• Journal of the Korean Society of Visualization
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• v.21 no.2
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• pp.91-101
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• 2023

In this study, we investigated how the performance of a Venturi changes when a hemispherical bump is applied to the divergent part of the Venturi tube and what causes the performance difference. The Venturi-tunnel experiment was conducted in the Reynolds number range of 0.2 × 10⁵ - 1.2 × 10⁵ and cavitation number range of 0.9 - 10. The bump was found to reduce the pressure loss coefficient and increase the discharge coefficient by shortening the cavitation length. The decrease in the cavitation length by the bump was explained by the strengthening of the re-entrant jet. The wake generated from the hemispherical bump seems to increase the adverse pressure gradient on the Venturi surface, thereby strengthening the re-entrant jet.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.79-79
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• 1998

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.9-17
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• 2008

Cu mushroom bumps were formed by electrodeposition and flip-chip bonded to Sn substrate pads. Contact resistances of the Cu-mushroom-bump joints were measured and compared with those of the Sn-planar-bump joints. The Cu-mushroom-bump joints, processed at bonding stresses ranging from 19.1 to 95.2 MPa, exhibited contact resistances near $15m\Omega$/bump. Superior contact-resistance characteristics to those of the Sn-planar-bump joints were obtained with the Cu-mushroom-bump joints. Contact resistance of the Cu-mushroom-bump joints was not dependent upon the thickness of the as-elecroplated Sn-capcoating layer ranging from $1{\mu}m$ to $4{\mu}m$. When the Sn-cap-coating layer was reflowed, however, the contact resistance was greatly affected by the thickness and the reflow time of the Sn-cap-coating layer.

• Journal of Korean Society for Geospatial Information Science
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• v.21 no.3
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• pp.55-62
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• 2013

This paper aims to detect Speed Bump by using Omni-directional Camera and to suggest Real-time update scheme of Speed Bump through Vision Based Approach. In order to detect Speed Bump from sequence of camera images, noise should be removed as well as spot estimated as shape and pattern for speed bump should be detected first. Now that speed bump has a regular form of white and yellow area, we extracted speed bump on the road by applying erosion and dilation morphological operations and by using the HSV color model. By collecting huge panoramic images from the camera, we are able to detect the target object and to calculate the distance through GPS log data. Last but not least, we evaluated accuracy of obtained result and detection algorithm by implementing SLAMS (Simultaneous Localization and Mapping system).

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.1276-1279
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• 2007

The main objectives of the Load/Unload are no slider-disk contact and no media damage. But, it remains unsolved technical problems on the unloading process. While the slider climbs up the ramp at the outer edge of the disk, the possibility of the slider-disk contact by lift-off force and rebound of the slider increases. Keeping in mind of these points, to prevent the slider-disk contact, we apply the disk bump on disk outer edge proceeding unload. First, referring to the simulation results, we select the optimal bump shapes to improve unload performance by unload analysis. Second, the disk bump is mechanically manufactured by pressing disk surface using tungsten tips. The bumps are variously processed by changing pressing pressure of tungsten tips. After confirming bump shape by nano-scanner, the optimal bump shape is applied to experimental unload process. Through this experiment, it is conformed that the unload performance was improved by using the optimal disk bump to prevent the slider-disk contact.

• Tribology and Lubricants
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• v.23 no.3
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• pp.123-129
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• 2007

This paper presents a theoretical model for the analysis of double-bumped AFBs. The stiffness and damping coefficients of the double bump vary depending on the external load and its friction coefficient. In the case of a lightly loaded condition where only the upper bump contributes to deformation, the double bump is in the single active region. In the case of a heavily loaded condition where both the upper and lower bumps contribute to deformation, the double bump is in the double active region. So the double bump can be either in the single or double active region depending on vertical deflection. The equivalent stiffness and damping coefficients of the bump system are derived from the vertical and horizontal deflection of the bump, including the friction effect. A static and dynamic performance analysis is carried out by using the finite difference method and the perturbation technique. The results of the performance analysis for a double-bumped AFB are compared with those obtained for a single-bumped AFB. This paper successfully proves that a double bumped AFB has higher load capacity, stiffness, and damping than a single-bumped AFB in a heavily loaded condition.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.2
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• pp.80-88
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• 2000

This paper presents a method to optimize the bump steer characteristics (the change of toe angle with vertical wheel travel) with respect to hard points in the double wishbone front suspension of the four-wheel-drive vehicle using the design of experiment, multibody dynamics simulation, and optimum design program. Front and rear suspensions are modeled as the interconnection of rigid bodies by kinematic joints and force elements using DADS. The design variables with respect to the kinematic characteristics are obtained through the experimental design sensitivity analysis. An object function is defined as the area of absolute differences between the desired and experimental toe angle. By the design of experiment and regression analysis, the regression model function of bump steer characteristics is extracted. The design variables that make the toe angle optimized are selected using the optimum design program DOT. The lane change simulations and tests of the full vehicle models are implemented to evaluate the improvement of vehicle handling performances by the optimization of front bump steer characteristics. The results of the lane change simulations show that the vehicle with optimized bump steer has the weaker understeer tendency than the vehicle with initial bump steer.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1785-1788
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• 2007

We investigated the effect on light extraction in OLED by introducing aluminum micro bump light scattering reflector. By attaching the micro bump reflector to a both side emission OLED, we found that the light extraction was 1.7 times larger than a simple flat reflector. We fabricated a 20.8” inch WXGA full color AM-OLED by integrating the micro bump scattering reflector.