 2006

We present experimental results that regard the effects of catalyst preparation on the structural and field-emissive properties of CNTs. The CNTs used in this research have been synthesized using the inductively coupled plasma-chemical vapor deposition (ICP-CVD) method. Catalyst materials (such as Ni, Co, and Invar 426) are varied and deposited on buffer films by RF magnetron sputtering. Prior to growth of CNTs, $NH_3$ plasma etching has also been performed with varying plasma etching time and power. For all the CNTs grown, nanostructures and morphologies are analyzed using Raman spectroscopy and FESEM, in terms of buffer films, catalyst materials, and pre-treatment conditions. Furthermore, the field electron-emission of CNTs are measured and characterized in terms of the catalyst preparation environments. The CNTs grown on Nicatalyst layer would be more effectual for enhancing the growth rate and achieving the vertical-alignment of CNTs rather than other buffer materials from results of SEM study. The crystalline graphitic structure of CNTs is improved as the catalyst dot reaches a critical size. Also, the field-emission result shows that the CNTs using Ni catalyst would be more favorable for improving electron-emission capabilities of CNTs compared with other samples.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1488-1490
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• 2000

ZnO:Cu thin films are deposited by using an RF magnetron co-sputtering system with Cu chips attached on ZnO target. Structural and electrical properties are analyzed as a function of deposition conditions, such as Cu chip areas, $O_2/(Ar+O_2)$ ratios, and working pressures, The results show that a higher electrical resistivity above $10^{10}$ ${\Omega}cm$ along with an excellent c-axial growth can be easily achieved by Cu-doping. SAW filters based on the ZnO:Cu films are also fabricated to estimate the electric-mechanical coupling coefficient($K^{2}_{eff}$). Higher $K^{2}_{eff}$ and lower insertion losses are observed for ZnO:Cu films, compared with those for ZnO films.

• Journal of Magnetics
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• v.8 no.2
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• pp.89-92
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• 2003

The tunneling magnetoresistance (TMR) of a ramp-edge type junction with SrTiO$_3$barrier layer has been stud-ied. The samples with a structure of glass/NiO(600${\AA}$)/Co(100${\AA}$)/SrTiO$_3$(400 ${\AA}$)/SrTiO$_3$(20-100${\AA}$)/NiFe(100${\AA}$) were prepared by the sputtering and etched by the electron cyclotron (ECR) argon ion milling. Nonlinear I-V characteristics were obtained from a ramp-type tunneling junctions, having the dominant difference between two different external magnetic fields (${\pm}$100 Oe) perpendicular to the junction edge line. In the SrTiO$_3$ barrier thickness of 40${\AA}$, the TMR was 52.7% at a bias voltage of -50 mV The bias voltage dependence of resistance and TMR in a ramp-type tunneling junction was similar with those of the layered TMR junction.

• The Korean Journal of Ceramics
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• v.2 no.2
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• pp.95-101
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• 1996

Variations of the leakage current behaviors and interface potential barrier $({\Phi}_B)$ of rf-sputter deposited (Ba, Sr)$TiO_3$ (BST) thin films with thicknesses ranging from 20 nm to 150nm are investigated as a function of the thickness and bias voltages. The top and bottom electrodes are dc-sputter-deposited Pt films. ${\Phi}_B$ critically depends on the BST film deposition temperature, postannealing atmosphere and time after the annealing. The postannealing under $N_2$ atmosphere results in a high interface potential barrier height and low leakage current. Maintaining the BST capacitor in air for a long time reduces the ${\Phi}_B$ from about 2.4 eV to 1.6 eV due to the oxidation. ${\Phi}_B$ is not so dependent on the film thickness in this experimental range. The leakage conduction mechanism is very dependent on the BST film thickness; the 20 nm thick film shows tunneling current, 30 and 40 nm thick films show Shottky emission current.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.22-22
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• 2000

DRAM의 고접적화에 따라 기존의 반도체 공정에서 사용중인 여러 가지 기술들이 대부분 그 한계를 보이고 었으며, 대표적인 것이 캐퍼시터 형성기술이다. 따라서 1G DRAM급 이상의 초고집적 회로를 실용화하기 위해서 유전율이 높은 BST ($BrSrTiO_3$) 박막을 이용하여 캐패시터를 제조하려는 기술도 반드시 해결되어야 현재 활발히 실용화 연구가 진행중에 있다. BST 박막을 제조하는 방법은 RF magnetron sputtering, Ion beam reactive co-evaporation, LSM (Liquid Source Misted) CVD, MOCVD 등의 법으로 제조되고 있다. 본 연구에서는 전기-수력 학적 분무(Electro-Hydrodynamic Spray)현상을 이용한 MOCVD에 BaO, SrO, $TiO_2$ 박막을 증착 하여 전기장세기, 기판온도, 시간 등에 따른 특성을 조사하였다. 전기수력학적 분무를 이용한 증착법은 원료를 함유하는 용액을 이용함으로써 이송관의 가열이 필요 없이 장치를 간단하게 할 수 있고, 용액의 유량과 전기장의 세기에 따라 초미세 입자제어도 가능하며, 박막의 조성을 출발 용액으로 부터 조절하는 등의 특징을 가지고 있다. 증착한 박막의 표면, 단면 형상 및 조성을 분석하였고 결정화 여부 및 우선 배향성을 조사하였다. 현재는 개별 박막의 표현 형상과 조성에 대한 연구 결과를 얻었으며, 계속해서 박 막의 여러 특성에 대하 연구할 계획이다.

• Journal of Sensor Science and Technology
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• v.18 no.3
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• pp.202-206
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• 2009

Flat type catalytic combustible hydrogen sensors were fabricated using platinum micro-heaters and sensing material pastes. The platinum micro-heater was formed on an alumina substrate by sputtering method. The paste for the sensing materials was prepared using ${\gamma}-Al_2O_3$ 30 wt%, $SnO_2$ 35 wt%, and Pd/Pt 30 wt% and coated on the platinum micro-heater. The sensing performances were tested for the prepared sensors with different substrate sizes. The micro catalytic combustible hydrogen sensors showed quick response time, high reliability, and good selectivity against various gases(CO, $C_3H_8,\;CH_4$) at low operating temperature of $156^{\circ}\C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.174-175
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• 2007

A programmable metallization cell (PMC) memory structure with copper-saturated GeTe solid electrolyte films doped by nitrogen was prepared on a TiW bottom electrode by a co-sputtering technique at room temperature. The $Ge_{45}Te_{55}$ solid electrolyte films deposited with various $N_2$/Ar flow ratios showed an increase of crystallization temperature and especially, the electrolyte films deposited at $N_2$/Ar ratios above 30% showed a crystallization temperature above $400^{\circ}C$, resulting in surviving in a back-end process in semiconductor memory devices. The device with a 200 nm thick $Cu_{1-x}(Ge_{45}Te_{55})_x$ electrolyte switches at 1 V from an "off " state resistance, $R_{off}$, close to $10^5$ to an "on" resistance state, Ron, more than 20rders of magnitude lower for this programming current.

• Korean Journal of Materials Research
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• v.18 no.2
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• pp.61-64
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• 2008

Electrical optical switching and structural transformation of $Ge_{15}Sb_{85}$, $Sb_{65}Se_{35}$ and N2.0 sccm doped $Sb_{83}Si_{17}$ were studied to investigate the phase change characteristics for PRAM application. Sb-based materials were deposited by a RF magnetron co-sputtering system and the phase change characteristics were analyzed using an X-ray diffractometer (XRD), a static tester and a four-point probe. Doping Ge, Se or Si atoms reinforced the amorphous stability of the Sb-based materials, which affected the switching characteristics. The crystallization temperature of the Sb-based materials increased as the concentration of the Ge, Se or Si increased. The minimum time of $Ge_{15}Sb_{85}$, $Sb_{65}Se_{35}$ and N2.0 sccm doped $Sb_{83}Si_{17}$ for crystallization was 120, 50 and 90 ns at 12 mW, respectively. $Sb_{65}Se_{35}$ was crystallized at $170^{\circ}C$. In addition, the difference in the sheet resistances between amorphous and crystalline states was higher than $10^4{\Omega}/{\gamma}$.