• Geomechanics and Engineering
• /
• 제15권3호
• /
• pp.811-822
• /
• 2018

Chip size distribution can be used to evaluate the cutting efficiency and to characterize the cutting behavior of rock during cutting and fragmentation process. In this study, a series of linear cutting tests was performed to investigate the effect of cutting conditions (specifically cut spacing and penetration depth) on the production and size distribution of rock chips. Linyi sandstone from China was used in the linear cutting tests. After each run of linear cutting machine test, the rock chips were collected and their size distribution was analyzed using a sieving test and image processing. Image processing can rapidly and cost-effectively provide useful information of size distribution. Rosin-Rammer distribution pamameters, the coarseness index and the coefficients of uniformity and curvature were determined by image processing for different cutting conditions. The size of the rock chips was greatest at the optimum cut spacing, and the size distribution parameters were highly correlated with cutter forces and specific energy.

• 한국전기전자재료학회논문지
• /
• 제32권1호
• /
• pp.47-52
• /
• 2019

Micro-LEDs show lower efficiencies compared to general LEDs having large areas. Simulations were carried out using ray-tracing software to investigate the change in light extraction efficiency and light distribution according to chip-size of blue flip-chip micro-LEDs (FC ${\mu}-LEDs$). After fixing the height of the square FC ${\mu}-LED$ chip at $158{\mu}m$, the length of one side was varied, with dimensions of 2, 5, 10, 30, 50, 100, 300, and $500{\mu}m$. The highest light-extraction efficiency was obtained at $10{\mu}m$, beyond which the efficiency decreased as the chip-size increased. The chip size-dependence of the FC ${\mu}-LEDs$ both without the patterned sapphire substrate, as well as vertical FC ${\mu}-LEDs$, were analyzed.

• Journal of electromagnetic engineering and science
• /
• 제11권4호
• /
• pp.282-289
• /
• 2011

GHz electromagnetic interference (EMI) characteristics are analyzed for a 3dimensional (3D) stacked chip power distribution network (PDN) with through silicon via (TSV) connections. The EMI problem is mostly raised by P/G (power/ground) noise due to high switching current magnitudes and high PDN impedances. The 3D stacked chip PDN is decomposed into P/G TSVs and vertically stacked capacitive chip PDNs. The TSV inductances combine with the chip PDN capacitances produce resonances and increase the PDN impedance level in the GHz frequency range. These effects depend on stacking configurations and P/G TSV designs and are analyzed using the P/G TSV model and chip PDN model. When a small size chip PDN and a large size chip PDN are stacked, the small one's impedance is more seriously affected by TSV effects and shows higher levels. As a P/G TSV location is moved to a corner of the chip PDNs, larger PDN impedances appear. When P/G TSV numbers are enlarged, the TSV effects push the resonances to a higher frequency range. As a small size chip PDN is located closer to the center of a large size chip PDN, the TSV effects are enhanced.

• 한국전자파학회논문지
• /
• 제13권7호
• /
• pp.633-640
• /
• 2002

본 논문에서는 이중공진 칩 meander 안테나를 제안하였다. 제안된 안테나는 기존 meander 안테나의 소형화 특성을 유지하면서 인접한 주파수에서 이중공진하는 특징을 갖는다. LTCC-MLC 공정을 이용하여 제작하였고, 2.20 GHz와 2.883 GHz에서 이중공진(주파수비=1.35)하며, meander 패치의 크기는 15.7 mm $\times$ 6.52 mm( 0.32 λg $\times$ 0.133 λg)이다. 그리고 이중공진 meander 안테나의 추가적인 소형화를 위해 3차원 구조를 제안한다. 이 3차원 구조를 이용하여 약 50 %의 크기를 추가적으로 소형화하였다. 전류분포를 통해 제안된 안테나가 이중공진하는 원리를 확인하였고, 제작된 안테나의 반사손실 및 방사패턴의 특성을 분석하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
• /
• pp.270-277
• /
• 2003

Thermal performance of flip chip bonding with Sn-3.5Ag solder ball was studied. The temperature distribution was measured with IR(InfraRed) camera of 25 urn resolution. The measurement shows that most of the samples had much higher maximum temperature than average temperature. With central heater and 2.5 (W), the difference between maximum and average temperature is over $80^{\circ}C$. The distribution was influenced by the location of heater, the distance from heater to flip chip bonding, and the passivation opening of solder bumps. To reduce the maximum temperature, the bigger passivation opening, the smaller chip size, and the closer location of heater to flip chip bumps are preferrable.

• The Journal of Asian Finance, Economics and Business
• /
• 제7권12호
• /
• pp.783-793
• /
• 2020

This research investigates the explanatory factors governing the dividend payout to shareholders of blue-chip companies listed on Bursa Malaysia. In spite of continuous attention offered by empirical research on dividend payout of publicly-listed companies, paradoxically only few studies exclusively examined the explanatory factors from the perspective of blue-chip companies. Recognizing the capability of blue-chip companies to serve as a stalwart indicator of stock market condition as well as a consistent income source to shareholders, more research should be carried out for better inference on the companies' dividend payout decision. This research is using 522 observations from a sample of 18 Malaysian blue-chip companies over a 29-year period (1990 to 2019) and utilizes a panel data regression analysis for the estimation of the impact of eight factors, namely, systematic risk, leverage, free cash flow, lagged dividends, market-to-book value, profit growth, total asset turnover, and company size. Measuring dividend payout using two specifications (dividend/earnings and dividend/total assets), this research reveals that systematic risk and free cash flow have a significant and negative impact on dividend payout. Meanwhile, past year dividends, market-to-book value, profit growth, total asset turnover and company size have a significant and positive impact on dividend payout.

• Elastomers and Composites
• /
• 제58권2호
• /
• pp.87-94
• /
• 2023

Abrasion tests of an SBR compound were conducted using four different types of abrasion testers (cut and chip, Lambourn, DIN, and LAT100). The abrasion test results were analyzed in terms of size distributions and morphologies of the wear particles. Most wear particles were larger than 1000 ㎛. The wear particle size distributions tended to decrease as the particle size decreased. Except for the Lambourn abrasion test, the wear particles smaller than 212 ㎛ were rarely generated by the other three abrasion tests, implying that small wear particles were produced through friction by introducing talc powder. Shapes of the wear particles varied depending on the abrasion testers. The wear particles generated from the Lambourn abrasion tester had stick-like shapes. The cut and chip abrasion test showed a clear abrasion pattern, but the DIN abrasion test did not show any specific abrasion pattern. The Lambourn and LAT100 abrasion tests showed irregular abrasion patterns.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2008년도 추계학술대회B
• /
• pp.2688-2691
• /
• 2008

This study addresses a microfluidic method to uniformly form diacetylene (DA) liposomes and control their size. DA liposomes are biochemical sensor materials with a unique property such that when they are polymerized to polydiacetylene (PDA) they exhibit non-fluorescent blue to fluorescent red phase transition upon chemical or thermal stress. The liposome size and distribution are important because they significantly affect the phase transition. So far, DA Liposomes, have been prepared by mixing of bulk phases leading to heterogeneous, polydisperse distribution in size. Therefore, additional post-processes are required such as sonication or membrane extrusion to obtain an appropriate size of liposomes. Here, we report a novel strategy using a microfluidic chip and hydrodynamic focusing to form DA liposomes and control their size. Preliminary results obtained by scanning electron microscope (SEM) and dynamic light scattering (DLS) show that the microfluidic strategy generates more monodispersed liposomes than a bulk method.

• 한국생산제조학회지
• /
• 제23권6호
• /
• pp.609-617
• /
• 2014

We have studied a chip-on-board LED lighting optical system for various luminous-intensity-distribution angles of the LED. An optical system that can accept different LEDs was made to reduce the systems's weight and size as we selected the chip-on-board LED, which is easy to apply to optical systems, unlike existing package-on-board LEDs. The luminous-intensity-distribution angles were $45^{\circ}$, $60^{\circ}$, $90^{\circ}$, and $120^{\circ}$. We researched these four types of optical systems. The $45^{\circ}$ and $60^{\circ}$ units were developed into reflectors, and the $90^{\circ}$ and $120^{\circ}$ units, into lenses. We checked the performance of the designed optical system through simulation and made a mock-up. Then we made a prototype of the chip-on-board LED high bay for use with the mock-up. After measuring its performance, we tested the luminous-intensity-distribution angles and compared them with simulation data. The resulting prototype was developed considering brightness, light uniformity, age, and economics which are suitable for a factory environment.

• 자원리싸이클링
• /
• 제3권1호
• /
• pp.38-43
• /
• 1994

국내의 반도체 회사에서 발생한 IC칩 스크랩의 기계적인 전처리를 통하여 귀금속 및 유가금속을 분리하는 연구를 행하였다. IC칩 스크랩을 절단, 분쇄한 뒤 분쇄된 스크랩의 입자크기에 따른 금속의 분포도를 조사하였으며 함유되어 있는 금속편을 자력선별에 의하여 분리하였다. 일련의 분쇄공정을 통하여 얻어 진 IC칩 스크랩 분쇄물의 입도분포는 +3 mm가 7.5%, 3~1 mm가 17.0%, -1 mm가 75.5%야였다. 분쇄물을 $700^{\circ}C$에서 배소하였을 때 중량감소율은 약 18%이였으며 입도분포에 따른 금속의 함량은 十3mm에서 97%, 1~3mm에서 96%, 1~0.595 mm에서 13% 및 0.595~0.5mm에서 3.7%이었다. Au는 99%가 -lmm의 분쇄물에 존재하였다. 자력선별기를 사용하여 700 및 1,500 Gauss로 Ni, Fe, Cu, Sn, Pb를 분리 회수할 수 있었다.