• Journal of the Korean Society of Clothing and Textiles
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• v.13 no.3 s.31
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• pp.286-294
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• 1989

This Study has treated the effects of fiber, surfactants, temperature, surfactant concentration, pH, electrolyte, fatty acid contents and mechanical force on the removal of particulate soil from fabric, vacuum cleaner dirt was used as model particulate soil. The fabrics were soiled with mixture of vacuum cleaner dirt and fatty soil, and washed in Terg-O-tometer. The detergency was evaluated by measuring reflectance of a fabric before and after washing. The results were as follows. 1. The fiber type showed a different pattern of soil removal with surfactants. In general, particulate soil removal increased in the following order Acetate>PET. Nylon>Cotton. Particulate soil removal, which is affected by the surfactant type, increased in the following order NPE $(EO)_{10}\leqq$Soap>SLS>DBS>Tween 80. 2. The influence of temperature on the particulate soil removal was very complex because efficiency of removal was varied with surfactant and fiber types. The washing efficiency of NPE $(EO)_{10}$ was highest at around $40^{\circ}C\;and\;60^{\circ}C$ with cotton and PET but the washing efficiency of DBS was the highest at $60^{\circ}C$ with cotton, decreased monotonously with increasing temperature with PET 3. The detergency of particulate soil increased with increasing surfactant concentration at relatively low concentration and then levelled off above some optimum concentration. 4. The removal of particulate soil increased with increasing pH and mechanical force. 5. Effect of electrolyte on the particulate soil removal was depended on the concentration of the surfactant. At low concentration of surfactant, addition of electrolytes improved soil removal but above the some concentration no effect was observed. At high concentration of surfactant, Vie., $0.6\%$ , the maximum washing effect is reached without added electrolyte. These result indicate that added electrolyte only influence the adsorption of surfactant on the soil and fiber 6. Fatty acid content in the soil did not influence on particulate soil removal without regard to surfactants.

• The Journal of Advanced Prosthodontics
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• v.7 no.4
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• pp.303-311
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• 2015

PURPOSE. The aim of this study was to compare the changes in retentive force of stud attachments for implant overdentures by in vitro 2-year-wear simulation. MATERIALS AND METHODS. Three commercially available attachment systems were investigated: Kerator blue, O-ring red, and EZ lock. Two implant fixtures were embedded in parallel in each custom base mounting. Five pairs of each attachment system were tested. A universal testing machine was used to measure the retentive force during 2500 insertion and removal cycles. Surface changes on the components were evaluated by scanning electron microscopy (SEM). A Kruskal-Wallis test, followed by Pairwise comparison, was used to compare the retentive force between the groups, and to determine groups that were significantly different (${\alpha}$<.05). RESULTS. A comparison of the initial retentive force revealed the highest value for Kerator, followed by the O-ring and EZ lock attachments. However, no significant difference was detected between Kerator and O-ring (P>.05). After 2500 insertion and removal cycles, the highest retention loss was recorded for O-ring, and no significant difference between Kerator and EZ lock (P>.05). Also, Kerator showed the highest retentive force, followed by EZ lock and O-ring, after 2500 cycles (P<.05). Based on SEM analysis, the polymeric components in O-ring and Kerator were observed to exhibit surface wear and deformation. CONCLUSION. After 2500 insertion and removal cycles, all attachments exhibited significant loss in retention. Mechanism of retention loss can only be partially explained by surface changes.

• Tribology and Lubricants
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• v.34 no.3
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.167-172
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• 2006

Submicron colloidal silica coated with ceria were prepared by mixing of silica and nano ceria particles and modified by hydrothermal reaction. The polishing efficiency of the ceria coated silica slurry was tested over oxide film on silicon wafer. By changing the polishing pressure in the range of $140{\sim}420g/cm^2$ with the ceria coated silica slurries in $100{\sim}300nm$, rates, WIWNU and friction force were measured. The removal rate was in the order of 200, 100, and 300 nm size silica coated with ceria. It was known that the smaller particle size gives the higher removal rate with higher contact area in Cu slurry. In the case of oxide film, the indentation volume as well as contact area gives effect on the removal rate depending on the size of abrasives. The indentation volume increase with the size of abrasive particles, which results to higher removal rate. The highest removal rate in 200 nm silica core coated with ceria is discussed as proper combination of indentation and contact area effect.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.700-705
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• 2003

In this paper, an extended process model is proposed for the application of flexible belt grinding equipment as utilized in robotic grinding. The analytical and experimental results corresponding to grinding force, material removal rate (MRR) and contact area in the robotic grinding shows the difference between the conventional grinding and the flexible robotic grinding. The process model representing the relationship between the material removal and the normal force acting at the contact area has been applied to robotic programming and control. The application of the developed model in blade grinding demonstrates the effectiveness of proposed process model.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.11
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• pp.1807-1812
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• 2004

The application of chemical mechanical polishing(CMP) has a long history. Recently, CMP has been used in the planarization of the interlayer dielectric(ILD) and metal used to form the multilevel interconnections between each layers. Therefore, much research has been conducted to understand the basic mechanism of the CMP process. CMP performed by the down force and the relative speed between pad and wafer with slurry is typical tribo-system. In general, studies have indicated that removal rate is relative to energy. Accordingly, in this study, CMP results will be analyzed by a viewpoint of the friction energy using friction force measurement. The results show that energy would not constant in the same removal rate conditions

• Maxillofacial Plastic and Reconstructive Surgery
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• v.14 no.4
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• pp.327-339
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• 1992

This study was undertaken to investigate the effect of orthognathic surgery on occlusal force. The maximum bite force was measured in 26 dentofacial deformity patients, aged 14-26(mean age 20.3) years, before surgery and at IMF removal, 3, 6, and 12months postsurgery. To grope the correlation of bite force and skeletal change after orthognathic surgery, the cephalometric headplates were measured, tabulated and statistically analyzed. The results were as follows. 1. The presurgical maximum bite force was 13.7kg in upper first molar(rt. Side 12.7kg, it. Side 14.6kg). There was remarkable difference with that of normal occlusion. 2. The recovery of bite force was very significant in according to the operation method and the duration of IMF that was 7.6kg at IMF removal, 14.2kg at 3 months, 19.7kg at 6 months. 26.1kg at 12 months postsurgery. 3. To fasten the recovery and to increase the bite force after orthognathic surgery, the long IMF time and the injury to the masticatory muscle should be avoided by the internal rigid fixation and early physical exercise. 4. The bite force was positively correlated to the changes of mandibular plane angle, the angle between platatal plane and mandibular plan, the angle between occlusal plane and mandibular plane, and negatively correlated to the changes of mandibular body length in craniofacial structure. 5. There was no correlationship between bit force and mesial inclination of tooth long axis of first molar in this subject. 6. There was no correlation between the changes of bite force and the changes of mechanical advantage of the temporal and masseter muscle.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1304-1307
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• 2004

실제 Cu CMP 공정이 진행되는 동안 연마입자의 응집현상을 관찰하긴 어렵다. 따라서 본 연구에서는 인위적으로 첨가한 large particle들이 공정 중에 발생하는 응집입자라 가정하고 각 공정에 따른 연마속도와 friction force를 측정하여 large particle을 첨가하지 않은 슬러리와 비교 평가해보았다. large particle을 첨가한 슬러리의 경우에 각 공정변수에 따라 연마속도와 friction force가 작아짐을 관찰하였다. 즉, 슬러리 내에 응집현상이 발생하게 된다면 large particle이 연마의 방해 인자로 나타남을 관찰 할 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1312-1315
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• 2004

Chemical Mechanical Polishing is referred to as a three body tribological system, because it includes two solids in relative motion and the slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason of not only the friction force but also material removal during polishing. The friction force generated by the abrasives was inspected with the change of abrasive size and concentration in this paper. The variation of coefficient of friction with abrasive concentration and size could result from the condition of contact and load balance between wafer and abrasives carried by pad asperity. The simulation was performed in this paper and compared with the result of experiment. The material removal rate also estimated with abrasive concentration and size increasement.

• Journal of Periodontal and Implant Science
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• v.30 no.2
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• pp.429-442
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• 2000

Based on current evidence in the literature, it is known that endotoxin is a weakly adherent surface phenomenon and that power-driven instruments can be used to accomplish definitive root detoxification and maximal wound healing without overinstrumentation of root and without extensive cementum removal. And one of the newly developed curette tips used with low power of piezoelectric ultrasonic scaler, is effective to remove calculus and not to remove the excessive cementum. The purpose of this study is therefore, to assess the influence of ultrasonic power and various working parameters on root substitute removal when instrumentation is performed with the curette tip on piezoelectric ultrasonic scaler. This study assessed defect depth, width and area resulting from instrumentation using a piezoelectric ultrasonic scaler with a curette type tip in vitro to acrylic resin block as a root substitute. The working parameters was standardized by the sledge device which controls lateral force(0.5 N, 1 N, 2 N) and instrumentation time(5 sec, 10 sec, 20 sec) and power setting was adjusted 0,2,4,8 in P mode. Power setting had the greatest influence on defect depth compared to lateral force and instrumentation time(standardized regression parameter estimates${\pm}$standard error, $0.37{\pm}0.02$, $0.19{\pm}0.02$, $0.07{\pm}0.02$). The effects on defect area also greatest for power setting($0.57{\pm}0.03$) compared to lateral force and instrumentation time($0.33{\pm}0.03$, $0.12{\pm}0.03$). The effect of the power setting on the defect width($0.15{\pm}0.01$) is not so great as defect depth or defect area compared to lateral force($0.12{\pm}0.01$) and effect of instrumentation time is minimal($0.02{\pm}0.01$). It could be concluded that the power setting has the greatest influence on the defect depth and area in curette type tip with low power of piezoelectric ultrasonic device. Many parameters can be adjusted in various situation in clinical use of piezoelectric ultrasonic scaler but the power setting is the first parameter to be adjusted.