• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.45-49
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• 2022

Through Silicon Via (TSV) is a technology that interconnects chips through silicon vias. TSV technology can achieve shorter distance compared to wire bonding technology with excellent electrical characteristics. Due to this characteristic, it is currently being used in many fields that needs faster communication speed such as memory field. However, there is performance degradation issue on TSV technology due to the parasitic capacitance. To deal with this problem, in this study, the parasitic capacitance with TSV design factors is analyzed using commercial tool. TSV design factors were set in three categories: size, aspect ratio, pitch. Each factor was set by dividing the range with TSV used for memory and package. Ansys electronics desktop 2021 R2.2 Q3D was used for the simulation to acquire parasitic capacitance data. DOE analysis was performed based on the reaction surface method. As a result of the simulation, the most affected factors by the parasitic capacitance appeared in the order of size, pitch and aspect ratio. In the case of memory, each element interacted, and in the case of package, it was confirmed that size * pitch and size * aspect ratio interact, but pitch * aspect ratio does not interact.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.69-74
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• 2010

A new package substrate for dynamic random access memory(DRAM) devices has been developed using selective aluminum anodization. Unlike the conventional substrate structure commonly made by laminating epoxy-based core and copper clad, this substrate consists of bottom aluminum, middle anodic aluminum oxide and top copper. Anodization process on the aluminum substrate provides thick aluminum oxide used as a dielectric layer in the package substrate. Placing copper traces on the anodic aluminum oxide layer, the resulting two-layer metal structure is completed in the package substrate. Selective anodization process makes it possible to construct a fully filled via structure. Also, putting vias directly in the bonding pads and the ball pads in the substrate design, via in pad structure is applied in this work. These arrangement of via in pad and two-layer metal structure make routing easier and thus provide more design flexibility. In a substrate design, all signal lines are routed based on the transmission line scheme of finite-width coplanar waveguide or microstrip with a characteristic impedance of about $50{\Omega}$ for better signal transmission. The property and performance of anodic alumina based package substrate such as layer structure, design method, fabrication process and measurement characteristics are investigated in detail.

• Bulletin of the Korean Chemical Society
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• v.33 no.9
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• pp.2907-2909
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• 2012

A disintegrin and metalloprotease with thrombospondin domains (ADAMTS) are a member of peptidase and involved in processing of von Willebrand factor as well as cleavage of aggrecan, versican, brevican and neurocan. Among 19 subfamilies of human ADAMTS, ADAMTS-4 is a zinc-binding metalloprotease and is a famous therapeutic target for arthritis. It has been reported that a flavonoid luteolin shows inhibitory activity against ADMATS-4. In this study, we verified that luteolin is a potent inhibitor of ADAMTS-4 and probed the molecular basis of its action. On the basis of a docking study, we proposed a binding model between luteolin and ADAMTS-4 in which 3',4'-dihydroxyl groups in luteolin formed hydrogen bonding with ADMATS-4 and these interactions are important for its inhibitory activity against ADAMTS-4.

• Korean Journal of Computational Design and Engineering
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• v.6 no.1
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• pp.17-23
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• 2001

Lasting machines for shoe manufacturing are continuously developed with the aid of automation and CAM(Computer Aided Manufacturing). Although automation and CAM techniques have tremendously reduced the labor in shoe manufacturing, there still remain some parts manufactured by experts. In order to enhance the capability and efficiency of machines for labor-free shoe manufacturing, CAD data of a shoe last is essential. While CAD datarization takes the fundamental role in the shoe design and manufacturing, there has been little research for the CAD datarization of a shoe last. In this paper, a new procedure for CAD datarization of a shoe last using finite element patches and a tension sl)line method is proposed for application to shoe manufacturing machines. The outer line of a shoe-last sole is interpolated by a tension spline method and bonding lines are extracted from the shoe CAD data. Data set for a control algorithm of the tasting machine can be produced from the CAD data.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.10
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• pp.1822-1828
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• 2008

This paper presents design parameter calculation methodology and its realization to construction for the 10/350${\mu}s$ lightning impulse current generator(ICG) modelled as double exponential function waveform with characteristic parameters ${\alpha},{\beta}$. Matlab internal function, "fzero" was applied to find ${\lambda}={\alpha}/{\beta}$ which is solution of nonlinear equation linearly related with two wave parameter $T_1$ and $T_2$. The calculation results for 10/350${\mu}s$ lightning impulse current show very good accuracy with error less 0.03%. Two type of 10/350${\mu}s$ ICGs based on the calculated design circuit parameters were fabricated by considering the load variation. One is applicable to the MOV based Surge protective device(SPD) for less 15 kA and the other is to test small resistive devices such as spark gap arrester and bonding device with maximum current capability 30 kA. The tested waveforms show error within 10% in comparison with the designed estimation and the waveform tolerance recommended in the IEC 61643-1 and IEC 60060-1.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.8
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• pp.113-120
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• 2014

In this paper, designing of an earthing system in accordance with international standards with regard to 22.9kV-y multi-grounded neutral system is discussed and confirmed that the consumer's earthing system can be a part of a global earthing system by interconnecting its earthing system with the neutral conductor of 22.9kV-y multi-grounded system. Further, it is proposed that some modification of the earthing system design flowchart given in the international standards are necessary when considering the equipotential bonding, lightning protection, and telecommunications facilities as well as the basic safety requirements.

• Journal of the Korea Fashion and Costume Design Association
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• v.4 no.2
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• pp.127-138
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• 2002

The recent fashion trend of knit wear is now changing to the various fibrous color combination which emphasizes the plain texture. It supports the human body curvature which is influenced by the slim style of woven wear. In this research work, the general characteristics and knit wear fashion trend are studied. The metallic fiber and fancy yarn are used widely as fiber materials for knit in nowadays. However, the light and functional materials are preferred. The general characteristics of knit which gives the feeling of light and warm are still prevailing using pure wool, kid mohair, and mixed wool with polyester. In order to provide the soft touch feeling, smoothness of fine fiber, and feeling of sponge, several kinds of finishing techniques such as bulky, felting, bonding, and quilting process are usually adopted. The knit wear fashion trend is mainly consisted of the basic design items, and it gives the feeling of luxurious and elegance. The more youthful feeling is adapted for the general style of knit wear of the certain target age. The woven wear trend such as season color, line and pattern are applied in knit wear trend in recent days.

• Journal of Sensor Science and Technology
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• v.13 no.3
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• pp.230-235
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• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 seem at a supplied voltage of 100 V with a 50% duty cycle, maximum non-linearity was 2.24% FS and leak rate was $3.03{\times}10^{-8}pa{\codt}m^{3}/cm^{2}$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.27 no.9
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• pp.1-5
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• 2013

We developed high-efficient 6W-LED package with simple structure by applying Heat Slug and silicone-reflector. LED package was manufactured in $8.5{\times}8.5mm$ sized multi-chip structure having thickness of $500{\mu}m$ achieved by bonding silicon-reflector with prepreg on top of the plate after implementing the reflector placed on copper substrate Half Etching by thickness of $200{\mu}m$. The luminous flux, luminous efficacy, correlated color temperature, color rendering index and thermal resistance of developed LED was evaluated, and it verified the application of products by applying it to 120W-LED road luminaires through simulation. The luminous efficacy of LED package reached over 130lm/W, and it is possible to be manufactured into 120W-LED road luminaires using 18 packages. In addition, the simulation results showed average of horizontal illuminance and overall illuminance uniformity that is suitable for three-lane road.

• Nuclear Engineering and Technology
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• v.52 no.5
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• pp.1079-1092
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• 2020

A parametric study of several parameters relevant to design safety on the spent nuclear fuel (SNF) rod response under a drop accident is presented. In the view of the complexity of interactions between the independent safety-related parameters, a factorial design of experiment is employed as an efficient method to investigate the main effects and the interactions between them. A detailed single full-length fuel rod is used with consideration of post-irradiated fuel conditions under horizontal and vertical free-drops onto an unyielding surface using finite-element analysis. Critical drop heights and critical g-loads that yield the threshold plastic strain in the cladding are numerically estimated to evaluate the fuel rod structural resistance to impact load. The combinatory effects of four uncertain parameters (pellet-cladding interfacial bonding, material properties, spacer grid stiffness, rod internal pressure) and the interactions between them on the fuel rod response are investigated. The principal finding of this research showed that the effects of above-mentioned parameters on the load-carrying capacity of fuel rod are significantly different. This study could help to prioritize the importance of data in managing and studying the structural integrity of the SNF.