• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.2
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• pp.3-9
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• 2005

In this study, the chip breaking characteristics of S, PbS and BiS free machining steels have been assessed. PbS free machining steel shows the lowest value of chip thickness ($t_c$) under the same cutting conditions. SM10C steel has the largest value of the chip cross-section area ratio ($R_{CA}$). As the feed rate becomes larger the chip breaking cycle time ($T_B$) decreases and the chip breaking index ($C_B$) increases. The properly controlled-C type chip has been obtained with the value of $C_B$ between 0.05 and 0.2. Free machining steel, PbS produces the properly controlled-C type chip in a wider feed rate range than other steels.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.11
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• pp.101-106
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• 2001

In this work, an effort is made to investigate the behavior of a chip, from its initial flow to its final breaking stage. The expression for chip flow in grooved tools is verified analytically using FEM. Cutting parameters like velocity and depth of cut have a profound influence on chip flow behavior. Chip curling increases and, for a given tool geometry, effectiveness of the groove increases with increasing depth of cut. The feasibility of tool design using FEM simulations is also demonstrated. Optimization of tool geometry results in better chip control.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.61-71
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• 1999

The recent trend toward higher frequencies, miniaturization and lower-cost in wireless communication equipment is demanding high density packaging technologies such flip chip interconnection and multichip module(MCM) as a substitute of conventional plastic package. With analyzing the recently reported research results of the RF flip chip, this paper presents the technical issues and advantages of RF flip chip and suggest the flip chip technologies suitable for the development stage. At first, most of RF flip chips are designed in a coplanar waveguide line instead of microstrip in order to achieve better electrical performance and to avoid the interaction with a substrate. Secondly, eliminating wafer back-side grinding, via formation, and back-side metallization enables the manufacturing cost to be reduced. Finally, the electrical performance of flip chip bonding is much better than that of plastic package and the flip chip interconnection is more suitable for Transmit/Receiver modules at higher frequency. However, the characterization of CPW designed RF flip chip must be thoroughly studied and the Au stud bump bonding shall be suggested at the earlier stage of RF flip chip development.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.4
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• pp.61-67
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• 1999

In turning the chip may be produced in the form of continuous chip or discontinuous one. Continuous chips produced at high speed machining may hit the newly cut workpiece surface and adversely affect the appearance of the surface finish and may interfere with tool and sometimes induce tool fracture. In this study relationship between AE signal and chip form was experimentally investigated, The experimental results show that types of chip form are possible to be classified from the AE signal using fuzzy logic.

• Journal of Mechanical Science and Technology
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• v.14 no.9
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• pp.997-1004
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• 2000

The experiments were conducted by using water and paraffin slurry to investigate the effect of a chip spacing in the multichip module on the cooling characteristics from an in-line $4{\times}3$ array of discrete heat sources which were flush mounted on the top wall of a channel. The experimental parameters were chip spacing in a multichip module, heat flux of simulated VLSI chip, mass fraction of paraffin slurry, and channel Reynolds number. The removable heat flux at the same chip surface temperature decreased as the chip spacing decreased at the first and fourth rows. The local heat transfer coefficients for the paraffin slurry were larger than those for water, and the chip spacing on the local heat transfer coefficients for paraffin slurry influenced less than that for water. The enhancement factor for paraffin slurry showed the largest value at a mass fraction of 5% regardless of the chip spacing, and the enhancement factors increased as the chip spacing decreased. This means that the paraffin slurry is more effective than water for cooling of the highly integrated multichip module.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.2
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• pp.96-101
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• 2000

In machining with cutting tool inserts having complex chip groove shape the flow curl and breaking pattern of the chip are different than in flat-face inserts. In the present work an effort is made to understand the three basic phe-nomena occurring in a chip since its formation in machining with groove type and pattern type inserts. These are the ini-tial chip flow the subsequent development of up and side curl and the final chip breaking due to the development of tor-sional and bending stresses. in this paper chip flow angle in a groove type and pattern type inserts. The expres-sion for chip flow angle in groove type and pattern type inserts is also verified experimentally using high speed filming techniques.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.12
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• pp.2926-2935
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• 1993

Chip breaker selection analysis, only being possible through experimental process, was obtained by a applied equation which used an orthogonal cutting model and a basic chip deformation. This equation could present an analysis of the chip breaking phenomena without the use of an actual experimetal method, and it was applied to computer simulation and proved the validity of theory through actual experiments. From these results, an efficient method for finding the optimum conditions of chip breaking was found through an optimized theory being applied to basic program. A finite element model for simulating chip breaking in orthogonal cutting was developed and discussed. By simulation the animation of chip breaking is observed in process on the computer screen.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.17-21
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• 1992

최근 들어 공작기계 자동화의 보편화로 절삭가공작업은 고속화, 정밀화되고 있어 생산성을 높이고 있다. 하지만 이러한 생산성의 증가는 단위시간당 chip생산량을 증가시켰으며, 이에 따라 효율적이면서 바람직한 chip처리가 생산성 향상과 연관되어 매우 중요한 문제로 대두되었다. 본 연구에서는 부착장애형 chip breaker를 설치한 insert 공구를 이용, 피삭재로서 내식성, 내마모성을 기계적 성질이 우수하여 근래 산업의 여러 분야에서 각광받고 있는 난삭재 STS304를 절삭하였다. 난삭재 STS304연질금속으로서, 자유표면이 다소 매끄러운 일반재료와 달리 chip의 단면이 어느 정도 규칙적인 톱니형 chip을 발생한다. 그러므로 부착장애형 chip breaker의 각 및 거리, 기타 각 조건을 이용하여 STS304를 절삭특성 및 chip 조절상태를 관찰하고, 기존의 실험에서 자주 이용되었던 연강과 STS304의 비교절삭을 행하여 chip형태등을 비교하여 보는 것도 난삭재의 절삭가공기술 진전에 일조하리라 생각한다.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.381-386
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• 1999

In machining with cutting tool inserts having complex chip groove shape, the flow, curl and breaking patterns of the chip are different than in flat-face type inserts. In the present work, an effort is made to understand the three basic phenomena occurring in a chip since its formation in machining with groove type and pattern type inserts. These are the initial chip flow, the subsequent development of up and side curl and the final chip breaking due to the development of torsional and banding stresses. In this paper, chip flow angle in a groove type and pattern type inserts. The expression for chip flow angle in groove type and pattern type insets is also verified experimentally using high speed filming techniques.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.2
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• pp.40-46
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• 1998

In order to achieve high flexibility in manufacture, chip control is one of the most serious problems at present. The continuous type chip (uncontrolled chip), which interrupts the normal cutting process and damages the operator, tool and workpiece have a higher force ratio. while the controlled chip which is 6 or 9 type and C type, has the values of the force ratio below 0.6 The chips were classified by 4 types. in chip formation and by described chip history during the cutting process. Finally, the feasibility of utilizing force ratios in chip control will be pointed out while comparing generated force signals during the cutting process.