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http://dx.doi.org/10.5695/JKISE.2020.53.5.249

A Study on the Properties of Anodic Oxide Films Formed on Al Alloys in Oxalic Acid  

Jeong, Nagyeom (R&D center, YKMC Inc.)
Park, Jihyun (R&D center, YKMC Inc.)
Publication Information
Journal of the Korean institute of surface engineering / v.53, no.5, 2020 , pp. 249-256 More about this Journal
Abstract
As the size of manufacturing equipment for LCD and OLED displays increases, replacement of existing heavy stainless steel components with light metals, such as aluminum alloys, is being more important in semiconducting and display manufacturing industries. To use aluminum alloys for components in semiconducting and display industries, it is important to develop a new anodization method for improved performance of anodic oxide films than conventional anodization method based on sulfuric acid. In this work, optimum applied current density and the best sealing methods for anodic oxide films in 3% oxalic acid were explored. Experimental results showed 2.5 A/dm2 is the best applied current density for improved hardness and dielectric breakdown voltage. Sealing of the anodic oxide films further improved their hardness, dielectric breakdown voltage and resistance to HCl, by which application of anodic oxide films become applicable for components in semiconducting and display industries.
Keywords
Aluminum; Oxalic acid anodizing; Hardness; Dielectric breakdown; Acid resistance;
Citations & Related Records
Times Cited By KSCI : 7  (Citation Analysis)
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