Characterization of Cu-doped ZnO thin film and its application of SAW devices

Cu 도핑된 ZnO 박막의 물성 및 SAW 소자 응용

  • LEE, Jin-Bock (Dept. of Electrical Engineering, Hanyang University) ;
  • LEE, Hye-Jung (Dept. of Electrical Engineering, Hanyang University) ;
  • SHIN, Wan-Chul (Dept. of Electrical Engineering, Hanyang University) ;
  • SEO, Soo-Hyung (Center for Electronic Materials and Components, Hanyang University) ;
  • PARK, Jin-Seok (Dept. of Electrical Engineering, Hanyang University)
  • 이진복 (한양대학교 전기공학과) ;
  • 이혜정 (한양대학교 전기공학과) ;
  • 신완철 (한양대학교 전기공학과) ;
  • 서수형 (한양대학교 전자재료 및 부품연구센터) ;
  • 박진석 (한양대학교 전기공학과)
  • Published : 2000.07.17

Abstract

ZnO:Cu thin films are deposited by using an RF magnetron co-sputtering system with Cu chips attached on ZnO target. Structural and electrical properties are analyzed as a function of deposition conditions, such as Cu chip areas, $O_2/(Ar+O_2)$ ratios, and working pressures, The results show that a higher electrical resistivity above $10^{10}$ ${\Omega}cm$ along with an excellent c-axial growth can be easily achieved by Cu-doping. SAW filters based on the ZnO:Cu films are also fabricated to estimate the electric-mechanical coupling coefficient($K^{2}_{eff}$). Higher $K^{2}_{eff}$ and lower insertion losses are observed for ZnO:Cu films, compared with those for ZnO films.

Keywords