• Journal of Radiation Protection and Research
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• v.35 no.2
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• pp.81-84
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• 2010

A CSA(Charge Sensitive Amplifier) was designed and fabricated for application in a radiation detection system based on a semiconductor detector such as Si, SiC, CdZnTe and etc.. A fabricated hybrid.type CSA was evaluated by comparison with a commercially available CSA. A comparison was performed by using calculation of ENC (Equivalent Noise Charge) and by using energy resolutions of fabricated radiation detectors based on Si. In energy resolution comparison, a fabricated CSA showed almost the same performance compared with a commercial one. In this study, feasibility of a fabricated CSA was discussed.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.05a
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• pp.678-681
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• 2009

A single-pixel photon counter is designed using a folded cascode CMOS operational amplifier which is self-biased. Since there is no need for a voltage bias circuit, the layout area and power consumption of the designed counter are reduced. The signal voltage of the designed charge sensitive amplifier (CSA) with the MagnaChip $0.18{\mu}m$ CMOS process is simulated to be 138mv, near the theoretical voltage of 151mV. And the layout area of the designed counter is $100{\mu}m{\times}100{\mu}m$.

• Nuclear Engineering and Technology
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• v.56 no.1
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• pp.189-194
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• 2024

This paper presents a radiation-hardened-by-design preamplifier that utilizes a self-compensation technique with a charge-sensitive amplifier (CSA) and replica for total ionizing dose (TID) effects. The CSA consists of an operational amplifier (OPAMP) with a 6-bit binary weighted current source (BWCS) and feedback network. The replica circuit is utilized to compensate for the TID effects of the CSA. Two comparators can detect the operating point of the replica OPAMP and generate appropriate signals to control the switches of the BWCS. The proposed preamplifier was fabricated using a general-purpose complementary metal-oxide-silicon field effect transistor 0.18 ㎛ process and verified through a test up to 230 kGy (SiO₂) at a rate of 10.46 kGy (SiO₂)/h. The code of the BWCS control circuit varied with the total radiation dose. During the verification test, the initial value of the digital code was 39, and a final value of 30 was observed. Furthermore, the preamplifier output exhibited a maximum variation error of 2.39%, while the maximum rise-time error was 1.96%. A minimum signal-to-noise ratio of 49.64 dB was measured.

• 대한방사선방어학회:학술대회논문집
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• 2010.04a
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• pp.172-173
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• 2010

• Nuclear Engineering and Technology
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• v.52 no.7
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• pp.1503-1510
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• 2020

Ultra-low noise charge sensitive amplifiers (CSAs) based on various types of circuit board substrates, such as FR4, Teflon, and ceramics (Al₂O₃) with two different designs, PA1 and PA2, have been developed. They were tested to see the noise effect from the dielectric loss of the substrate capacitance before and after irradiation. If the electronic noise from the CSAs is to be minimized and the energy resolution enhanced, the shaping time has to be optimized for the detector, and a small feedback capacitance of the CSA is favorable for a better SNR. Teflon- and ceramic-based PA1 design CSAs showed better noise performance than the FR4-based one, but the Teflon-based PA1 design showed better sensitivity than ceramic based one at a low detector capacitance (<10 pF). In the PA2 design, the equivalent noise and the sensitivity were 0.52 keV FWHM for a silicon detector and 7.2 mV/fC, respectively, with 2 ㎲ peaking time and 0.1 pF detector capacitance. After 10, 100, 10³, 10⁴, and 10⁵ Gy irradiation the ENC and sensitivity characteristics of the developed CSAs based on three different substrate materials are also discussed.

• 전기의세계
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• v.11
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• pp.8-13
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• 1963

Solid state nuclear radiation detector에 사용되는 transistor에 의한 저잡음 charge sensitive preamplifier의 설계방식과 이에 대한 실측결과에 관하여 기술하였다. 먼저 transistor noise의 제원인을 분석하고 이 잡음들을 최소로 하기 위하여 이에 관련된 각 parameter에 대하여 이론 및 실험적으로 고찰하였다. 지금까지 알려진 진공관식 증폭기의 최소잡음은 등가전자수로 표시하면 약 250전자 정도이고 그 transistor증폭기에 있어서는 약 1,000전자 정도이었으나 본 설계방식에 의하여 제작된 transistor증폭기에서는 detector를 포함한 전 input capacitance가 약 100PF일때 약 400전자의 양호한 저잡음특성을 보이고 있으며 linearity 및 stability도 매우 좋은 결과를 보이고 있다. 여기에 사용된 cascode회로 자체는 이미 오래 전부터 알려져 있었지만 잡음을 최소로 하기 위한 설계방법은 지금껏 알려지지 않고 있으므로 본 논문에서는 전치증복기의 소요이득에서 잡음을 최소로 할 수 있는 설계방식을 확립하여 이 방식에 의한 실측결과는 종래의 transistor를 사용한 것보다 가장 좋았다.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.13 no.5
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• pp.403-411
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• 2020

Since the analog circuit of the beta ray sensor circuit for the true random number generator and the power and ground line used in the comparator circuit are shared with each other, the power generated by the digital switching of the comparator circuit and the voltage drop at the ground line was the cause of the decreasein the output signal voltage drop at the analog circuit including CSA (Charge Sensitive Amplifier). Therefore, in this paper, the output signal voltage of the analog circuit including the CSAcircuit is reduced by separating the power and ground line used in the comparator circuit, which is the source of digital switching noise, from the power and ground line of the analog circuit. In addition, in the voltage-to-voltage converter circuit that converts VREF (=1.195V) voltage to VREF_VCOM and VREF_VTHR voltage, there was a problem that the VREF_VCOM and VREF_VTHR voltages decrease because the driving current flowing through each current mirror varies due to channel length modulation effect at a high voltage VDD of 5.5V when the drain voltage of the PMOS current mirror is different when driving the IREF through the PMOS current mirror. Therefore, in this paper, since the PMOS diode is added to the PMOS current mirror of the voltage-to-voltage converter circuit, the voltages of VREF_VCOM and VREF_VTHR do not go down at a high voltage of 5.5V.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.7
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• pp.1235-1242
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• 2008

In this paper, x-ray image sensor of photon counting type having a $32{\times}32$ pixel array is designed with $0.18{\mu}m$ triple-well CMOS process. Each pixel of the designed image sensor has an area of loot $100{\times}100\;{\mu}m2$ and is composed of about 400 transistors. It has an open pad of an area of $50{\times}50{\mu}m2$ of CSA(charge Sensitive Amplifier) with x-ray detector through a bump bonding. To reduce layout size, self-biased folded cascode CMOS OP amp is used instead of folded cascode OP amp with voltage bias circuit at each single-pixel CSA, and 15-bit LFSR(Linear Feedback Shift Register) counter clock generator is proposed to remove short pulse which occurs from the clock before and after it enters the counting mode. And it is designed that sensor data can be read out of the sensor column by column using a column address decoder to reduce the maximum current of the CMOS x-ray image sensor in the readout mode.

• Journal of IKEEE
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• v.13 no.4
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• pp.63-68
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• 2009

The power management integrated circuit(PMIC) for CCD image sensor is presented in this study. A CCD image sensor is very sensitive against temperature. The temperature, that is heat, is generally generated by the PMIC with low efficiency. Since the generated heat influences performance of CCD image sensor, it should be minimized by using a PMIC which has a high efficiency. In order to develop the PMIC with high efficiency, the input stage is designed with synchronous type step down DC-DC converter. The operating range of the converter is from 5V to 15V and the converter is controlled using PWM method. The PWM control circuit consists of a saw-tooth generator, a band-gap reference circuit, an error amplifier and a comparator circuit. The saw-tooth generator is designed with 1.2MHz oscillation frequency. The comparator is designed with the two stages OP Amp. And the error amplifier has 40dB DC gain and $77^{\circ}$ phase margin. The output of the step down converter is connected to input stage of the charge pump. The output of the charge pump is connected to input of the LDO which is the output stage of the PMIC. Finally, the PMIC, based on the PWM control circuit and the charge pump and the LDO, has output voltage of 15V, -7.5V, 3.3V and 5V. The PMIC is designed with a 0.35um process.

• Journal of IKEEE
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• v.23 no.3
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• pp.947-953
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• 2019

The purpose of this paper is to explore an ASIC design for estimating sizes and concentrations of airborne micro-particles by the means of integrating, amplifying and digitizing electric charge signals generated by photo-sensors as it receives scattered photons by the presence of micro-particles, consisting of a pre-amplifier that detects and amplifies voltage or current signal from photo-sensor that generates charges (hole-electron pairs) when exposed to visible rays, infrared rays, ultraviolet rays, etc. according to the intensity of rays; a shaper for shaping the amplified signal to a semi-gaussian waveform; two discriminators and binary counters for outputting digital signals by comparing the magnitude of the shaped signal with an arbitrary reference voltages. The ASIC with the proposed architecture and functional blocks in this study was designed with a 0.18um standard CMOS technology from Global Foundries and the operation and performances of the ASIC has been verified by the silicons fabricated by using the process.