• Journal of the Korean Ceramic Society
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• v.30 no.5
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• pp.357-364
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• 1993

Chemical reaction occurred in the interface of Mn-Zn ferrite and glass after bonding. Effects of the formation of reaction layer on the magnetic properties were investigated. The composition of glass was 23PbO-61SiO2-6ZnO-8Na2O-2K2O and the ferrite was chosen to have a high permeability. Toroid samples of ferrites bonded with glasses, were heat-treated at $700^{\circ}C$, 80$0^{\circ}C$ and 90$0^{\circ}C$ for 1h. The reaction was observed to increase with bonding temperature, resulting in the development of reaction layer. Subsequently the initial permeability was found to be decreased. The permeabilities decreased by 25% with increasing bonding temperature from $700^{\circ}C$ to 80$0^{\circ}C$. At the bonding temperature of 90$0^{\circ}C$, the permeability was decreased by 45%, compared to that of 80$0^{\circ}C$.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.1
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• pp.70-72
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• 2000

In this paper, a spacer process for FED(Field Emission Display) was developed with the glass to glass anodic bonding technology using Al film as an interlayer and a 3.5 inch monochromatic type FED was fabricated. Holder to dislocate spacers vertically was designed with (110) Si wafer by bulk etching. Spacers, $100\mum\; width\; and\; 1000\mum$ height, were formed on anode panel by spacer to glass anodic bonding and the fabricated FED was operated for emission at 1㎸ anode voltage.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.5
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• pp.29-35
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• 2009

Field emission displays(FED) are currently being study as a potential flat technology. The purpose of this project shows the research result of vacuum packaging technology for the development of FED. For FED vacuum packaging, the bonding of glass/glass, the exhaust of vacuum and getter technology have been studied for vacuum packaging technology The simulation and vacuum sealing, and glass/glass bonding are also extensively studied. The glass/glass bonding is formed by using the frit glass and the Inside pressure of complete panel showed of $2{\times}10^{-5}$[Torr]. As a getter result, the increase of pressure has been showed the decrease of outgassing effect by using thin film getter.

• Journal of the Korean Ceramic Society
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• v.38 no.11
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• pp.1000-1007
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• 2001

In an evacuated tube solar collector, the stable sealing of the heat pipe to the glass tube is important for the collector to use for a long period of time. The sealing of copper tube to the glass is quite difficult because of the large differences in the physical and chemical properties of the two materials. In this study, therefore, a proper copper oxide layer was induced to improve the chemical bonding of the two materials, and the oxidation state of copper and the interface between copper and glass were examined by XRD, SEM and EDS. Its bonding strength was also measured. Cu$_2$O was formed when the bare copper was heat-treated under 600$^{\circ}C$, while CuO oxide layer was formed above that temperature. The bonding state of CuO to the copper was very poor. The borate treatment of the copper, however, extend the stable forming of Cu$_2$O layer to 800$^{\circ}C$. Borosilicate glass tube was sealed to a copper tube by Housekeeper method only when the sealing part was covered with Cu$_2$O layer. The bonding strength at the interface was measured 354.4N, its thermal shock resistance was acceptable.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1946-1949
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• 1996

We have performed silicon-to-silicon anodic bonding using glass layer deposited by electron beam evaporation. Wafers can be bonded at $135^{\circ}C$ with an applied voltage of $35V_{DC}$, which enables application of this technique to the vacuum packaging of microelectronic devices, because its bonding temperature and voltage are low. From the experimental results, we have found that the evaporated glass layer more than $1\;{\mu}$ m thick was suitable for anodic bonding. The role of sodium ions for anodic bonding was also investigated by theoretical bonding mechanism and experimental inspection.

• The Journal of Korean Academy of Prosthodontics
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• v.36 no.1
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• pp.26-49
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• 1998

The purpose of this study was to confirm the formation of hybrid layer and resin tags in dentin tissue and the possibility of bonding between luting cements used for the prosthesis and the resinous surface coated with resin bonding agents to prevent the dentin hypersensitivity after abutment preparation. Some resin bonding agents, which may have the possibility of bonding with polyacrylic acid as a liquid ingredient of polycarboxylate and glass ionomer cements, were selected. All-Blond desensitizer containing NTG-GMA and BPDM, Scotch-Bond Multipurpose plus containing HEMA, and XR-bond containing organophosphate were selected as a coating agent. Dental cements were zinc phosphate, polycarboxylate, and glass ionomer cement. After the exposed dentin surface of premolars was ethced with 10% phosphoric acid and coated with resin bonding agents, the morphology of treated surfaces and the resin tags and hybrid layers on sectioned surfaces were observed by SEM. Shear bond strength between the resin bonding agents and 3 kinds of cements was measured 24 hours after bonding. On the debonded surfaces of the shear bond strength tested specimens, the cement tags and the bonding sites between the resin materials and cements were examined by SEM. Following conclusions were drawn : 1. Coating of dentin with resin bonding agents had no effect on the shear bond strength of zinc phosphate cement. 2. Both of polycarboxylate and glass ionomer cements showed the increased shear bond strength by the dentinal coating with Scotch-Bond Multipurpose plus containing HEMA. However, in the case of dentinal coating with some agents containing NTG-GMA and BPDM or organophosphate, polycarboxylate cement exhibited the lowered shear bond strength, and glass ionomer cement showed the unchanged shear bond strength. 3. Complete obstructions of dentinal tubules were observed on the dentin coated with All-Bond desensitizer or XR-bond, but distinct shape of the orifices of dentinal tubules was observed consistently on the dentin coated with Scotch-Bond Multipurpose plus. 4. The hybrid layer was thickest on the dentin coated with All-Bond desensitizer, and the length of resin tags was longest on the dentin coated with Scotch-Bond Multipurpose plus. 3. On the debonded specimens which had been bonded with polycarboxylate cement or glass ionomer cement after coating with Scotch-Bond Multipurpose plus, the cement tags and the bonding sites between the resinous surface and the cements could be examined.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.103-106
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• 1999

In this paper, we suggest the FED packaging technology that have 4mm thickness, using sodalime glass-to-sodalime glass electrostatic bonding. It based on conventional silicon-glass bonding. The silicon film was deposited an around the exhausting hole on FED backside panel. And then, the silicon film of panel was successfully bonded with capping(bare) glass in vacuum environment and the FED panel was vacuum-sealed. In this method, we could achieve more 153 times increased conductance and 200 times increased vacuum efficiency than conventional tube packaging method. The vacuum level in panel, by SRG test, was maintained about low 10$_{-4}$ Torr during above two months And, the light emission was observed to 0.7-inch tubeless packaged FED. Then anode current was 34 $\mu$ A. Emission stability was constantly measured for 10 days.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• Proceedings of the Optical Society of Korea Conference
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• 2002.07a
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• pp.254-255
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• 2002

Optical elements such as small glass lenses or optical fibers can be permanently bonded to substrates using Al inter-layer by applying Pressure and heating. As an example aspherical lens was bonded on a silicon V-groove. The bonding has high shear strength and good thermal cycling stability.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.85-89
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• 2006