• Geomechanics and Engineering
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• v.15 no.3
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• pp.811-822
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• 2018

Chip size distribution can be used to evaluate the cutting efficiency and to characterize the cutting behavior of rock during cutting and fragmentation process. In this study, a series of linear cutting tests was performed to investigate the effect of cutting conditions (specifically cut spacing and penetration depth) on the production and size distribution of rock chips. Linyi sandstone from China was used in the linear cutting tests. After each run of linear cutting machine test, the rock chips were collected and their size distribution was analyzed using a sieving test and image processing. Image processing can rapidly and cost-effectively provide useful information of size distribution. Rosin-Rammer distribution pamameters, the coarseness index and the coefficients of uniformity and curvature were determined by image processing for different cutting conditions. The size of the rock chips was greatest at the optimum cut spacing, and the size distribution parameters were highly correlated with cutter forces and specific energy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.1
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• pp.47-52
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• 2019

Micro-LEDs show lower efficiencies compared to general LEDs having large areas. Simulations were carried out using ray-tracing software to investigate the change in light extraction efficiency and light distribution according to chip-size of blue flip-chip micro-LEDs (FC ${\mu}-LEDs$). After fixing the height of the square FC ${\mu}-LED$ chip at $158{\mu}m$, the length of one side was varied, with dimensions of 2, 5, 10, 30, 50, 100, 300, and $500{\mu}m$. The highest light-extraction efficiency was obtained at $10{\mu}m$, beyond which the efficiency decreased as the chip-size increased. The chip size-dependence of the FC ${\mu}-LEDs$ both without the patterned sapphire substrate, as well as vertical FC ${\mu}-LEDs$, were analyzed.

• Journal of electromagnetic engineering and science
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• v.11 no.4
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• pp.282-289
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• 2011

GHz electromagnetic interference (EMI) characteristics are analyzed for a 3dimensional (3D) stacked chip power distribution network (PDN) with through silicon via (TSV) connections. The EMI problem is mostly raised by P/G (power/ground) noise due to high switching current magnitudes and high PDN impedances. The 3D stacked chip PDN is decomposed into P/G TSVs and vertically stacked capacitive chip PDNs. The TSV inductances combine with the chip PDN capacitances produce resonances and increase the PDN impedance level in the GHz frequency range. These effects depend on stacking configurations and P/G TSV designs and are analyzed using the P/G TSV model and chip PDN model. When a small size chip PDN and a large size chip PDN are stacked, the small one's impedance is more seriously affected by TSV effects and shows higher levels. As a P/G TSV location is moved to a corner of the chip PDNs, larger PDN impedances appear. When P/G TSV numbers are enlarged, the TSV effects push the resonances to a higher frequency range. As a small size chip PDN is located closer to the center of a large size chip PDN, the TSV effects are enhanced.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.7
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• pp.633-640
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• 2002

In this paper, the small chip meander antenna for dual-frequency operation is presented. The proposed chip meander antennas was fabricated by the ceramic chip using LTCC-MLC process. It is a novel compact dual-frequency design using a meandered patch that achieves more degrees of freedom for adjusting dual-frequency operation and the size reduction with narrow frequency ratio. And it is proposed that the 3D structure for additional size reduction of the meander antenna. The size reduction of the 3D meander antenna is as large as 50 % as compared to the design for dual-frequency operation not using 3D structure. It is observed that the principle of dual-frequency operation through current distribution, return loss and radiation pattern.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.270-277
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• 2003

Thermal performance of flip chip bonding with Sn-3.5Ag solder ball was studied. The temperature distribution was measured with IR(InfraRed) camera of 25 urn resolution. The measurement shows that most of the samples had much higher maximum temperature than average temperature. With central heater and 2.5 (W), the difference between maximum and average temperature is over $80^{\circ}C$. The distribution was influenced by the location of heater, the distance from heater to flip chip bonding, and the passivation opening of solder bumps. To reduce the maximum temperature, the bigger passivation opening, the smaller chip size, and the closer location of heater to flip chip bumps are preferrable.

• The Journal of Asian Finance, Economics and Business
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• v.7 no.12
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• pp.783-793
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• 2020

This research investigates the explanatory factors governing the dividend payout to shareholders of blue-chip companies listed on Bursa Malaysia. In spite of continuous attention offered by empirical research on dividend payout of publicly-listed companies, paradoxically only few studies exclusively examined the explanatory factors from the perspective of blue-chip companies. Recognizing the capability of blue-chip companies to serve as a stalwart indicator of stock market condition as well as a consistent income source to shareholders, more research should be carried out for better inference on the companies' dividend payout decision. This research is using 522 observations from a sample of 18 Malaysian blue-chip companies over a 29-year period (1990 to 2019) and utilizes a panel data regression analysis for the estimation of the impact of eight factors, namely, systematic risk, leverage, free cash flow, lagged dividends, market-to-book value, profit growth, total asset turnover, and company size. Measuring dividend payout using two specifications (dividend/earnings and dividend/total assets), this research reveals that systematic risk and free cash flow have a significant and negative impact on dividend payout. Meanwhile, past year dividends, market-to-book value, profit growth, total asset turnover and company size have a significant and positive impact on dividend payout.

• Elastomers and Composites
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• v.58 no.2
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• pp.87-94
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• 2023

Abrasion tests of an SBR compound were conducted using four different types of abrasion testers (cut and chip, Lambourn, DIN, and LAT100). The abrasion test results were analyzed in terms of size distributions and morphologies of the wear particles. Most wear particles were larger than 1000 ㎛. The wear particle size distributions tended to decrease as the particle size decreased. Except for the Lambourn abrasion test, the wear particles smaller than 212 ㎛ were rarely generated by the other three abrasion tests, implying that small wear particles were produced through friction by introducing talc powder. Shapes of the wear particles varied depending on the abrasion testers. The wear particles generated from the Lambourn abrasion tester had stick-like shapes. The cut and chip abrasion test showed a clear abrasion pattern, but the DIN abrasion test did not show any specific abrasion pattern. The Lambourn and LAT100 abrasion tests showed irregular abrasion patterns.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2688-2691
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• 2008

This study addresses a microfluidic method to uniformly form diacetylene (DA) liposomes and control their size. DA liposomes are biochemical sensor materials with a unique property such that when they are polymerized to polydiacetylene (PDA) they exhibit non-fluorescent blue to fluorescent red phase transition upon chemical or thermal stress. The liposome size and distribution are important because they significantly affect the phase transition. So far, DA Liposomes, have been prepared by mixing of bulk phases leading to heterogeneous, polydisperse distribution in size. Therefore, additional post-processes are required such as sonication or membrane extrusion to obtain an appropriate size of liposomes. Here, we report a novel strategy using a microfluidic chip and hydrodynamic focusing to form DA liposomes and control their size. Preliminary results obtained by scanning electron microscope (SEM) and dynamic light scattering (DLS) show that the microfluidic strategy generates more monodispersed liposomes than a bulk method.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.6
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• pp.609-617
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• 2014

We have studied a chip-on-board LED lighting optical system for various luminous-intensity-distribution angles of the LED. An optical system that can accept different LEDs was made to reduce the systems's weight and size as we selected the chip-on-board LED, which is easy to apply to optical systems, unlike existing package-on-board LEDs. The luminous-intensity-distribution angles were $45^{\circ}$, $60^{\circ}$, $90^{\circ}$, and $120^{\circ}$. We researched these four types of optical systems. The $45^{\circ}$ and $60^{\circ}$ units were developed into reflectors, and the $90^{\circ}$ and $120^{\circ}$ units, into lenses. We checked the performance of the designed optical system through simulation and made a mock-up. Then we made a prototype of the chip-on-board LED high bay for use with the mock-up. After measuring its performance, we tested the luminous-intensity-distribution angles and compared them with simulation data. The resulting prototype was developed considering brightness, light uniformity, age, and economics which are suitable for a factory environment.

• Resources Recycling
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• v.3 no.1
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• pp.38-43
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• 1994

The separation of valuable metals from IC chip scrap generated by domestic electronic company was carried out using the mechanical beneficiation such as shredding, crushing, screening and magnetic separation. The distribution of metals in various sizes of crushed IC chip scrap was investigated and metals present in crushed products was separated with the magnetic separator. The particle size distribution of crushed IC chip scrap was 7.5% for +3mm, 17.0% for 3~1mm and 75.5% for -1mm. The weight loss of crushed IC chip scrap was 18% when roasted at $700^{\circ}C$. The content of metals was 96% for +3~1mm, 13% for 1~0.595mm, 3.7% for 0.95~0.5. Au of 99% was present in -1mm crushed IC chip scrap. Ni, Fe, Cu, Sn and Pb were separated from crushed IC chip scrap by the magnetic separator under 700 and 2, 500 Gauss.