• 대한금속재료학회지
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• 제48권12호
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• pp.1116-1122
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• 2010

Metal interconnections of multilayer Al/Ni and TiW/seed-Ni/Ni were formed on glass, and the adhesion strength and nanoindentation response of the composite layers were evaluated. The Al/Ni multilayer was formed by an anodic bonding of glass to Al and subsequent electroless plating of Ni, while the TiW/Ni multilayer was fabricated by sputter deposition of TiW and seed-Ni onto glass and electroless plating of Ni. Because of the diffusion of aluminum into glass during the anodic bonding, anodically bonded glass/Al joint exhibited greater interfacial strength than the sputtered glass/TiW one. The Al/Ni on glass also showed excellent resistance against delamination by bending deformation compared to the TiW/seed-Ni/Ni on glass. From the nanoindentation experiment of each metal layer on glass, it was found that the aluminum layer had extremely low hardness and elastic modulus similar to the glass substrate and played a beneficial role in the delamination resistance by lessening stress intensification at the joint. The indentation data of the multilayers also supported superior joint reliability of the Al/Ni to glass compared to that of the TiW/seed-Ni/Ni to glass.

• 한국자기학회지
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• 제13권1호
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• pp.6-14
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• 2003

열처리 온도에 따라 접합유리와의 화학적 반응이 Fe-Hf-N/SiO$_2$, 및 Fe-Hf-N/Cr/SiO$_2$ 박막의 물리적, 자기적 특성에 미치는 영향을 고찰하였다. 접합유리와 반응된 Fe-Hf-N/SiO$_2$ 박막의 연자기 특설은 온도가 증가함에 따라 크게 떨어졌으며, $600^{\circ}C$에서 포화자화값은 1 kG, 보자력이 27 Oe, 10MHz에서의 유효투자율이 70로 자기적 특성이 급격히 열화되었다. 이는 접합유리와의 화학적 반응에 의해 Fe-Hf-N 박막이 H$_{f}$ O$_2$, Fe$_3$O$_4$ 등으로 산화되기 때문인 것으로 나타났다. Fe-Hf-N/Cr/SiO$_2$ 박막의 경우, $600^{\circ}C$에서 포화자화값 13.5kG, 보자력은 4Oe, 10 MHz에서의 유효 투자율이 700으로 Fe-Hf-N/SiO$_2$ 박막보다 연자기 특성 열화가 덜 일어났다. 이는 Fe-Hf-N/Cr/SiO$_2$ 박막의 Cr 층이 Fe-Hf-N 박막의 산화를 억제하여. 일부에서만 HfO$_2$가 생성되고 나머지는 원래의 $\alpha$-Fe상을 유지하기 때문인 것으로 나타났다.

• 한국전산유체공학회지
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• 제8권2호
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• pp.33-41
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• 2003

A simplified simulation model is designed to investigate the vacuum-driven bonding of glass panels in the cell process for LCD manufacturing. The bonding process is modelled by the transient flow of a weakly-compressible fluid in a very thin channel between two horizontal glass panels. An order of magnitude scaling analysis is conducted based on the characteristic feature of the channel of which height is much smaller than the horizontal length scales. It is revealed that the flow in the channel is represented by a Poiseuille flow of a compressible fluid. A finite volume model has been constructed to acquire the numerical solution to the derived simplified equations. For a simple test problem of pressure-driven microchannel flow, an assessment is made of the accuracy and validity of the proposed model. The basic aspects of vacuum-driven bonding are examined numerically, and the applicability of the present simulation model is illustrated.

• 대한기계학회논문집B
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• 제41권6호
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• pp.423-427
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• 2017

본 논문은 silicon-on-glass(SOG) 공정에서 접합력 균일도 향상을 위한 고정단 설계에 대한 내용을 다룬다. SOG 공정은 전극이 형성된 유리 기판층과 실리콘 구조층의 양극접합을 기반으로 하며, 가속도 센서와 공진형 센서를 비롯한 고종횡비 구조를 갖는 다양한 실리콘 센서들의 제작에 널리 사용된다. 본 논문에서는 전극과 유리 기판층의 표면 사이에 발생하는 단차로 인한 불균일한 접합을 방지하기 위해, 실리콘 구조층에서 유리 기판층과 접합되는 부분과 전극과 겹쳐지는 부분을 트렌치(trench)를 이용해 분리하는 새로운 형상의 고정단을 제안한다. 본 고정단은 추가적인 공정 없이 기존의 SOG 공정으로 제작되는 디바이스들에 손쉽게 적용이 가능하다.

• 대한치과보철학회지
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• 제43권4호
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• pp.415-425
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• 2005

Statement of problem : Fracture of composite resin core will be occulted by progress of crack. Bonding interface of different materials has large possibility of starting point of crack line. Therefore, the bond strength of glass fiber post to composite resin core is important for prevention of fracture. Purpose: This in vitro study tried to find out how to get the higher strength of glass fiber post to composite resin core through surveying the maximum load that fractures the post and cote complex. Materials and methods: 40 specimens made with glass fiber Posts(Style $post^{(R)}$, Metalor, Swiss) and composite resin core ($Z-100^{(R)}$, 3M, USA) were prepared and loaded to failure with push-out type shear-bond strength test in a universal test machine. The maximum fracture load and fracture mode were investigated in the specimens that were restored with four different surface treatments. With the data. ANOVA test was used to validate the significance between the test groups, and Bonferroni method was used to check if there is any significant statistical difference between each test group. Evely analysis was approved with 95% reliance. Results: On measuring the maximum fracture load of specimens, both the treatments of sandblasted and acid-etched one statistically showed the strength increase rather than the control group (p<0.005). The scanning electric microscope revealed that sand blasting made more micro-retention form not only on the resin matrix but on the glass fiber, and acid-etching contributed to increase in surface retention form, eliminated the inorganic particles in resin matrix. Specimen fracture modes investigation represented that sand blasted groups showed lower bonding failure than no-sand blasted groups. Conclusion: Referring to the values of maximum fracture load of specimens, the bonding strength was increased by sand blasting and acid-etching.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.1053-1054
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• 2009

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.53-81
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• 2006

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권11호
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• pp.635-639
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• 2000

In this paper, a new idea about ultra-clean aligning and mounting method of FED spacers was introduced. The glass-to -glass electrostatic bonding process was employed in order to bond the micro-structures of spacers to black matrix area formed on an FED anode substrate. It is possible to get adhesive-free bonding interface and well-aligned spacer array on an FED anode substrate with a ${\pm}5{\mu}m$ accuracy. Finally, I inch-sized FED panel was demonstrated to make sure of its applicability to FED panel fabrication.

• Restorative Dentistry and Endodontics
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• 제17권1호
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• pp.166-180
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• 1992

One disadvantage of Glass Ionomer Cement Restoration is the difficulty in polishing. To find the appropriate polishing method, we polished the surface of Glass Ionomer Cement Restorations by 11 combination methods serially using disks shared with large-small particles and evaluated the polishing process in terms of surface roughness, surface roughness curve, and SEM findings. In addition, a visible light curing type bonding material was applied to evaluate the possible improvement in surface properties. The following results were obtained. 1. The disk surface of Glass Ionomer Cement was polished serially by disks with superfine particles, but it didn't become smooth. 2. The surface of Microfilled Composite resin became smoother as using a disk with finer particles. 3. When a visible light curing type bonding material was applied in finishing process, the surface of Glass Ionomer Cement became smooth as much as the applied matrix.

• 한국전기전자재료학회논문지
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• 제22권3호
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.