Effects of Friction Energy on Polishing Results in CMP Process |
Lee, Hyun-Seop
(부산대학교 정밀기계공학과)
Park, Boum-Young (부산대학교 정밀기계공학과) Kim, Goo-Youn (부산대학교 정밀기계공학과) Kim, Hyoung-Jae (부산대학교 정밀기계공학과) Seo, Heon-Deok (부산대학교 정밀기계공학과) Jeong, Hae-Do (부산대학교 기계공학부) |
1 | Wonseop Choi, Seung-Mahn Lee and Rajiv K. Singh, 2001, 'Effects of particle concentration in CMP,' Mat. Res. Soc. Symp. Proc. Vol. 671, pp. M5.1.1-M5.1.6 |
2 | Ara Philipossian and Erin Mitchell, 2004, 'Mean Residence Time and Removal Rate Studies in ILD CMP, 'Journal of The Electrochemical Socirty, 151 (6) G402-G407 DOI ScienceOn |
3 | SILKDER, A.K., FRANK GIGLIO, JOHN WOOD, ASHOK KUMAR, and MARK ANTHONY, 2001, ' Optimization of Tribological Properties of Silicon Dioxide During the Chemical Mechanical Planarization Process,' Journal of ELECTRONIC MATERIALS, Vol. 30, No. 12 DOI |
4 | Bhushan, B., 1999, 'Handbook of micro-nano tribology,' CRC Press Inc, Boca Raton |
5 | Preston, F. W., 1927, J. Soc. Glass Technol., 11, 214 |
6 | Yeau-Ren Jeng, Pay-Yau Huang and Wen-Chueh Pan, 2003, 'Tribological Analysis of CMP with Partial Asperity Contact, ' Journal of The Electrochemical Society, 150 (10) G630-G637 DOI ScienceOn |