• Journal of the Korean Wood Science and Technology
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• v.24 no.4
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• pp.56-63
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• 1996

This study was to manufacture thinned wood of Larix leptolepis Gordon into Oriented Strand Board(OSB) with Urea-Formaldehyde Resin. The OSB was made of four kinds of strand in slenderness ratio 150 ; thickness $0.3{\pm}0.05mm$, $0.4{\pm}0.05mm$, $0.5{\pm}0.05mm$ and $0.6{\pm}0.05mm$, respectively length 45mm, 60mm, 75mm and 90mm. Target densities were 0.65gr/$cm^3$, 0.75gr/$cm^3$ and 0.85gr/$cm^3$. The stepwise 9 minutes-multi-pressing schedule in the maximum pressure 40kgf/$cm^2$, the minimum pressure 10kgf/$cm^2$ was applied for $400mm{\times}390mm{\times}12mm$ board at the temperature of $150^{\circ}C$ in a hot press. In MOR The OSB of thin strand thickness $0.3{\pm}0.05mm$(length 45mm) and density 0.85gr/$cm^3$ was the highest. The strand thickness had more effect on MOR than the strand length. In strand thickness $0.4{\pm}0.05mm$(length 60mm) and density 0.85gr/$cm^3$ was the highest MOE. The strand thickness and length had adverse effects on MOE each other. At internal bonding. The OSB of strand thickness $0.3{\pm}0.05mm$(length 45mm) and board density 0.75gr/$cm^3$ showed the highest value. OSB had higher IB value with thinner strand thickness. The thinner strand thickness showed the lower thickness swelling in turn $0.3{\pm}0.05mm$(length 45mm), $0.4{\pm}0.05mm$(length 60mm), $0.5{\pm}0.05mm$(length 75mm). $0.6{\pm}0.05mm$(length 90mm). Target densities 0.75gr/$cm^3$ 0.65gr/$cm^3$, 0.85gr/$cm^3$ showed in turn lower value. Finally, The OSB made of thinned wood of Larix leptolepis Gordon showed good results in laboratory experiment.

• Journal of the Korean Wood Science and Technology
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• v.41 no.4
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• pp.293-301
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• 2013

This study discusses the feasibility of coffee bean residue as a raw material of medium-density fiberboard (MDF). In this relation, the effect of coffee bean residue known as an absorbent material on the physical and mechanical properties of MDF manufactured at its different addition level. Coffee bean residue which is a by-product of coffee mill and large amount of waste left over after processing for instant coffee was added at the level of 3, 6, and 9% on dry basis and urea formaldehyde resin was used as the adhesive. The MDF made with mixture of wood fiber and coffee bean residue was tested for physical and mechanical properties as well as formaldehyde emission. The bending strength and internal bonding strength of the MDF made with mixture of wood fiber-coffee bean residue were higher than that of the KS standard in randomized mat structure type, but not in layered mat structure type. Also, the physical properties of MDF made with mixture of wood fiber-coffee bean residue showed a considerable improvement in thickness swelling over the commercial MDF. More importantly, the formaldehyde emission rate of MDF made with mixture of wood fiber-coffee bean residue met the KS standard and was close to that of commercial MDF. These results showed the feasibility of coffee bean residue as a raw material for the production of environmentally-friendly MDF. Additional works on adhesive-coffee bean compatibility, improvement of moisture absorption effect and reduction the formaldehyde emission rate by carbonization of coffee bean residue may be required.

• Journal of the Korean Vacuum Society
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• v.20 no.1
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• pp.22-29
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• 2011

An infrared thermographic imaging module of [$320{\times}256$] focal-plane array (FPA) based on [InAs/GaSb] strained-layer superlattice (SLS) was fabricated, and its images were demonstrated. The p-i-n device consisted of an active layer (i) of 300-period [13/7]-ML [InAs/GaSb]-SLS and a pair of p/n-electrodes of (60/115)-period [InAs:(Be/Si)/GaSb]-SLS. FTIR photoresponse spectra taken from a test device revealed that the peak wavelength (${\lambda}_p$) and the cutoff wavelength (${\lambda}_{co}$) were approximately $3.1/2.7{\mu}m$ and $3.8{\mu}m$, respectively, and it was confirmed that the device was operated up to a temperature of 180 K. The $30/24-{\mu}m$ design rule was applied to single pixel pitch/mesa, and a standard photolithography was introduced for [$320{\times}256$]-FPA fabrication. An FPA-ROIC thermographic module was accomplished by using a $18/10-{\mu}m$ In-bump/UBM process and a flip-chip bonding technique, and the thermographic image was demonstrated by utilizing a mid-infrared camera and an image processor.

• Journal of Conservation Science
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• v.32 no.2
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• pp.223-234
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• 2016

Two-component epoxy resin is widely used in the cultural heritage restoration field. However according to mixing ratio of resin and hardener, curing property, mechanical strength and chemical structure differ which have possibility to effect the stability of cultural heritage. Result of questionnaire survey shows hands-on workers in the conservation field tend to mix the epoxy resin with his or her eye measurement when the using amount is small or mix additional hardener to shorten the pot life of epoxy resin. This research aims to analyze the curing property, mechanical strength and chemical structure of rapid curing type epoxy resin and medium curing type one depending on relative ratio of 0.25~4 of hardener to resin. When the amount of hardener was 0.5~2 times more than the resin, exothermic heat and curing speed were both increased. In case of included hardener to resin was lower than official ratio, mechanical strength (tensile shear strength, tensile strength and compressive strength) became higher along with active cross-linking bonding of the epoxy resin. Medium curing type epoxy relatively had lower exothermic heat and slower reaction during curing process. It was observed to be put to definite point of mechanical strength under lower content of hardener than official ratio. While, hardener ratio more than twice the resin slowed down the curing greatly and lowered the adhesion strength also. In conclusion, under the lower mixing rate of hardener than official ratio would show relatively fast reaction with similar mechanical strength. Over the official ratio on the other hand, material property drops rapidly. Accordingly, mixing ratio of epoxy resin is expected to be influential to the stability of cultural heritage.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.91-96
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• 2014

Through silicon via (TSV) technology is to form a via hole in a silicon chip, and to stack the chips vertically for three-dimensional (3D) electronics packaging technology. This can reduce current path, power consumption and response time. In this study, Cu-filling substrate size was changed from Si-chip to a 4" wafer to investigate the behavior of Cu filling in wafer level. The electrolyte for Cu filling consisted of $CuSO_4$ $5H_2O$, $H_2SO_4$ and small amount of additives. The anode was Pt, and cathode was changed from $0.5{\times}0.5cm^2$ to 4" wafer. As experimental results, in the case of $5{\times}5cm^2$ Si chip, suitable distance of electrodes was 4cm having 100% filling ratio. The distance of 0~0.5 cm from current supplying location showed 100% filling ratio, and distance of 4.5~5 cm showed 95%. It was confirmed good TSV filling was achieved by plating for 2.5 hrs.

• Korean Chemical Engineering Research
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• v.43 no.5
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• pp.632-636
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• 2005

In this work, the effect of chemical treatments on surface properties of SiC was investigated in thermal and mechanical interfacial behaviors of SiC/PMMA nanocomposites. The acid/base value, contact angles, and FT-IR analysis were performed for the study of surface characteristics of the SiC studied. The thermal stabilities of the SiC/PMMA nanocomposites were investigated by thermogravimetric analysis (TGA). Also the mechanical interfacial properties of the composites were studied in critical stress intensity factor ($K_{IC}$) and critical strain energy release rate ($G_{IC}$) measurements. As a result, the acidically treated SiC (A-SiC) had higher acid value than that of untreated SiC (V-SiC) or basically treated SiC (B-SiC). The acidic solution treatment led to an increase in surface free energy of the SiC, mainly due to the increase of its specific component. Thermal and mechanical interfacial properties of the SiC/PMMA nanocomposites, including initial decomposition temperature (IDT), $K_{IC}$, and $G_{IC}$ had been improved in the acidic treatment on SiC. This was due to the improvement in the interfacial bonding strength, resulting from the acid-base interfacial interactions between the fillers and polymeric matrix.

• Composites Research
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• v.29 no.4
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• pp.194-202
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• 2016

A graphene film, two-dimensional carbon sheet, is a promising material for future electronic devices and so on. In graphene applications, the effect of substrate on the atomic/electronic structures of graphene is significant, so we studied an interaction between graphene film and substrate. To study the effect, we investigated the graphene films grown on Ni substrate with two crystal face of (111) and (100) by Raman spectroscopy, comparing with graphene films transferred on $SiO_2/Si$ substrate. In our study, the doping effect caused by charge transfer from Ni or $SiO_2/Si$ substrate to graphene was not observed. The bonding force between graphene and Ni substrate is stronger than that between graphene and $SiO_2/Si$. The graphene films grown on Ni substrate showed compressive strain and the growth of graphene films is incommensurate with Ni (100) lattice. The position of 2D band of graphene synthesized on Ni (111) and (100) substrate was different, and this result will be studied in the near future.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.6788-6798
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• 2015

In recent high speed rail way, the operating speed of train is enhanced and the introduction of EMU train vehicles is increased. In addition, as expected the demand of the concrete slab track and the trend of design cross-section reduction, the clear behavior of evaluation of internal slab layer is demanded about the variation of design load and speed. The purpose of this study is to evaluate and identify the mechanical behavior pattern of concrete slab track and track-road bed with the variation of axle load and train speed. To this end, the behavior of TCL and HSB was evaluated in according to the variation of axle load and speed. And the analysis results and the data measured TCL strain sensor, which was embedded in TCL slab under installation on Honam high speed railway, was analyzed. The analysis result shows that the strain are increasing in according to the speed-up of train, and line regression was obtained from measured data. Analysis data of the state of bonding condition of slab layer and measured data was analyzed. It is conducted that the TCL layer stress of HEMU 430X, which of axle load, is lighter was similar to the stress of KTX-Honam, the standard deviation of measured stress is dramatically increased.

• Journal of the Korean Wood Science and Technology
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• v.35 no.6
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• pp.100-107
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• 2007

People have spent lots of time inside building about 90% of these day. Industry has been developed rapidly after I960. Construction materials had changed from natural materials to chemical materials and confidentiality of building has been more higher than before by policy of saving energy. These have caused sick-building syndrome (SBS) for us. So people want environmental construction materials for their house. We designed a environmental loess (yellow soil) finishing material which was composed of loess, water, water-soluble resin, hardener and filler. The purposes of this study were that making an environmental loess finishing material with optimum ratio, evaluating the usability of loess finishing material for wall. Furthermore it was suitable for wall to evaluate mechanical properties that are impact test, cracking test, abrasion test and de-bonding test, environmental properties that were emission of VOCs, formaldehyde and far infrared radiation.

• Journal of the Korean Wood Science and Technology
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• v.27 no.3
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• pp.51-62
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• 1999

The objective of this research is to develop paper sludge reinforced thermoplastic composites which incorporate the advantages of each component materials. The effects of paper sludge content(0, 10, 20, 30, 40----), mesh size(20~40, 60~80, less than 100mesh), and coupling agent(Epolene E-43 and Epolene G-3003) on the mechanical properties of paper sludge-polypropylene composites were investigated. Composite density increased with an increase in the paper sludge content. When paper sludge is incorporated into a polypropylene matrix, the flexural properties of the composite increase significantly with an increase in the paper sludge mixing ratio. Especially, flexural modulus was improved with increasing paper sludge content. The flexural strength of composites was improved, but flexural modulus reduced somewhat with decreasing paper sludge particle size. The flexural properties of paper sludge-polypropylene composites were improved by using coupling agents to enhance the bonding between reinforcing filler and matrix. Use of the epolene E-43 and G-3003 resulted in considerable improvement in the flexural strength over control specimens. The flexural strength of the G-3003 composite system is higher than that of the E-43 system. Generally, izod notched impact strength of paper sludge-polypropylene composite decreased slightly, whereas izod unnotched impact strength decreased significantly with increasing paper sludge contents. There was no effects of paper sludge particle size on impact strength of paper sludge-polypropylene composites. And izod unnotched impact strength of epolene E-43 composite system sharply decreased but that of G-3003 composite system was no tendency with increasing additive content.