• Title/Summary/Keyword: chip control

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Simultaneous Positioning and Vibration Control of Chip Mounter with Structural Flexibility (칩마운터 구조물의 유연성을 고려한 위치와 진동 동시 제어)

  • Kang, Min Sig
    • Journal of the Semiconductor & Display Technology
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    • v.12 no.1
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    • pp.53-59
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    • 2013
  • Chip mounter which is used to pick chips from the pre-specified position and place them on the target location of PCB is an essential device in semiconductor and LCD industries. Quick and high precision positioning is the key technology needed to increase productivity of chip mounters. As increasing acceleration and deceleration of placing motion, structural vibration induced from inertial reactive force and flexibility of mounter structure becomes a serious problem degrading positioning accuracy. Motivated from these, this paper proposed a new control design algorithm which combines a mounter structure acceleration feedforward compensation and an extended sliding mode control for fine positioning and suppression of structural vibration, simultaneously. The feasibility of the proposed control design was verified along with some simulation results.

Precise contact force control of a flip chip mounting head system

  • Shim, Jaehong;Cho, Youngim;Oh, Yeontaek
    • 제어로봇시스템학회:학술대회논문집
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    • 2002.10a
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    • pp.109.1-109
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    • 2002
  • This paper presents a macro/micro flip chip mounting head system for precise force control. In the proposed macro/ micro system, the macro actuator is conventional do servomotor with a ball screw mechanism and the micro actuator is a voice coil motor(VCM) that consists of four NdFeB magnets and a winded moving coil. For force control, a sensitive strain-gauge force sensor is mounted in the micro actuator. Through harmonic motion between macro and micro actuator, we would like to get precise contact force control when small sized flip chip is mounted on flexible substrate in high speed. In order to show the effectiveness of the proposed macro/micro flip chip mounting head system, we com...

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Vector Control of Induction Motors using 80C196MC (80C196MC를 이용한 유도전동기 벡터제어)

  • 이동명;김창현;이주환;김학원;홍석종;김종철;신휘범
    • Proceedings of the KIPE Conference
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    • 1997.07a
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    • pp.156-160
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    • 1997
  • This paper proposed the vector controller of induction motors using one chip microprocessor. For developing a small and cheep speed control system, we use the one chip microprocessor 80C196MC. By using the one chip microprocessor we can make an inexpensive and small-sized vector controller for induction motors. We apply indirect vector control method and space vector modulation method to this system. The experimental results show that the proposed inverter has high performance features.

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Speed Control ASIC Design of Induction Motor (VHDL을 이용한 유도전동기의 속도제어 ASIC 설계)

  • Park, H.J.;Kim, C.H.;Kwon, Y.A.
    • Proceedings of the KIEE Conference
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    • 1999.07f
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    • pp.2758-2760
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    • 1999
  • ASIC chip design for motor control has been a subject of increasing interest since effective system-on-a-chip design methodology was developed. This paper investigates the design and implementation of ASIC chip for speed control of induction motor using VHDL which is a standarded hardware description language. The presented system is implemented using a simple electronic circuit based on FPGA.

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Chip breaker mechanism with double step grooves (이단홈형 칩브레이커의 메카니즘)

  • 이우영;신효철
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.11 no.6
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    • pp.1005-1013
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    • 1987
  • For the factory automation and unmanned machine operation, it is very important to manufacture highly reliable and efficient chip breakers for optimal chip control. In this research, using the CALMA CAD/CAM SYSTEM, the manufacturing process of 3-dimensional chip breakers is established. Using the results of the cutting test of the selected chip breakers with double-step grooves, the chip breaking mechanism is schematically analysed. An expression for the chip breaking relation is derived which considers chip material behavior following LUDWIK's stress-strain curve, chip breaking criterion and the shape of chip breakers. This contains the thickness of chip, the radius of chip curl, and the mechanical properties of chip materials. It is found that the expression agrees very closely with the experimental results.

Design of an Inexpensive Heater using Chip Resistors for a Portable Real-time Microchip PCR System (저항소자를 이용한 휴대형 Real-time PCR 기기용 히터 제작)

  • Choi, Hyoung-jun;Kim, Jeong-tae;Koo, Chi-wan
    • Journal of IKEEE
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    • v.23 no.1
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    • pp.295-301
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    • 2019
  • A heater in a portable real-time polymerase chain reaction(PCR) system is one of the important factors for controlling the PCR thermocycle precisely. Since heaters are integrated on a small-sized PCR chip for rapid heating and fabricated by semiconductor processes, the cost of producing PCR chips is high. Here, we propose to use chip resistors as an inexpensive and accurate temperature control method. The temperature distribution was simulated using one or two chip resistors on a real-time PCR chip and the PCR chip with uniform temperature distribution was fabricated. The temperature rise and fall rates were $18^{\circ}C/s$ and $3^{\circ}C/s$, respectively.

Simultaneous Control of Power Factor Corrector and Electronic Ballast for Fluorescent Lamp Using One Chip Micom (원칩 마이컴을 이용한 형광등용 역률보상기 및 전자식 안정기의 동시제어)

  • Park, Hyo-Sik;Han, Woo-Yong;Lee, Gong-Hee
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.53 no.4
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    • pp.166-170
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    • 2004
  • In this paper, it has been proposed the simultaneous control of PFC (power factor corrector) and electronic ballast for fluorescent lamp by one chip micro-controller. Boost DC-DC converter is adopted for PFC, and half bridge inverter for electronic ballast. It controls, simultaneously and independently, the boost DC-DC converter and the half bridge inverter. As PFC and electronic ballast are controlled by one chip micro-controller, it is possible to achieve the simpler and the cheaper controller for fluorescent lamp. Experimental results have shown the feasibility of the proposed simultaneous control of PFC and electronic ballast by one chip micro-controller.

Digital Hearing Aids Specific $\mu$DSP Chip Design by Verilog HDL

  • Jarng, Soon-Suck;Chen, Lingfen;Kwon, You-Jung
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.190-195
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    • 2005
  • The hearing aid chip described in this paper is an analog & digital mixed system. The design focuses on the$\mu$DSP core. This $\mu$DSP core includes internal time delays to two inputs from front and rear microphones. The paper consists of two parts; one is the composure and signal processing algorithm of digital hearing aids and the other is Verilog HDL codes for$\mu$DSP cores. All digital modules in the design were coded and synthesized by Verilog HDL codes which were verified by Mentor Graphics and Synopsis semiconductor chip design tools.

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Sensorless Speed Control of Induction Motor Based on System-On-A-Chip Design (원칩 설계에 의한 유도전동기의 센서리스 속도제어)

  • Lee, H.J.;Kim, S.J.;Lee, J.H.;Kwon, Y.A.
    • Proceedings of the KIEE Conference
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    • 2000.07b
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    • pp.1102-1104
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    • 2000
  • Recently effective system-on-a-chip design methodology is developed, and ASIC chip design is much studied for motor control. This paper investigates the design and implementation of ASIC chip for sensorless speed control of induction motor using VHDL which is a standarded hardware description language. The sensorless control strategy is to design an adaptive state observer for flux estimation and to estimate the rotor speed from the estimated rotor flux and stator current. The presented system is implemented using a simple electronic circuit based on FPGA.

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Reduction of Wire Sweep during Chip Encapsulation by Runner Balancing and Ram Control (반도체 칩 캡슐화 공정에 있어서 와이어 스윕(wire sweep) 최소화에 관한 연구)

  • Han, S.;Huh, Y.J.
    • Journal of the Korean Society for Precision Engineering
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    • v.13 no.12
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    • pp.13-21
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    • 1996
  • In this paper, methods to reduce wire sweep during the chip-encapsulation process have been studide. Two methods have been tried for this purpose, namely runner balancing and ram velocity control. Runner balancing has been achieved automatically by using a computer program. Ram-velocity control has been achieved using empirical rules and results from a flow simulation of the encapsulation process. A mold which has 12 cavities for chip has been used as a case study. The simulation results show that the wire sweep obtained from the optimal process condition is about 1/5 of that from initial, unoptimized condition.

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