Sn-3.5Ag 솔더를 이용한 페리퍼럴 어레이 플립칩의 열 성능 분석

Thermal performance of flip chip bonding with Sn-3.5Ag solder ball was studied. The temperature distribution was measured with IR(InfraRed) camera of 25 urn resolution. The measurement shows that most of the samples had much higher maximum temperature than average temperature. With central heater and 2.5 (W), the difference between maximum and average temperature is over $80^{\circ}C$. The distribution was influenced by the location of heater, the distance from heater to flip chip bonding, and the passivation opening of solder bumps. To reduce the maximum temperature, the bigger passivation opening, the smaller chip size, and the closer location of heater to flip chip bumps are preferrable.