• 제목/요약/키워드: chip control

검색결과 1,344건 처리시간 0.031초

칩마운터 구조물의 유연성을 고려한 위치와 진동 동시 제어 (Simultaneous Positioning and Vibration Control of Chip Mounter with Structural Flexibility)

  • 강민식
    • 반도체디스플레이기술학회지
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    • 제12권1호
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    • pp.53-59
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    • 2013
  • Chip mounter which is used to pick chips from the pre-specified position and place them on the target location of PCB is an essential device in semiconductor and LCD industries. Quick and high precision positioning is the key technology needed to increase productivity of chip mounters. As increasing acceleration and deceleration of placing motion, structural vibration induced from inertial reactive force and flexibility of mounter structure becomes a serious problem degrading positioning accuracy. Motivated from these, this paper proposed a new control design algorithm which combines a mounter structure acceleration feedforward compensation and an extended sliding mode control for fine positioning and suppression of structural vibration, simultaneously. The feasibility of the proposed control design was verified along with some simulation results.

Precise contact force control of a flip chip mounting head system

  • Shim, Jaehong;Cho, Youngim;Oh, Yeontaek
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2002년도 ICCAS
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    • pp.109.1-109
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    • 2002
  • This paper presents a macro/micro flip chip mounting head system for precise force control. In the proposed macro/ micro system, the macro actuator is conventional do servomotor with a ball screw mechanism and the micro actuator is a voice coil motor(VCM) that consists of four NdFeB magnets and a winded moving coil. For force control, a sensitive strain-gauge force sensor is mounted in the micro actuator. Through harmonic motion between macro and micro actuator, we would like to get precise contact force control when small sized flip chip is mounted on flexible substrate in high speed. In order to show the effectiveness of the proposed macro/micro flip chip mounting head system, we com...

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80C196MC를 이용한 유도전동기 벡터제어 (Vector Control of Induction Motors using 80C196MC)

  • 이동명;김창현;이주환;김학원;홍석종;김종철;신휘범
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 1997년도 전력전자학술대회 논문집
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    • pp.156-160
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    • 1997
  • This paper proposed the vector controller of induction motors using one chip microprocessor. For developing a small and cheep speed control system, we use the one chip microprocessor 80C196MC. By using the one chip microprocessor we can make an inexpensive and small-sized vector controller for induction motors. We apply indirect vector control method and space vector modulation method to this system. The experimental results show that the proposed inverter has high performance features.

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VHDL을 이용한 유도전동기의 속도제어 ASIC 설계 (Speed Control ASIC Design of Induction Motor)

  • 박형준;김창화;권영안
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 F
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    • pp.2758-2760
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    • 1999
  • ASIC chip design for motor control has been a subject of increasing interest since effective system-on-a-chip design methodology was developed. This paper investigates the design and implementation of ASIC chip for speed control of induction motor using VHDL which is a standarded hardware description language. The presented system is implemented using a simple electronic circuit based on FPGA.

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이단홈형 칩브레이커의 메카니즘 (Chip breaker mechanism with double step grooves)

  • 이우영;신효철
    • 대한기계학회논문집
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    • 제11권6호
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    • pp.1005-1013
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    • 1987
  • For the factory automation and unmanned machine operation, it is very important to manufacture highly reliable and efficient chip breakers for optimal chip control. In this research, using the CALMA CAD/CAM SYSTEM, the manufacturing process of 3-dimensional chip breakers is established. Using the results of the cutting test of the selected chip breakers with double-step grooves, the chip breaking mechanism is schematically analysed. An expression for the chip breaking relation is derived which considers chip material behavior following LUDWIK's stress-strain curve, chip breaking criterion and the shape of chip breakers. This contains the thickness of chip, the radius of chip curl, and the mechanical properties of chip materials. It is found that the expression agrees very closely with the experimental results.

저항소자를 이용한 휴대형 Real-time PCR 기기용 히터 제작 (Design of an Inexpensive Heater using Chip Resistors for a Portable Real-time Microchip PCR System)

  • 최형준;김정태;구치완
    • 전기전자학회논문지
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    • 제23권1호
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    • pp.295-301
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    • 2019
  • 바이오샘플의 DNA를 대량 증폭할 수 있는 휴대형 실시간 중합효소연쇄반응(Real-time PCR) 기기에서 히터는 PCR 반응 온도를 제어하기 위한 중요한 요소 중의 하나이다. 보통 빠른 히팅을 위해 소형 PCR 칩에 집적화되어 있고, 반도체 공정을 이용하여 박막형태로 제작되어 PCR 칩 제작 단가가 높은 편이다. 따라서 본 연구에서는 값싸고 온도제어를 정확히 할 수 있는 히터로 칩 저항을 사용하는 것을 제안한다. 칩 저항을 사용한 히터는 구조가 단순하고 제작이 쉽다는 장점이 있다. $2.54{\times}2.54cm^2$ 크기의 실시간 PCR 칩 위에 칩 저항을 1개 또는 2개를 사용했을 때 온도분포를 시뮬레이션 하였고, 고른 온도분포를 갖는 PCR 칩을 제작했다. 또한 효율적인 PCR 칩 냉각을 위해 소형 fan이 내장된 하우징을 설계하였고, 3D 프린터로 제작했다. 온도제어는 마이크로프로세서를 이용한 PID제어법(Proportional-Integral-Differential control)을 적용했다. 온도상승비와 하강비는 각각 $18^{\circ}C/s$, $3^{\circ}C/s$이며, 각 PCR 반응 단계의 유지 시간을 30초로 하였을 때, 한 사이클은 약 2.66분이 걸렸고, 35 사이클은 약 93 분 내로 진행할 수 있었다.

원칩 마이컴을 이용한 형광등용 역률보상기 및 전자식 안정기의 동시제어 (Simultaneous Control of Power Factor Corrector and Electronic Ballast for Fluorescent Lamp Using One Chip Micom)

  • 박효식;한우용;이공희
    • 전기학회논문지P
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    • 제53권4호
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    • pp.166-170
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    • 2004
  • In this paper, it has been proposed the simultaneous control of PFC (power factor corrector) and electronic ballast for fluorescent lamp by one chip micro-controller. Boost DC-DC converter is adopted for PFC, and half bridge inverter for electronic ballast. It controls, simultaneously and independently, the boost DC-DC converter and the half bridge inverter. As PFC and electronic ballast are controlled by one chip micro-controller, it is possible to achieve the simpler and the cheaper controller for fluorescent lamp. Experimental results have shown the feasibility of the proposed simultaneous control of PFC and electronic ballast by one chip micro-controller.

Digital Hearing Aids Specific $\mu$DSP Chip Design by Verilog HDL

  • Jarng, Soon-Suck;Chen, Lingfen;Kwon, You-Jung
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2005년도 ICCAS
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    • pp.190-195
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    • 2005
  • The hearing aid chip described in this paper is an analog & digital mixed system. The design focuses on the$\mu$DSP core. This $\mu$DSP core includes internal time delays to two inputs from front and rear microphones. The paper consists of two parts; one is the composure and signal processing algorithm of digital hearing aids and the other is Verilog HDL codes for$\mu$DSP cores. All digital modules in the design were coded and synthesized by Verilog HDL codes which were verified by Mentor Graphics and Synopsis semiconductor chip design tools.

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원칩 설계에 의한 유도전동기의 센서리스 속도제어 (Sensorless Speed Control of Induction Motor Based on System-On-A-Chip Design)

  • 이호재;김세진;이종희;권영안
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 하계학술대회 논문집 B
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    • pp.1102-1104
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    • 2000
  • Recently effective system-on-a-chip design methodology is developed, and ASIC chip design is much studied for motor control. This paper investigates the design and implementation of ASIC chip for sensorless speed control of induction motor using VHDL which is a standarded hardware description language. The sensorless control strategy is to design an adaptive state observer for flux estimation and to estimate the rotor speed from the estimated rotor flux and stator current. The presented system is implemented using a simple electronic circuit based on FPGA.

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반도체 칩 캡슐화 공정에 있어서 와이어 스윕(wire sweep) 최소화에 관한 연구 (Reduction of Wire Sweep during Chip Encapsulation by Runner Balancing and Ram Control)

  • 한세진;허용정
    • 한국정밀공학회지
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    • 제13권12호
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    • pp.13-21
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    • 1996
  • In this paper, methods to reduce wire sweep during the chip-encapsulation process have been studide. Two methods have been tried for this purpose, namely runner balancing and ram velocity control. Runner balancing has been achieved automatically by using a computer program. Ram-velocity control has been achieved using empirical rules and results from a flow simulation of the encapsulation process. A mold which has 12 cavities for chip has been used as a case study. The simulation results show that the wire sweep obtained from the optimal process condition is about 1/5 of that from initial, unoptimized condition.

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