• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.91-95
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• 2003

In this work, we have designed Gilbert cell downconversion mixer using 0.25um Anam CMOS process, we also have analyzed Conversion gain and IIP3 using Taylor series in our own unique way. Especially, bulk terminal is used as LO( Local Oscillator) input for reduction of power consumption and supply voltage. Supply voltage used in this design is lower than 1.8V and core current is less than 500uA. The simulation experiments showed that the conversion gain, IIP3, and power consumption were -1dB, 4.46dBm, and 0.8mW, respectively.

• Electronics and Telecommunications Trends
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• v.5 no.1
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• pp.55-70
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• 1990

SIMOX SOI is known to be one of the most useful technologies for fabrications of new generation ULSI devices. This paper describes the current status of SIMOX SOI technology for ULSI applications. The SIMOX wafer is vertically composed of buried oxide layer and silicon epitaxial layer on top of the silicon substrate. The buried oxide layer is used for the vertical isolation of devices The oxide layer is formed by high energy ion implantation of high dose oxygen into the silicon wafer, followed by high temperature annealing. SIMOX-based CMOS fabrication is transparent to the conventional IC processing steps without well formation. Furthermore, thin film CMOX/SIMOX can overcome the technological limitations which encountered in submicron bulk-based CMOS devices, i.e., soft-error rate, subthreshold slope, threshold voltage roll-off, and hot electron degradation can be improved. SIMOX-based bipolar devices are expected to have high density which comparable to the CMOX circuits. Radiation hardness properties of SIMOX SOI extend its application fields to space and military devices, since military ICs should be operational in radiation-hardened and harsh environments. The cost of SIMOX wafer preparation is high at present, but it is expected to reduce as volume increases. Recent studies about SIMOX SOI technology have demonstrated that the performance of the SIMOX-based submicron devices is superior to the circuits using the bulk silicon.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.451-454
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• 2015

This paper introduces 3 type of OTAs with $0.35-{\mu}m$ standard CMOS technology for Low-Power, Low-Voltage. The first type is a two-stage OTA designed to operate with a 1-V VDD and it has $1.774{\mu}W$ low power consumption. All transistors are operating in strong inversion. It takes Gm-Enhancement techniques to compensate gm, which is lowered by Bulk-Driven technique and has an Wide swing current mirror for low voltage operation and a Class-A output. The second type is a Two-stage OTA designed to operate with a 0.8-V VDD and It has 52nW low power consumption and 112dB high gain. The current mirror uses Composite Transistor binding Gates of two MOSFET to raise Rout which is similar with cascode structure. The third type is a Two-stage OTA designed to operate with a 0.6-V VDD and It has 160nW low power consumption and 72dB high gain. It takes Level Shift technique by Common Gate structure to amplify signals without additional bias voltage at second stage.

• Journal of Sensor Science and Technology
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• v.15 no.5
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• pp.341-346
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• 2006

We have fabricated SOI CMOS active pixel image sensor with the pinned photodiode on handle wafer in order to reduce dark currents and improve spectral response. The structure of the active pixel image sensor is 4 transistors APS which consists of a reset and source follower transistor on seed wafer, and is comprised of the photodiode, transfer gate, and floating diffusion on handle wafer. The source of dark current caused by the interface traps located on the surface of a photodiode is able to be eliminated, as we apply the pinned photodiode. The source of dark currents between shallow trench isolation and the depletion region of a photodiode can be also eliminated by the planner process of the hybrid bulk/SOI structure. The photodiode could be optimized for better spectral response because the process of a photodiode on handle wafer is independent of that of transistors on seed wafer. The dark current was about 6 pA at 3.3 V of floating diffusion voltage in the case of transfer gate TX = 0 V and TX=3.3 V, respectively. The spectral response of the pinned photodiode was observed flat in the wavelength range from green to red.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.2
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• pp.189-194
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• 2018

Nowadays most integrated circuits are built using the bulk CMOS technology, but it has much difficulty in further reduction of the power consumption and die size. As a super low-power technology to solve such problems, the SOI technology attracts great attention recently. In this paper, the study results of the temperature dependency of the hot carrier effects in the n-channel MOSFETs fabricated on the thin SOI substrate were discussed. In spite that the devices employed the LDD structure, the hot carrier effects were more serious than expected due to the high series resistance between the channel region and the substrate contact to the ground, and were found to be less serious for the higher temperature with the more phonon scattering in the channel region, which resulted in reducing the hot electron generation.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.477-480
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• 2015

In this paper a low-voltage vibration energy harvesting circuit with MPPT(Maximum Power Point Tracking) control is proposed. By employing bulk-driven technique, the minimum operating voltage of the proposed circuit is as low as 0.8V. The designed MPPT control circuit traces the maximum power point by periodically sampling the open circuit voltage of a full-wave rectifier circuit connected to the piezoelectric device output and delivers the maximum available power to load. The proposed circuit is designed using a $0.35{\mu}m\;CMOS$ process, and the chip area including pads is $1.33mm{\times}1.31mm$. Simulation results show that the maximum power efficiency of the designed circuit is 85.49%.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.10a
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• pp.520-523
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• 2016

This paper describes a DC-DC converter with MPPT control for thermoelectric energy harvesting. The designed circuit converts low voltage harvested from a thermoelectric generator into higher voltage for powering a load. A start-up circuit supplies VDD to a controller, and the controller turns on and off a NMOS switch of a main-boost converter. The converter supplies the boosted voltage to the load through the switch operation. Bulk-driven comparators can do the comparison under low voltage condition and are used for voltage regulation. Also, bulk-driven comparators raise system's efficiency. A peak conversion efficiency of 76% is achieved. The proposed circuit is designed in a 0.35um CMOS technology and its functionality has been verified through simulations. The designed chip occupies $933um{\times}769um$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.10a
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• pp.533-536
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• 2016

This paper describes a vibrational energy harvesting circuit with MPPT control. A high-performance AC-DC converter of which the efficiency is improved by using body-bias technique and bulk-driven technique is proposed and applied for the vibrational energy harvesting circuit design. MPPT (Maximum Power Point Tracking) control function is implemented using the linear relationship between the open-circuit voltage of a vibrational device and its MPP voltage. The designed MPPT control circuit traces the maximum power point by periodically sampling the open circuit voltage of a vibrational device, makes the reference voltages using sampled voltage and delivers the maximum available power to load. The proposed circuit is designed with a $0.35{\mu}m$ CMOS process, and the chip area is $1.21mm{\times}0.98mm$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.6
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• pp.491-495
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• 2007

This paper has demonstrated the electrical properties of SiGe pMOSFETs fabricated on both bulk-Si and PD SOI substrates. Two principal merits, the mobility increase in strained-SiGe channel and the parasitic capacitance reduction of SOI isolation, resulted in improvements in device performance. It was observed that the SiGe PD SOI could alleviate the floating body effect, and consequently DIBL was as low as 10 mV/V. The cut-off frequency of device fabricated on PD SOI substrate was roughly doubled in comparison with SiGe bulk: from 6.7 GHz to 11.3 GHz. These experimental result suggests that the SiGe PD SOI pMOSFET is a promising option to drive CMOS to enhance performance with its increased operation frequency for high speed and low noise applications.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.2
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• pp.184-188
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• 2014

There is a trade-off between read stability and writability under a full-/half-select condition in static random access memory (SRAM). Another trade-off in the minimum operating voltage between the read and write operation also exists. A new peripheral circuit for SRAM arrays, called a variation sensor, is demonstrated here to balance the read/write margins (i.e., to optimize the read/write trade-off) as well as to lower the minimum operation voltage for both read and write operations. A test chip is fabricated using an industrial 45-nm bulk complementary metal oxide semiconductor (CMOS) process to demonstrate the operation of the variation sensor. With the variation sensor, the word-line voltage is optimized to minimize the trade-off between read stability and writability ($V_{WL,OPT}=1.055V$) as well as to lower the minimum operating voltage for the read and write operations simultaneously ($V_{MIN,READ}=0.58V$, $V_{MIN,WRITE}=0.82V$ for supply voltage $(V_{DD})=1.1V$).