• Title/Summary/Keyword: anodizing

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Fabrication of Microchanneled Reformer for Portable Fuel Cell (이동형 연료전지용 마이크로 채널 개질기 제작)

  • Yu, S.P.;Lim, S.D.;Lee, W.K.;Kim, C.S.
    • Transactions of the Korean hydrogen and new energy society
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    • v.16 no.4
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    • pp.350-355
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    • 2005
  • 소형 PEMFC(Proton Exchange Membrane Fuel Cell)는 전기를 만들기 위해서 고순도의 수소를 필요로 한다. 각각의 마이크로 성형된 금속박판(스테인레스 스틸, 알루미늄)을 진공 브레이징법으로 접합하여 수소공급용 소형 개질기를 제작하였다. 마이크로 채널의 내부는 졸-겔법(스테인레스 스틸)과 양극산화법(알루미늄)으로 촉매를 지지하기 위한 다공성 $Al_2O_3$ 층을 형성시켰다. 스테인레스 스틸 박판은 에칭과 브레이징에 유리하였으나, 표면산화층 코팅을 균일하게 하여 안정적인 촉매반응을 유도하기 위한 균일한 표면 산화층 형성이 힘들었다. 반면 알루미늄 박판은 표면 산화층 형성이 상대적으로 용이했으며, 촉매를 상하지 않는 낮은 온도에서의 적층이 가능했다.

A Study of Nanoscale Structure of Anodic Porous Alumina film (다공성 알루미나 박막의 나노 스케일 구조에 관한 연구)

  • 정경한;신훈규;권영수
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.9
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    • pp.801-806
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    • 2003
  • In recent years, there has been large interest in the fabrication of the self organized nanoscale structures since not only their potential utilization in electronic, optoelectronic, and magnetic devices but also their fundamental interest such as uniformity and regularization. An attractive candidate of these materials is anodic porous alumina film(Al$_2$O$_3$) which is formed by the anodization of aluminum in an appropriate acid solution. In this study to fabricate the porous alumina film with very uniform and nearly parallel pores the anodization was carried out under constant voltage mode in 0.3M oxalic acid as an electrolyte. The hexagonally ordered arrays with a few $\mu\textrm{m}$ in size two-dimensional polycrystalline structure were obtained of which pore densities were 1.1${\times}$10$\^$10//$\textrm{cm}^2$.

Fabrication of 8 inch Polyimide-type Electrostatic Chuck (폴리이미드형 8인치 정전기척의 제조)

  • 조남인;박순규;설용태
    • Journal of the Semiconductor & Display Technology
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    • v.1 no.1
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    • pp.9-13
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    • 2002
  • A polyimide-type electrostatic chuck (ESC) was fabricated for the application of holding 8-inch silicon wafers in the oxide etching equipment. For the fabrication of the unipolar ESC, core technologies such as coating of polyimide films and anodizing treatment of aluminum surface were developed. The polyimide films were prepared on top of thin coated copper substrates for the good electrical contacts, and the helium gas cooling technique was used for the temperature uniformity of the silicon wafers. The ESC was essentially working with an unipolar operation, which was easier to fabricate and operate compared to a bipolar operation. The chucking force of the ESC has been measured to be about 580 gf when the applied voltage was 1.5 kV, which was considered to be enough force to hold wafers during the dry etching processing. The employment of the ESC in etcher system could make 8% enhancement of the wafer processing yield.

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다공질 실리콘을 이용한 전계 방출 소자

  • 주병권
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.92-97
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    • 2002
  • We establish a visible light emission from porous polycrystalline silicon nano structure(PPNS). The PPNS layer are formed on heavily doped n-type Si substrate. 2um thickness of undoped polycrystalline silicon deposited using LPCVD (Low Pressure Chemical Vapor Deposition) anodized in a HF: ethanol(=1:1) as functions of anodizing conditions. And then a PPNS layer thermally oxidized for 1 hr at $900 ^{\circ}C$. Subsequently, thin metal Au as a top electrode deposited onto the PPNS surface by E-beam evaporator and, in order to establish ohmic contact, an thermally evaporated Al was deposited on the back side of a Si-substrate. When the top electrode biased at +6V, the electron emission observed in a PPNS which caused by field-induces electron emission through the top metal. Among the PPNSs as functions of anodization conditions, the PPNS anodized at a current density of $10mA/cm^2$ for 20 sec has a lower turn-on voltage and a higher emission current. Furthermore, the behavior of electron emission is uniformly maintained.

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Investigation of Cell Behavior on Nanoporous Surface (나노기공 표면에서의 세포 행동양식에 관한 연구)

  • Chung, Sung-Hee;Yoon, Won-Jung;Min, Jun-Hong
    • KSBB Journal
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    • v.27 no.1
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    • pp.45-50
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    • 2012
  • In this paper, we investigated the effect of nanostructure on the cell behaviors such as adhesion and growth rate. Nanoporous structures with various diameters (30, 40, 45, 50, 60 nm) and 500 nm of the depth were fabricated using the anodizing method. The water contact angle of the surface consisting of nanopores with 30 nm diameter was 40 degree and those were 60~70 degree in cases of nanopores with over 40 nm diameter. Hela cells were cultivated on various nanoporous structure surface to investigate the cell behavior on nanostructure. As a result, Hela cells preferred 30 nm diameter nanoporous surface that has lower water contact angle. This result was confirmed by protein adsorption experiment and scanning electron microscope investigation.

Fabrication of a Hydrogenated a-Si Photodiode

  • Hur, Chang-Wu
    • Journal of information and communication convergence engineering
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    • v.1 no.1
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    • pp.23-26
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    • 2003
  • A photodiode capable of obtaining a sufficient photo/dark current ratio at both a forward bias state and a reverse bias state is proposed. The photodiode includes a glass substrate, an aluminum film formed as a lower electrode over the glass substrate, an alumina film formed as a schottky barrier over the aluminum film, a hydrogenated amorphous silicon film formed as a photo conduction layer over a portion of the alumina film, and a transparent conduction film formed as an upper electrode over the hydro-generated amorphous silicon film. Growth of high quality alumina($Al_{2}O_{3}$) film using anodizing technology is proposed and analyzed by experiment. We have obtained the film with a superior characteristics

Optimization of Pretreatment Conditions for Ti Surface in the Low Voltage PEO Anodization Process (저전압 PEO 양극산화 공정을 위한 Ti 전처리 조건의 최적화 연구)

  • Ha, Dongheun;Choi, Jinsub
    • Journal of the Korean institute of surface engineering
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    • v.50 no.6
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    • pp.439-446
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    • 2017
  • Plasma electrolyte oxidation (PEO) is a kind of anodization, in which a very high voltage or current is applied to a metal substrate in various electrolytes, allowing distinctly thick thickness of the oxide film with outstanding film properties, such as a good corrosion resistance, mechanical strength, thermal stability, and excellent adhesion to a substrate. Herein, we tried to find the optimal pretreatment conditions among commercially available solutions in order to produce PEO anodizing at relatively low voltage. We characterized the surface morphologies of the sample by scanning electron microscope (SEM), atomic force microscopy (AFM), and investigated color parameters of the pretreated surface of Ti by spectrophotometer.

Fabrication of Plasma Electrolytic Oxidation Coatings on Magnesium AZ91D Casting Alloys

  • Lee, Sung-Hyung;Yashiro, Hitoshi;Kure-Chu, Song-Zhu
    • Journal of the Korean institute of surface engineering
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    • v.50 no.6
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    • pp.432-438
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    • 2017
  • AZ91D casting alloy requires an advanced plasma anodizing processing because large amount of defects are liable to generate during anodization. In this study, plasma electrolytic oxidation (PEO) of AZ91D Mg alloy was conducted by the application of either constant voltage or current using a pulse mode and its effects on pore formation, surface roughness and corrosion resistance were investigated. The PEO films showed a three-layer structure. The PEO film thickness was found to increase linearly with voltage. The surface roughness, Ra, ranged between $0.2{\mu}m$ and $0.3{\mu}m$. The corrosion resistance increased from RN 3.5 to 9.5 by the PEO treatment when evaluated according to the 72 hour salt spray test. The PEO-treated surface exhibited higher pitting potential than the raw material.

Novel Methods for Measuring the Surface Hardness of Anodic Oxide Films on Aluminum Alloy (알루미늄 합금 양극산화피막의 표면경도 측정법)

  • Moon, Sungmo
    • Journal of the Korean institute of surface engineering
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    • v.53 no.1
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    • pp.36-42
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    • 2020
  • In this study, two novel methods to measure the surface hardness of anodic oxide films on aluminum alloys are reported. The first method is to impregnate oil-based ink into pores in the anodic oxide film and then to clean the ink on the surface using ethanol, resulting in an impregnation of inks only inside of the pores in anodic oxide film. The second method is to coat the anodic oxide film surface with thin Au layer less than 0.1 ?. Both the ink-impregnating method and Au-coating method provided clear indentation marks on the anodic oxide film surface when it was indented using a pyramidal-diamond penetrator. Thus, Vickers hardness of anodic oxide films on aluminium alloy could be measured successfully and precisely from the anodic film surface. In addition, advantages and disadvantages of the ink-impregnating method and Au-coating method for the measurement of surface hardness of anodic oxide films are discussed.

A Study on the Properties of Anodic Oxide Films Formed on Al Alloys in Oxalic Acid (알루미늄 합금 소재의 옥살산 아노다이징 피막 물성 연구)

  • Jeong, Nagyeom;Park, Jihyun
    • Journal of the Korean institute of surface engineering
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    • v.53 no.5
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    • pp.249-256
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    • 2020
  • As the size of manufacturing equipment for LCD and OLED displays increases, replacement of existing heavy stainless steel components with light metals, such as aluminum alloys, is being more important in semiconducting and display manufacturing industries. To use aluminum alloys for components in semiconducting and display industries, it is important to develop a new anodization method for improved performance of anodic oxide films than conventional anodization method based on sulfuric acid. In this work, optimum applied current density and the best sealing methods for anodic oxide films in 3% oxalic acid were explored. Experimental results showed 2.5 A/dm2 is the best applied current density for improved hardness and dielectric breakdown voltage. Sealing of the anodic oxide films further improved their hardness, dielectric breakdown voltage and resistance to HCl, by which application of anodic oxide films become applicable for components in semiconducting and display industries.