• 마이크로전자및패키징학회지
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• 제23권1호
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• pp.11-15
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• 2016

유기발광다이오드(orgianic light emitting diodes, OLEDs)는 대형 유연 디스플레이와 발광원으로서 사물인터넷 (IoT)의 하드웨어 기기 등 다양한 분야에서 연구가 진행되고 있다. 그러나 낮은 일함수의 금속 및 쉽게 반응하는 유기재료 자체의 특성으로 인하여 외부환경에 매우 취약한 단점을 가지고 있으며 특히, 수분과 산소에 민감하여 외부와의 접촉 시 성능이 급속도로 저하되는 현상을 나타내게 된다. 이를 방지하기 위해 PVD, CVD, ALD 와 같은 방법으로 보호막 형성 연구를 진행 중에 있지만 복잡한 공정 및 높은 비용의 문제점 등이 있다. 그러므로 외부 환경에 의한 성능 저하를 차단해주는 저렴하고 단순한 공정의 페시베이션(passivation) 박막 기술 개발이 매우 중요하다. 본 연구에서는 유기발광다이오드의 수명 향상을 위하여 스핀코팅(spin-coating) 방법으로 녹색 유기발광다이오드 소자 위에 조성비에 따른 페시베이션 박막을 형성한 후 녹색 유기발광다이오드의 휘도특성 변화를 조사하였다. 페시베이션 용액은 poly vinyl alcohol (PVA)를 기반으로 sodium alginate (SA)를 0, 10, 20, 40 wt%의 조성비로 제조하였으며, 40 wt%의 조성비에서 가장 좋은 배리어 보호 특성을 나타내었다. 최종적으로 PVA + SA 용액의 최적화된 페시베이션 보호막을 제작할 수 있었다.

• 한국정보통신학회논문지
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• 제10권9호
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• pp.1663-1670
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• 2006

펄스 전기증착법에 의해 단결정 Fe 박막을 n-Si(111) 기판위에 직접 성장시켰다. CV 분석 을 통해 $Fe^{2+}n-Si(111)$ 계면은 쇼트키 장벽 형성에 따른 다이오드 특성을 가진다는 사실을 알 수 있었다. 또한 인가 전압에 따른 전기용량의 변화를 보여주는 Mott-Schottky chottky(MS) 관계식을 이용하여 전해질 내에서 n-Si(111) 기판의 flat-band potential(EFB)을 조사하였으며, 0.1M $FeCl_2$ 전해질 내에서 EFB와 산화-환원 전위는 각각 -0.526V 과 -0.316V 임을 알 수 있었다. Fe/n-Si(111) 계면반응 시, Fe 증착 초기 단계에서의 핵 형성과 성장 운동학은 과도전류 특성을 이용하여 조사하였으며, 과도전류 특성을 통해 Fe 박막의 성장모드는 "instantaneous nucleation and 3-dimensional diffusion limited growth"임을 알 수 있었다. 주파수가 300Hz, 최대 전압이 1.4V인 펄스 전압을 이용하여 n-Si(111) 기판위에 Fe를 직접 전기 증착 시켰으며, 형 성 된 Fe 박막은 단결정 ${\alpha}-Fe$로 Si 기판위에 ${\alpha}-Fe(110)/Si(111)$의 격자 정합성을 가지고 성장하였음을 XRD 분석을 통해 확인하였다.

• 한국표면공학회지
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• 제49권2호
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• pp.166-171
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• 2016

Cathodic protection is widely recognized as the most cost effective and technically appropriate corrosion prevention methodology for the port, offshore structures, ships. When applying the cathodic protection method to metal facilities in seawater, on the surface of the metal facilities a compound of calcium carbonate($CaCO_3$) or magnesium hydroxide($Mg(OH)_2$) films are formed by $Ca^{2+}$ and $Mg^{2+}$ ions among the many ionic components dissolving in the seawater. And calcareous deposit films such as $CaCO_3$ and $Mg(OH)_2$ etc. are formed by the surface of the steel product. These calcareous deposit film functions as a barrier against the corrosive environment, leading to a decrease in current demand. On the other hand, the general calcareous deposit film is a compound like ceramics. Therefore, there may be some problems such as weaker adhesive power and the longer time of film formation uniting with the base metal. In this study, we tried to determine and control the optimal condition through applying the principle of cathodic current process to form calcareous deposit film of uniform and compact on steel plate. The quantity of precipitates was analyzed, and both the morphology, component and crystal structure were analyzed as well through SEM, EDS and XRD. And based on the previous analysis, it was elucidated mechanism of calcareous deposit film formed in the sacrificial anode type (Al, Zn) and current density (1, 3, $5A/m^2$) conditions. In addition, the taping test was performed to evaluate the adhesion.

• Current Photovoltaic Research
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• 제2권1호
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• pp.8-13
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• 2014

ZnSe/$Zn_3P_2$ heterojunctions with a substrate configuration were fabricated using a series of cost-effective processes. Thin films of ZnTe and $Zn_3P_2$ were successively grown by close-spaced sublimation onto Mo-coated glass substrates. ZnSe layers thinner than 100nm were formed by annealing the $Zn_3P_2$ films in selenium vapor. Surface selenization generated a high density of micro-cracks which, along with voids, provided shunt paths and severely deteriorated the diode characteristics. Annealing the $Zn_3P_2$ film at $300^{\circ}C$ in a $ZnCl_2$ atmosphere before surface selenization produced a dense microstructure and prevented micro-crack generation. The mechanism of micro-crack generation by the selenization was described and the suppression effect of $ZnCl_2$ treatment on the micro-crack generation was explained. ZnSe/$Zn_3P_2$ heterojunctions with low leakage current ($J_0$ < $1{\mu}A/cm^2$) were obtained using an optimized surface selenization process with $ZnCl_2$ treatment. However, the series resistance was very high due to the presence of an electrical barrier between the ZnTe and $Zn_3P_2$ layers.

• 센서학회지
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• 제28권6호
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• pp.402-406
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• 2019

Recently, semiconducting organic materials have been spotlighted as next-generation electronic materials based on their tunable electrical and optical properties, low-cost process, and flexibility. However, typical organic semiconductor materials are vulnerable to moisture and oxygen. Therefore, an encapsulation layer is essential for application of electronic devices. In this study, SiN_x thin films deposited at process temperatures below 150 ℃ by plasma-enhanced chemical vapor deposition (PECVD) were characterized for application as an encapsulation layer on organic devices. A single structured SiN_x thin film was optimized as an organic light-emitting diode (OLED) encapsulation layer at process temperature of 80 ℃. The optimized SiN_x film exhibited excellent water vapor transmission rate (WVTR) of less than 5 × 10^-5 g/㎡·day and transmittance of over 87.3% on the visible region with thickness of 1 ㎛. Application of the SiN_x thin film on the top-emitting OLED showed that the PECVD process did not degrade the electrical properties of the device, and the OLED with SiN_x exhibited improved operating lifetime

• 한국진공학회지
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• 제9권2호
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• pp.110-115
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• 2000

열-필라멘트 CVD 장치를 이용하여 다이아몬드 박막의 증착 조건을 최적화시켰다. $B_4C $ 고체 펠렛을 사용하여 보론두핑된 다이아몬드 박막을 제조하여 그 질적 특성을 알아보고, 전류전압 특성과 전계 방출 측정을 통해 박막의 전계방출소자(field emission display (FED)로의 특성을 조사하였다. 보론 도핑의 양이 증가함에 따라 다이아몬드 결정의 평균 입자 크기가 조금씩 감소하지만 다이아몬드의 질은 소량 도핑인 경우에 크게 바뀌지 않았다. Al/Diamond/p-Si 소자의 전류전압 특성을 조사한 결과 도핑된 다이아몬드 박막의 전류는 도핑되지 않은 박막의 전류에 비해 $10^4$~$10^5$배 정도 증가하였다. 전계방출 특성을 조사한 결과 보론-도핑이 증가함에 따라 점차 낮은 전기장에서 전자를 방출하며, 또한 높은 방출 전류를 나타냈다. 전자가 방출되기 시작하는 onset-field는 펠렛의 수가 2개일 때 15.5 V/$\mu\textrm{m}$, 3개일 때 13.6 V/$\mu\textrm{m}$, 4개일 때는 11.1 V/$\mu\textrm{m}$. 체계적으로 감소하였다. 도핑의 강도가 세어짐에 따라 Fowler-Nordheim 그래프의 기울기는 감소하는 경향을 보였으며, 이로서 보론 도핑으로 인해 유효 장벽 에너지가 감소되어 전자 방출 특성이 향상됨을 알 수 있었다.

• 폴리머
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• 제37권5호
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• pp.618-624
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• 2013

Trimellitic anhydride chloride와 hydroquinone을 이용하여 hydroquinone bis(trimellitate anhydride)(HQ-TA)를 합성하였다. 합성된 HQ-TA와 6가지의 다양한 디아민들을 사용하여 전구체 polyamic acid(PAA)를 합성한 후, 열적-및 화학적-이미드화 반응을 거쳐 에스터 그룹을 가지는 폴리이미드(polyimide, PI) 필름을 합성하였다. PI 합성은 구조적으로 다양한 방향족 디아민을 사용하였다. 각 디아민 구조에 따른 유리전이온도($T_g$)는 167-$215^{\circ}C$를 보였고, 초기분해온도(${T_D}^i$)는 $364-451^{\circ}C$를 나타내었다. 가장 향상된 열팽창 계수(coefficient of thermal expansion, CTE)와 가스차단성은 TFB(3.23 $ppm/^{\circ}C$)와 4,4-ODA(< $10^{-2}cc/m^2/day$) 단량체를 각각 사용하였을 때 보였다. PI 필름의 투과도는 500 nm에서 65-89%를 보였으며, 노란색 정도를 나타내는 황색지수(yellow index, YI)는 3.01-69.52를 보였다.

• 한국표면공학회지
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• 제50권6호
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• pp.531-535
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• 2017

Enormous amount of waste oyster-shell (OS) has a major disposal problem in coastal regions. OSs have attracted much attention for recycling, because these are mainly composed of calcium carbonate with rare impurities. In this study, we demonstrate the calcareous deposit films on steel plate by using OSs on the basic of cathodic protection technique. The composition of the OSs was analyzed by wavelength dispersive X-ray fluorescence spectrometer. Carbon dioxide gas was pumped into distilled water to make carbonic acid solution for dissolution of OS. The calcareous deposit was characterized by second electron microscope (SEM), energy dispersive X-ray analysis (EDX) and X-ray diffraction. Corrosion rates were estimated by measurements of anodic polarization and immersion test. It is confirmed that calcareous deposits on steel plate are formed under all condition of cathodic protection by using waste OS from the SEM and EDX results. Calcareous deposits on steel by OS provide good corrosion resistance by acting as a barrier to oxygen supply to the steel surface.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.138-143
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• 2022

We analyzed the influence of post-annealing on Ga₂O₃/n-type 4H-SiC heterojunction diode. Gallium oxide (Ga₂O₃) thin films were deposited by radio frequency (RF) sputtering. Post-deposition annealing at 950℃ in an Oxygen atmosphere was performed. The material properties of Ga₂O₃ and the electrical properties of the diodes were investigated. Atomic Force Microscopy (AFM), X-Ray Diffraction and Scanning Electron Microscope (SEM) images show a significant increase in the roughness and crystallinity of the O₂-annealed films. After Oxygen annealing X-ray Photoelectron Spectroscopy (XPS) shows that the atomic ratio of oxygen increases which is related to a decrease in oxygen vacancy within the Ga₂O₃ film. The O₂-annealed diodes exhibited higher on-current and lower leakage current. Moreover, the ideality factor, barrier height, and thermal activation energy were derived from the current-voltage curve by increasing the temperature from 298 - 434K.

• 한국초전도ㆍ저온공학회논문지
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• 제9권3호
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• pp.5-8
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• 2007

All three buffer layers of $Y_2O_3$, YSZ, and $CeO_2$ have been deposited on the biaxially textured metal substrates using rf-sputtering method, The first 50-70nm thick $Y_2O_3$ films were grown epitaxially on biaxially textured metal substrates as a seed layer and followed by the diffusion barrier ${\sim}100nm$ thick YSZ and subsequent capping layer ${\sim}200nm$ thick $CeO_2$ deposited epitaxially on top of $Y_2O_3$ seed layer. The epitaxial orientation of all three layers were all (100) grown with rocking curve Full Width at Half Maximum(FWHM) of $4-5^{\circ}$ and in plane phi-scan FWHM of $6-8^{\circ}$ using X -ray diffraction analysis. The NiO phases formed during the $Y_2O_3$ seed layer deposition seem to degrade the crystallinity and roughen the surface morphology of the following layer observed by AFM(Atomic Force Microscopy). The buffered tapes were used as substrates for long length YBCO coated conductors with high critical current density $J_c$. The five multi-turn of metal tapes was employed to increase the thickness of films and production rate to compensate the low growth rate of rf-sputtering method.