• 제목/요약/키워드: boron doping

검색결과 142건 처리시간 0.025초

Local Back Contact의 Boron-BSF 최적화에 따른 태양전지의 특성에 관한 연구

  • 안시현;박철민;조재현;장경수;백경현;이준신
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.394-394
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    • 2011
  • 최근 태양전지의 후면에서 통상적으로 사용되는 Al을 이용한 후면의 BSF형성과 그에 관한 연구보다 계면의 recombination을 줄이기 위하여 passivation 특성이 좋은 층을 후면에 형성하고 국부적으로 BSF를 형성하는 back contact을 형성하여 특성을 향상시키는 연구가 많이 이루어지고 있다. 본 연구는 이러한 local back contact을 boron-BSF를 이용하여 형성하고 passivation layer는 oxide를 이용한 구조를 SILVACO 2-dimension simulation을 이용하여 그 특성을 분석하였다. Boron-local back contact 구조에서 boron-BSF의 doping concentration, depth, lateral width, boron-BSF spacing 가변을 통해 태양전지의 특성변화에 대해서 spectrum response를 통한 QE 분석 및 I-V를 분석하여 최적화하였다.

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On Electroless Plating and Double Sided Buried Contact Silicon Solar Cells

  • Ebong, A.U.;Kim, D.S.;Lee, S.H.;Honsberg, C.B.
    • 한국재료학회지
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    • 제6권6호
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    • pp.568-575
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    • 1996
  • The double sided buried contact(DSBC)silicon solar cell processing requires doping of the rear and front grooves with boron and phosphorus respectively. The successful electroless plating of these grooves with the appropriate metals haave been found to depend on the boron conditions for the rear fingers. However, an increased understanding of electroless plating has removed this restriction. Thus the DSBC cells using different boron conditions can be electrolessly plated with ease. This paper presents the recent work done on metallizing the double sided buried contact silicon solar cells with heavily doped boron grooves. The cells results indicate that, the heavier the boron grooves, the poorer the cell performance because of the probable higher metal contact recombination associated with boron grooves.

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Boron Detection Technique in Silicon Thin Film Using Dynamic Time of Flight Secondary Ion Mass Spectrometry

  • Hossion, M. Abul;Arora, Brij M.
    • Mass Spectrometry Letters
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    • 제12권1호
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    • pp.26-30
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    • 2021
  • The impurity concentration is a crucial parameter for semiconductor thin films. Evaluating the impurity distribution in silicon thin film is another challenge. In this study, we have investigated the doping concentration of boron in silicon thin film using time of flight secondary ion mass spectrometry in dynamic mode of operation. Boron doped silicon film was grown on i) p-type silicon wafer and ii) borosilicate glass using hot wire chemical vapor deposition technique for possible applications in optoelectronic devices. Using well-tuned SIMS measurement recipe, we have detected the boron counts 101~104 along with the silicon matrix element. The secondary ion beam sputtering area, sputtering duration and mass analyser analysing duration were used as key variables for the tuning of the recipe. The quantitative analysis of counts to concentration conversion was done following standard relative sensitivity factor. The concentration of boron in silicon was determined 1017~1021 atoms/㎤. The technique will be useful for evaluating distributions of various dopants (arsenic, phosphorous, bismuth etc.) in silicon thin film efficiently.

Epitaxial Growth of Boron-doped Si Film using a Thin Large-grained Si Seed Layer for Thin-film Si Solar Cells

  • Kang, Seung Mo;Ahn, Kyung Min;Moon, Sun Hong;Ahn, Byung Tae
    • Current Photovoltaic Research
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    • 제2권1호
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    • pp.1-7
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    • 2014
  • We developed a method of growing thin Si film at $600^{\circ}C$ by hot wire CVD using a very thin large-grained poly-Si seed layer for thin-film Si solar cells. The seed layer was prepared by crystallizing an amorphous Si film by vapor-induced crystallization using $AlCl_3$ vapor. The average grain size of the p-type epitaxial Si layer was about $20{\mu}m$ and crystallographic defects in the epitaxial layer were mainly low-angle grain boundaries and coincident-site lattice boundaries, which are special boundaries with less electrical activity. Moreover, with a decreasing in-situ boron doping time, the mis-orientation angle between grain boundaries and in-grain defects in epitaxial Si decreased. Due to fewer defects, the epitaxial Si film was high quality evidenced from Raman and TEM analysis. The highest mobility of $360cm^2/V{\cdot}s$ was achieved by decreasing the in-situ boron doping time. The performance of our preliminary thin-film solar cells with a single-side HIT structure and $CoSi_2$ back contact was poor. However, the result showed that the epitaxial Si film has considerable potential for improved performance with a reduced boron doping concentration.

도핑효과에 따른 리튬이차전지용 NCA 양극활물질의 전기화학적 특성 향상 (Enhanced Electrochemical Properties of NCA Cathode Materials for Lithium Ion Battery by Doping Effect)

  • 범지우;김은미;정상문
    • Korean Chemical Engineering Research
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    • 제55권6호
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    • pp.861-867
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    • 2017
  • 니켈 함량이 높은 리튬이차전지용 NCA 양극소재의 용량 및 수명특성을 향상시키기 위하여 붕소와 코발트를 상업용 $Li_{1.06}Ni_{0.91}Co_{0.08}Al_{0.01}O_2$ (NCA)에 도핑하여 리튬이차전지의 양극소재로 사용하였다. 상업용 NCA 양극소재는 약 $5{\mu}m$$12{\mu}m$ 크기의 2차 입자들이 혼합되어 있고 붕소와 코발트 도핑후 입자크기는 조금 감소되었다. 붕소와 코발트를 도핑한 NCA-B와 NCA-Co의 초기 방전용량은 각각 214 mAh/g과 200 mAh/g으로 도핑하지 않은 NCA에 비해 높게 나타났으며, 특히 NCA-Co는 20번째의 방전용량이 157 mAh/g으로 가장 우수한 방전용량특성을 나타내었다. 이는 코발트를 도핑함으로써 c축 방향으로의 결정이 성장되어 리튬이온의 확산이 용이하기 때문이다.

Fabrication of p-type FinFETs with a 20 nm Gate Length using Boron Solid Phase Diffusion Process

  • Cho, Won-Ju
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제6권1호
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    • pp.16-21
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    • 2006
  • A simple doping method to fabricate a very thin channel body of the p-type FinFETs with a 20 nm gate length by solid-phase-diffusion (SPD) process was developed. Using the poly-boron-films (PBF) as a novel diffusion source of boron and the rapid thermal annealing (RTA), the p-type sourcedrain extensions of the FinFET devices with a threedimensional structure were doped. The junction properties of boron doped regions were investigated by using the $p^+-n$ junction diodes which showed excellent electrical characteristics. Single channel and multi-channel p-type FinFET devices with a gate length of 20-100 nm was fabricated by boron diffusion process using PBF and revealed superior device scalability.

비질량 분리 이온 질량 주입법으로 도핑시킨 다결정 박막의 도판트 활성화 거동 (Phenomenal study on the dopant activation behavior in polysilicon thin films doped by non-mass separated ion mass doping technique)

  • 윤진영;최덕균
    • 한국결정성장학회지
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    • 제7권1호
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    • pp.143-150
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    • 1997
  • 본 연구는 수소로 희석된 $B_2H_6$를 도판트 소스 가스로 사용하여 이온 질량 주입(ion mass doping)을 하였을 때 다결정 박막의 전기적 특성과 도판트의 활성화시 방사 손상(radiation damage)의 효과에 대하여 고찰하였다. 다결정 박막에서 보론(boron)의 SIMS 분석과 컴퓨터 시뮬레이션인 TRIM92를 비교해서 가장 주입 확률이 높은 이온의 종류는 $B_2H_x\;^+$(x=1, 2, 3‥‥) 형태의 분자 이온임을 알았다. 높은 에너지의 질량 이온 주입 결과 시간에 따라 변화하는 비정질화된 층의 분율이 다결정 박막 내에 연속적인 비정질 충으로 존재하였다. 주입 이온의 질량 분리가 일어나지 않는 이온 질량 주입법(ion mass doping technique)에 의해 비정질화는 유발된다. 손상된 시편의 중간 열처리 온도 범위에서 도판트 활성화 거동과 역 열처리(reverse annealing) 효과가 관찰되었다. 이와 같은 연구의 결과 p-채널 다결정 박막 트랜지스터의 오프 스테이트(off-state) 전류는 방사 손상(radiation damage)에 의존한다.

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폴리스타이렌을 이용한 그래핀 합성 및 산화 붕소가 그래핀 합성에 미치는 영향 (Synthesis of Graphene Using Polystyrene and the Effect of Boron Oxide on the Synthesis of Graphene)

  • 최진석;안성진
    • 한국재료학회지
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    • 제28권5호
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    • pp.279-285
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    • 2018
  • Graphene is an interesting material because it has remarkable properties, such as high intrinsic carrier mobility, good thermal conductivity, large specific surface area, high transparency, and high Young's modulus values. It is produced by mechanical and chemical exfoliation, chemical vapor deposition (CVD), and epitaxial growth. In particular, large-area and uniform single- and few-layer growth of graphene is possible using transition metals via a thermal CVD process. In this study, we utilize polystyrene and boron oxide, which are a carbon precursor and a doping source, respectively, for synthesis of pristine graphene and boron doped graphene. We confirm the graphene grown by the polystyrene and the boron oxide by the optical microscope and the Raman spectra. Raman spectra of boron doped graphene is shifted to the right compared with pristine graphene and the crystal quality of boron doped graphene is recovered when the synthesis time is 15 min. Sheet resistance decreases from approximately $2000{\Omega}/sq$ to $300{\Omega}/sq$ with an increasing synthesis time for the boron doped graphene.

Photocatalytic Degradation of Quinol and Blue FFS Acid Using TiO2 and Doped TiO2

  • Padmini., E.;Prakash, Singh K.;Miranda, Lima Rose
    • Carbon letters
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    • 제11권4호
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    • pp.332-335
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    • 2010
  • The photodegradation of the model compounds Quinol, an aromatic organic compound and Acid blue FFS, an acid dye of chemical class Triphenylmethane was studied by using illumination with UV lamp of light intensity 250W. $TiO_2$ and $TiO_2$ doped with Boron and Nitrogen was used as catalyst. The sol-gel method was followed with titanium isopropoxide as precursor and doping was done using Boron and Nitrogen. In photocatalytic degradation, $TiO_2$ and doped $TiO_2$ dosage, UV illumination time and initial concentration of the compounds were changed and examined in order to determine the optimal experimental conditions. Operational time was optimized for 360 min. The optimum dosage of $TiO_2$ and BN doped $TiO_2$ was obtained to be 2 $mgL^{-1}$ and 2.5 $mgL^{-1}$ respectively. Maximum degradation % for quinol and Blue FFS acid dye was 78 and 95 respectively, at the optimum dosage of BN-doped $TiO_2$ catalyst. It was 10 and 4% higher than when undoped $TiO_2$ catalyst was used.

Ultra low sheet resistance on poly silicon film by Excimer laser activation

  • Lim, Hyuck;Yin, Huaxiang;Xianyu, Wenxu;Kwon, Jang-Yeon;Zhang, Xiaoxin;Cho, Hans-S;Kim, Jong-Man;Park, Kyung-Bae;Kim, Do-Young;Jung, Ji-Sim;Noguchi, Takashi
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1112-1115
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    • 2005
  • In this study, we performed excimer laser activation on Phosphorus or Boron doped a-Si (amorphous silicon) film. We've got a very low sheet resistance (Rs), Rs was 60 ohm/sq. with phosphorus doping and was 65 ohm/sq. with boron doping at each optimized laser irradiation condition. We've found Rs on activated thin film showed an unprecedented behavior in both cases, because Rs had a strong dependency on the crystallinity of the activated Si film.

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