• Title/Summary/Keyword: channeling

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A Study on Ultra-Shallow Junction Formation using Upgraded MDRANGE (향상된 MDRANGE을 사용한 초미세 접합 형성에 관한 연구)

  • 강정원;강유석
    • Proceedings of the IEEK Conference
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    • 1998.10a
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    • pp.585-588
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    • 1998
  • We investigated the ultra-low energy B, P, and As ion implantation using ungraded MDRANGE code to form nanometer junction depths. Even at the ultra-low energies that were simulated in paper, it was found that channeling cases must be carefully considered. In the cases of B, channeling occurred above 500 eV, in the cases of P, channeling occurred above 1 keV, and in the cases of As, channeling occurred above 2 keV. Comparing 2D dopant profiles of 1 keV B, 2 keV P, and 5 keV As with tilts, we demonstrated that most channeling cases occurred not lateral directions but depth directions. Through thus results, even below 5 keV energy ion implant considered here, it is estimated that channeling effects are important in the formation of nanometer junction depths.

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BS/channeling studies on the epitaxially grown Pt(111) films on $Al_2O_3$(0001) (BS/Channeling을 이용한 Pt(111)/$Al_2O_3$(0001) 적층 생장 연구)

  • 이종철;김신철;김효배;정광호;김긍호;최원국;송종환
    • Journal of the Korean Vacuum Society
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    • v.7 no.4
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    • pp.300-305
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    • 1998
  • Crystallinity and structual properties of the epitaxially grown Pt films on $Al_2O_3$(0001) substrate by rf magnetron sputtering at a substrate temperature of $600^{\circ}C$ were studied by using backscattering spectrometry (BS)/channeling and transmission electron microscopy (TEM) measurements. $MeV^4$He ion BS/channeling results showed that the channeling minimum yield of Pt film with a thickness of 3500$\AA$ was 4%. This indicates an excellent crystallinity of Pt film. When the thickness of Pt film was less than 200 $\AA$, the channeling minimum yield of Pt film increased sharply with the decrease in film thickness. The Pt layer on $Al_2O_3$(0001) substrate grew epitaxially to the direction of (111) with six-fold symmetry. Cross-sectional TEM images also showed that Pt film on $Al_2O_3$(0001) substrate consist of twinned domains to release the strain induced by the lattice mismatch and the surface roughness of the film increased at the twin boundaries where the strain was contcentrated.

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BS/channeling studies on the heteroepitaxially grown $Y_2O_3$ films on Si substrates by UHV-ICB deposition (실리콘 기판 위에 UHV-ICB 증착법으로 적층 성장된 $Y_2O_3$박막의 BS/channeling 연구)

  • 김효배;조만호;황보상우;최성창;최원국;오정아;송종한;황정남
    • Journal of the Korean Vacuum Society
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    • v.6 no.3
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    • pp.235-241
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    • 1997
  • The crystallinity and the structure of heteroepitaxially grown $Y_2O_3$ films on the silicon substrates deposited by Ultra High Vacuum Ionized Cluster Beam(UHV-ICB) were investigated by Back-scattering Spectroscopy(BS)/channeling. The channeling minimum values, $X_{min}$, of the $Y_2O_3$ films deposited by other methods were 0.8~0.95 up to the present, which indicates amorphous or highly polycrystalline nature of the $Y_2O_3$ films. On the contrary, the channeling minimum value of heteroepitaxially grown $Y_2O_3$ films on Si(100) and Si(111) deposited by UHV-ICB are 0.28 and 0.25 respectively. These results point out fairly good crystalline quality. It is also observed that the top region of $Y_2O_3$ films have less crystalline defects than the bottom region regardless of the crystal direction of the Si substrates. The axis of $Y_2O_3$<111> epitaxially grown on Si(111) is tilt by $0.1^{\circ}$ with respect to Si<111>. That of $Y_2O_3$<110> on Si(100) is parallel to the Si<001>. The $Y_2O_3$ film on Si(100) grew with single domain structure and that on Si(111) grew with double domain structure. From the result of oxygen resonance BS/channeling, the oxygen atoms in heteroepitaxially grown $Y_2O_3$ film on Si(111) substrate have the crystallinity, but that on Si(100) shows almost channeling amorphous state.

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A Study on the Tribolayer using Focused Ion Beam (FIB) (FIB를 이용한 트라이보층에 대한 연구)

  • Kim, Hong-Jin
    • Tribology and Lubricants
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    • v.26 no.2
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    • pp.122-128
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    • 2010
  • Focused Ion Beam (FIB) has been used for site-specific TEM sample preparation and small scale fabrication. Moreover, analysis on the surface microstructure and phase distribution is possible by ion channeling contrast of FIB with high resolution. This paper describes FIB applications and deformed surface structure induced by sliding. The effect of FIB process on the surface damage was explored as well. The sliding experiments were conducted using high purity aluminum and OFHC(Oxygen-Free High Conductivity) copper. The counterpart material was steel. Pin-on-disk, Rotational Barrel Gas Gun and Explosively Driven Friction Tester were used for the sliding experiments in order to investigate the velocity effect on the microstructural change. From the FIB analysis, it is revealed that ion channeling contrast of FIB has better resolution than SEM and the tribolayer is composed of nanocrystalline structures. And the thickness of tribolayer was constant regardless of sliding velocities.

Optimal Conditions for Defect Analysis Using Electron Channeling Contrast Imaging

  • Oh, Jin-Su;Yang, Cheol-Woong
    • Applied Microscopy
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    • v.46 no.3
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    • pp.164-166
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    • 2016
  • Electron channeling contrast imaging (ECCI) is a powerful analyzing tool for identifying lattice defects like dislocations and twin boundaries. By using diffraction-based scanning electron microscopy technique, it enables microstructure analysis, which is comparable to that obtained by transmission electron microscopy that is mostly used in defect analysis. In this report, the optimal conditions for investigating crystal defects are suggested. We could obtain the best ECCI images when both acceleration voltage and probe current are high (30 kV and 20 nA). Also, shortening the working distance (6 mm) enhances the quality of defect imaging.

Microstructural Evolution and Recrystallization Behavior Traced by Electron Channeling Contrast Imaging

  • Oh, Jin-Su;Yang, Cheol-Woong
    • Applied Microscopy
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    • v.48 no.4
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    • pp.130-131
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    • 2018
  • Electron channeling contrast imaging (ECCI) is one of the imaging techniques in scanning electron microscopy based on a variation in electron backscattering yield depending on the direction of the primary electron beam with respect to the crystal lattice. The ECCI provides not only observation of the distribution of individual grains and grain boundaries but also identification of the defects such as dislocations, twins, and stacking faults. The ECCI at the interface between recrystallized and deformed region of shot peening treated nickel clearly demonstrates the microstructural evolution during the recrystallization including original grain boundaries, and thus can provide better insight into the recrystallization behavior.

Assessment of Subsurface Damage in Ultraprecision Machined Semiconductors

  • Lucca, D.A.;Maggiore, C.J.;Rhorer, R.L.;Wang, Y.M.;Seo, Y.W.
    • Tribology and Lubricants
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    • v.11 no.5
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    • pp.156-161
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    • 1995
  • The subsurface damaged layer in ultraprecisison machined single crystal Ge was examined by ion channeling. Single crystal Ge surfaces were prepared by chemo-mechanical polishing, mechanical polishing with 1/4 gm diamond abrasive, single point diamond turning and ultraprecision orthogonal flycutting. The extent of subsurface lattice disorder was compared to the crystal's orginal surface quality. Ion channeling is seen to be useful for quantitative measure of lattice disorder in finely finished surfaces.

Thermal Cycle Reliabilties and Cracking Characteristics of Electroplated Cr/Ni-P Coatings (전해 Cr/Ni-P 도금막의 열 사이클 신뢰성 및 균열거동 분석)

  • Lee, Jina;Son, Kirak;Lee, Kyu Hwan;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.133-140
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    • 2019
  • The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.