• Composites Research
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• 제26권6호
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• pp.386-391
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• 2013

본 연구에서는 차량의 승차감 향상을 위해 기존의 알루미늄 차량용 휠의 성능을 개선하고자 복합재료-알루미늄 하이브리드 휠을 제안하고 시제품을 제작하여 평가하였다. 유한요소해석 기법을 통해 알루미늄과 복합재료의 접착부에 대한 접착 길이와 접착 두께를 결정하고, 자동조심 및 접착 지그 역할을 할 수 있는 홈과 돌기 구조를 적용하였다. 차량용 복합재료-알루미늄 하이브리드 휠의 성능평가를 위해 다양한 실험을 유한요소해석을 통해 구현하고 안전성을 검토하였다. 복합재료 림 부의 성형을 위한 금형을 설계하고 진공백 성형방법으로 제작한 후 알루미늄 부와 접착을 하여 시제품을 완성하였다. 진동실험 결과, 동일한 형상의 알루미늄 휠보다 10% 가벼운 복합재료-알루미늄 하이브리드 휠의 경우 고유진동수가 16% 증가하였고, 감쇠능이 32% 증가하였다.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.71-74
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• 2013

본 연구에서는 웨이퍼 레벨 적층 과정에서 발생하는 웨이퍼 오정렬(misalignment) 현상과 웨이퍼 휘어짐(warpage)과의 관계에 대해서 조사하였다. $0.5{\mu}m$ 두께의 구리 박막 증착을 통해 최대 $45{\mu}m$의 휨 크기(bow height)를 갖는 웨이퍼를 제작하였으며, 이 휘어진 웨이퍼와 일반 웨이퍼를 본딩하였을 때 $6{\sim}15{\mu}m$ 정도의 정렬 오차가 발생하였다. 이는 약 $5{\mu}m$의 웨이퍼 확장(expansion)과 약 $10{\mu}m$의 미끄러짐(slip)의 복합 거동으로 설명할 수 있으며, 웨이퍼 휘어짐의 경우 확장 오정렬보다 본딩 과정에서의 미끄러짐 오정렬에 주로 기여하는 것으로 보인다.

• 대한기계학회논문집A
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• 제28권4호
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• pp.435-442
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• 2004

This paper presents a hermetic MEMS on-chip package bonded by a closed-loop AuSn solder-line. We design three different package specimens, including a substrate heated specimen without interconnection-line (SHX), a substrate heated specimen with interconnection-line (SHI) and a locally heated specimen with interconnection-line (LHI). Pressurized helium leak test has been carried out for hermetic seal evaluation in addition to the critical pressure test for bonding strength measurement. Substrate heating method (SHX, SHI) requires the bonding time of 40min. at 400min, while local heating method (LHI) requires 4 min. at the heating power of 6.76W. In the hermetic seal test. SHX, SHI and LHI show the leak rates of 5.4$\pm$6.7${\times}$$^{-10}$ mbar-l/s, 13.5$\pm$9.8${\times}$$^{-10}$ mbar-l/s and 18.5$\pm$9.9${\times}$$^{-10}$ mbar-l/s, respectively, for an identical package chamber volume of 6.89$\pm$0.2${\times}$$^{-10}$. In the critical pressure test, no fracture is found in the bonded specimens up to the applied pressure of 1$\pm$0.1MPa, resulting in the minimum bonding strength of 3.53$\pm$0.07MPa. We find that the present on-chip packaging using a closed AuSn solder-line shows strong potential for hermetic MEMS packaging with interconnection-line due to the hermetic seal performance and the shorter bonding time for mass production.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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• pp.163-166
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• 2002

For the development of an all composite unmanned aerial vehicle (UAV), manufacturing consideration in design phase, works for composite parts fabrication, subassembly and final assembly are summarized. In design phase, to maximize the advantage of composite material, manufacturing processes such as cocuring, cobonding and secondary bonding are introduced. For the curing of designed parts, composite tools are designed and manufactured. Assembly jigs are designed to satisfy dimensional tolerance of the structure. Inspection criteria are established and applied to the manufacturing. Technical data about inspection items and methods are summarized as manufacturing specifications for the mass production of the UAV structure.

• Structural Engineering and Mechanics
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• 제44권2호
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• pp.257-266
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• 2012

Walls are the most important vertical load-carrying elements of masonry structures. Their bond designs are different from one country to another. This paper presents the shear effects of some structural bond designs commonly used for masonry walls. Six different bond designs are considered and modeled using finite element procedures under lateral loading to examine the shear behavior of masonry walls. To obtain accurate results, finite element models are assumed in the inelastic region. Crack development patterns for each wall are illustrated on deformed meshes, and the numerical results are compared.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2001년도 학술논문발표회
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• pp.22-27
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• 2001

The purpose of this study is development of dry floor tile method that practically used for improving wet method's defect, with resin mat design. PE resin used mat which satisfied with bonding test, waterproof test, resistance to chemical attack test, resistance to impact test and freezing and thawing test is confirmed the basic property.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.69-73
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• 2008

본 연구에서는 리드-온-칩 패키징 기술을 이용한 반도체 제품에서 디바이스의 패드의 위치가 온도변화로 인한 신뢰성 문제에 대단히 중요하다는 것을 보여준다. 컴퓨터를 이용한 이론적 계산 및 실험을 통해 패시베이션 파손으로 대변되는 신뢰성 문제가 디바이스의 코너 부위에 위치한 패턴에서 가장 심하게 발생할 수 있다는 것을 보여준다. 따라서, 패시베시션 파손 등으로 인한 디바이스의 신뢰성 저하를 예방하기 위해서는 취약한 패드 부위는 다바이스의 테두리 부위보다는 중앙부위에 위치하도록 설계하는 것이 바람직하다는 것을 본 연구에서는 지적하고 있다.

• Structural Engineering and Mechanics
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• 제9권5호
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• pp.491-504
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• 2000

A convenient method for enhancing the strength and stiffness of existing reinforced concrete beams is to bond adhesively steel plates to their tension faces. However, there is a limit to the applicability of tension face plating as the tension face plates are prone to premature debonding and, furthermore, the addition of the plate reduces the ductility of the beam. An alternative approach to tension face plating is to bond adhesively steel plates to the sides of reinforced concrete beams, as side plates are less prone to debonding and can allow the beam to remain ductile. Debonding at the ends of the side plates due to flexural forces, that is flexural peeling, is studied in this paper. A fundamental mathematical model for flexural peeling is developed, which is calibrated experimentally to produce design rules for preventing premature debonding of the plate-ends due to flexural forces. In the companion paper, the effect of shear forces on flexural peeling is quantified to produce design rules that are applied to the strengthening and stiffening of continuous reinforced concrete beams.

• Journal of Welding and Joining
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• 제29권1호
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• pp.46-51
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• 2011

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권4호
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• pp.443-450
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• 2014

This paper presents a 20-Gb/s optical receiver circuit fabricated with standard 65-nm CMOS technology. Our receiver circuits are designed with consideration for parasitic inductance and capacitance due to bonding wires connecting the photodetector and the circuit realized separately. Such parasitic inductance and capacitance usually disturb the high-speed performance but, with careful circuit design, we achieve optimized wide and flat response. The receiver circuit is composed of a transimpedance amplifier (TIA) with a DC-balancing buffer, a post amplifier (PA), and an output buffer. The TIA is designed in the shunt-feedback configuration with inductive peaking. The PA is composed of a 6-stage differential amplifier having interleaved active feedback. The receiver circuit is mounted on a FR4 PCB and wire-bonded to an equivalent circuit that emulates a photodetector. The measured transimpedance gain and 3-dB bandwidth of our optical receiver circuit is 84 $dB{\Omega}$ and 12 GHz, respectively. 20-Gb/s $2^{31}-1$ electrical pseudo-random bit sequence data are successfully received with the bit-error rate less than $10^{-12}$. The receiver circuit has chip area of $0.5mm{\times}0.44mm$ and it consumes excluding the output buffer 84 mW with 1.2-V supply voltage.