• Title/Summary/Keyword: channel bonding

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Fabrication of Thick Periodically-poled Lithium Niobate Crystals by Standard Electric Field Poling and Direct Bonding

  • Kim, Byoung-Joo;Kim, Chung-Sik;Kim, Dong-Jin;Lim, Hwan-Hong;Park, Sung-Kyun;Cha, Myoung-Sik;Kim, Kyung-Jo
    • Journal of the Optical Society of Korea
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    • v.14 no.4
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    • pp.420-423
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    • 2010
  • We fabricated 1 mm-thick periodically-poled lithium niobate (PPLN) crystals by using a high-voltage amplifier for standard electric field poling combined with a voltage multiplier. Furthermore, two 1 mm-thick PPLNs were directly bonded to make a 2 mm-thick PPLN. The large aperture allowed broad angular tuning, and a broad spectral range of quasi-phase matched second-harmonic generation can be achieved in a single channel. High-power applications are also expected.

Operation of PCR chip by micropump (마이크로펌프를 이용한 PCR Chip의 구동)

  • 최종필;반준호;장인배;김헌영;김병희
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2004.10a
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    • pp.463-467
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    • 2004
  • This paper presents the fabrication possibility of the micro actuator which uses a micro-thermal bubble, generated b micro-heater under pulse heating. The valve-less micropump using the diffuser/nozzle is consists of the lower plate, he middle plate, the upper plate. The lower plate includes the channel and chamber are fabricated on high processability silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The middle plate includes the chamber and diaphragm d the upper plate is the micro-heater. The Micropump is fabricated by bonding process of the three layer. This paper resented the possibility of the PCR chip operation by the fabricated micropump.

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Heat Transfer Analysis of a Pulse Magnetron Sputtering Cathode (펄스 마그네트론 스퍼터링 음극의 열전달 해석)

  • Joo, Jung-Hoon
    • Journal of the Korean institute of surface engineering
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    • v.41 no.6
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    • pp.274-278
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    • 2008
  • 3-dimensional numerical analysis for a rectangular magnetron cathode model is done to predict cooling characteristics of high power sputtering system for ZnO deposition. It includes cooling channel design, heat transfer analysis of a target, bonding layer and backing plate. In order to model erosion profiles of a target, ion current density distribution from 3D Monte Carlo simulation is used to distribute total sputtering power to 5 discrete regions. At 3 kW of sputtering power and cooling water flow of 1 liter/min at $10^{\circ}C$, the maximum surface temperature was $45.8^{\circ}C$ for a flat new target and $156^{\circ}C$ for a target eroded by 1/3 of its thickness, respectively.

Data Distribution Algorithm in Multiple NIC (다중 NIC를 위한 효율적인 데이터 분배 알고리즘)

  • 차윤준;김양섭;이진영;김영찬
    • Proceedings of the Korean Information Science Society Conference
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    • 2000.10c
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    • pp.82-84
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    • 2000
  • 하드웨어 기술의 발전으로 서버 시스템의 연산능력은 발전을 거듭하고 있다. 또한 인터넷 사용의 광범위한 발전으로 인한 웹에 대한 폭발적인 사용 증가는 네트워크 서버의 연산 능력에 대한 요구와 더불어 향상된 네트워크 대역폭을 요구하게 되었다. 네트워크 장비의 발전도 진일보하고 있지만, 10Mbps, 100Mbps, 기가비트 이더넷등을 거치는 표준의 변화와 함께 기존의 장비에 대한 전면적인 교체 등으로 성능향상을 위해 많은 비용의 소요를 감수할 수밖에 없는 상황에 처해 있다. 클러스터의 한 예인 Beowulf 프로젝트와 같은 경우에, 기존의 네트워크 인터페이스를 병렬적으로 사용함으로써 큰비용 없이 더 큰 네트워크 대역폭을 얻기 위한 목적으로 이더채널(Channel-bonding)과 같은 기술이 개발되어 사용되기도 하였으나, 어디까지나 클러스터링을 위한 부수적인 기술로써 다소의 성능 향상에 만족하였고 심도있는 연구와 개발은 이루어지지 못하였다. 본 논문에서는 강력한 컴퓨팅 파워를 요구하는 특별한 서버 시스템이 아닌, 일반적으로 큰 네트워크 대역폭만을 요구하는 네트워크 서버에서 기존의 네트워크 인터페이스를 병렬적으로 이용하고, 채널-본딩에 비해 개선된 data distribution algorithm을 제안함으로써 성능의 향상을 꾀하고, 더불어 이러한 기술을 IEEE에서 제정중에 있는 802.3ad Link Aggregation 표준에 적용시키기 위한 기초를 마련하고자 한다.

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MEMS for Heterogeneous Integration of Devices and Functionality

  • Fujita, Hiroyuki
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.7 no.3
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    • pp.133-139
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    • 2007
  • Future MEMS systems will be composed of larger varieties of devices with very different functionality such as electronics, mechanics, optics and bio-chemistry. Integration technology of heterogeneous devices must be developed. This article first deals with the current development trend of new fabrication technologies; those include self-assembling of parts over a large area, wafer-scale encapsulation by wafer-bonding, nano imprinting, and roll-to-roll printing. In the latter half of the article, the concept towards the heterogeneous integration of devices and functionality into micro/nano systems is described. The key idea is to combine the conventional top-down technologies and the novel bottom-up technologies for building nano systems. A simple example is the carbon nano tube interconnection that is grown in the via-hole of a VLSI chip. In the laboratory level, the position-specific self-assembly of nano parts on a DNA template was demonstrated through hybridization of probe DNA segments attached to the parts. Also, bio molecular motors were incorporated in a micro fluidic system and utilized as a nano actuator for transporting objects in the channel.

Design, Fabrication of Electromagnetic Microvalve for Drug Delivery Systems (약물 전달용 전자력 마이크로 밸브의 설계 및 제작)

  • Lim, In-Ho;Lee, Ki-Jung;Yoon, Hyeun-Joong;Sim, Woo-Young;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.1526-1527
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    • 2007
  • This paper presents the design, fabrication and experimental results of an electromagnetic microvalve for drug delivery systems. The microvalve consists of two silicon substrates with a silicone rubber diaphragm and a flow channel, a PDMS layer, and an electromagnetic actuator. Each substrate is fabricated by using the silicon wet etch, SU-8 mold process and $O_2$ plasma bonding.

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A Channel Bonding based Vi-GM Communication Module Development for Myrinet Bandwidth Enhancement (Myrinet 대역폭 향상을 위한 채널 본딩 기반 VI-GM 통신 모듈 개발)

  • Jang, Gi-Sung;Kim, Sang-Hyong;Choi, Hyun-Ho;Yoo, Weon-Kyung;Yoo, Kwan-Jong
    • Proceedings of the Korea Information Processing Society Conference
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    • 2007.05a
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    • pp.1338-1341
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    • 2007
  • 클러스터 파일 시스템의 성능은 노드 내부 연산의 성능 뿐만 아니라 노드간의 통신 성능이 전체 시스템의 성능에 큰 영향을 미친다. 최근의 클러스터 파일 시스템에는 Myrinet, ServerNet, QNet, SCI(Scalable Coherent Interface) 등의 고속 인터페이스를 통해 연결하는 것이 일반화되어 있다 본 논문에서는 노드간의 통신 성능을 높이기 위해서 Myrinet 환경에서 제공해 주는 사용자 수준의 통신 프로토콜인 VI-GM(Virtual Interface Architecture over GM)을 사용하여 2개 이상의 네트워크 장치를 하나처럼 보이게 해서 Redundancy와 대역폭을 증가시키는 채널 본딩 기법을 기반으로 통신 모듈을 개발하였다. 그리고 성능 실험을 통해 제안된 모듈의 우수함을 보였다.

Imaging of self-assembled monolayers by surface plasmon microscope (표면 플라즈몬 현미경을 이용한 자기조립 단분자막의 이미징)

  • 표현봉;신용범;윤현철;양해식;김윤태
    • Korean Journal of Optics and Photonics
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    • v.14 no.1
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    • pp.97-102
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    • 2003
  • Multi-channel images of 11-MUA(11-Mercaptoundecanoic acid) and 11-MUOH(11-Mercaptoundecanol) self-assembled monolayers were obtained by using two-dimensional surface plasmon resonance (SPR) absorption. The patterning process was simplified by exploiting direct photo-oxidation of thiol bonding (photolysis) instead of conventional photolithography. Sharper images were resolved by using a white light source in combination with a narrow bandpass filter in the visible region, minimizing the diffraction patterns on the images. The line profile calibration of the image contrast caused by different resonance conditions at each point on the sensor surface (at a fixed incident angle) enables us to discriminate the monolayer thickness in nanometer scale. Furthermore, there is no signal degradation such as photo bleaching or quenching, which are common in the detection methods based on fluorescence.

Role of modifiers on the structural, mechanical, optical and radiation protection attributes of Eu3+ incorporated multi constituent glasses

  • Poojha, M.K. Komal;Marimuthu, K.;Teresa, P. Evangelin;Almousa, Nouf;Sayyed, M.I.
    • Nuclear Engineering and Technology
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    • v.54 no.10
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    • pp.3841-3848
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    • 2022
  • The effect of modifiers on the optical features and radiation defying ability of the Eu3+ ions doped multi constituent glasses was examined. XRD has established the amorphous nature of the specimen. The presence of various functional/fundamental groups in the present glasses was analyzed through FTIR spectra. The physical, structural and elastic traits of the glasses were explored. The variation in the structural compactness of the glass structure according to the incorporated modifier was enlightened to describe their suitability for a better shielding media. For the examined glasses, the metallization criterion value varied in the range 0.613-0.692, indicating the non-metallic character of the glasses with possible nonlinear optical applications. The computed elastic moduli expose the Li-containing glass (BTLi:Eu) to be tightly packed and rigid, which is a requirement for a better shielding channel. Furthermore, the optical bandgap and the Urbach energy values are calculated based on the optical absorption spectra. The evaluated bonding parameters revealed the nature of the fabricated glasses covalent. In addition, we investigated the radiation attenuation attributes of the prepared Eu3+ ions doped multi constituent glasses using Phy-X software. We determined the linear attenuation coefficient (LAC) and reported the influence of the five oxides Li2O3, CaO, BaO, SrO, and ZnO on the LAC values. The LAC varied between 0.433 and 0.549 cm-1 at 0.284 MeV. The 39B2O3-25TeO2-15Li2O3-10Na2O-10K2O-1Eu2O3 glass has a much smaller LAC than the other glasses.

The Effect of Post-Bond Heat Treatment on Tensile Property of Diffusion Bonded Austenitic Alloys (확산 접합된 오스테나이트계 재료의 인장특성에 미치는 후열처리의 영향)

  • Hong, Sunghoon;Kim, Sung Hwan;Jang, Changheui;Sah, Injin
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.39 no.12
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    • pp.1221-1227
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    • 2015
  • Diffusion bonding is the key manufacturing process for the micro-channel type heat exchangers. In this study, austenitic alloys such as Alloy 800HT, Alloy 690, and Alloy 600, were diffusion bonded at various temperatures and the tensile properties were measured up to $650^{\circ}C$. Tensile ductility of diffusion bonded Alloy 800HT was significantly lower than that of base metal at all test temperatures. While, for Alloy 690 and Alloy 600, tensile ductility of diffusion bonded specimens was comparable to that of base metals up to $500^{\circ}C$, above which the ductility became lower. The poor ductility of diffusion bonded specimen could have caused by the incomplete grain boundary migration and precipitates along the bond-line. Application of post-bond heat treatment (PBHT) improved the ductility close to that of base metals up to $550^{\circ}C$. Changes in tensile properties were discussed in view of the microstructure in the diffusion-bonded area.