• 제목/요약/키워드: air-cooling heat sink

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펠티에 소자를 이용한 냉각성능에 관한 연구 (Investigation of the Cooling Performance Using Pottier Module)

  • 이상일;최진욱;이동렬
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2006년도 하계학술발표대회 논문집
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    • pp.1156-1161
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    • 2006
  • This study is to evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital $LabView^{TM}$ measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module.

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강제대류에서 펠티에 소자를 이용한 내부터널 구조를 가지는 히트싱크에 관한 연구 (A Study on the Heat Sink with internal structure using Peltier Module in the Forced Convection)

  • 이민;김태완
    • 한국산학기술학회논문지
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    • 제15권6호
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    • pp.3410-3415
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    • 2014
  • 전자 장비에서 발생하는 열은 장비의 성능을 저하시킨다. 이러한 장비의 열을 외부로 방출하기 위한 방법으로 히트싱크가 사용된다. 본 연구에서는 내부터널의 형상을 가지는 히트싱크에 대한 냉각 및 히팅성능을 강제대류 상태에서 열전달 특성에 대하여 고찰하였다. 또한, 시간에 따른 히트싱크의 열전달 특성 및 온도분포의 변화에 따른 실험을 수행하였다. 냉각실험에서 전압이 10V일 때, A형상이 B형상 보다 온도가 낮게 나타났고, 가장 좋은 냉각효과를 나타내었다. 히팅실험에서 전압이 13V일 때, 온도가 A형상이 B형상 보다 높게 나타났고, A형상이 효율이 더 좋은 것으로 판단된다.

에너지슬래브 적용 지열원 열펌프 시스템의 성능 특성에 관한 실증 연구 (Heating and Cooling Performance of a Ground Coupled Heat Pump System with Energy-Slab)

  • 최종민
    • 설비공학논문집
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    • 제24권2호
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    • pp.196-203
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    • 2012
  • Energy foundations and other thermo-active ground structure, energy wells, energy-slab, and pavement heating and cooling represent an innovative technology that contributes to environmental protection and provides substantial long-term cost savings and minimized maintenance. This paper focuses on earth-contact concrete elements that are already required for structural reasons, but which simultaneously work as heat exchangers. Pipes, energy slabs, filled with a heat carrier fluid are installed under conventional structural elements, forming the primary circuit of a geothermal energy system. The natural ground temperature is used as a heat source in winter and a heat sink in summer. The geothermal heat pump system with energy-slab represented very high heating and cooling performance due to the stability of EWT from energy slab. However, the performance of it seemed to be affected by the atmospheric air temperature.

Thermal-hydraulic study of air-cooled passive decay heat removal system for APR+ under extended station blackout

  • Kim, Do Yun;NO, Hee Cheon;Yoon, Ho Joon;Lim, Sang Gyu
    • Nuclear Engineering and Technology
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    • 제51권1호
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    • pp.60-72
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    • 2019
  • The air-cooled passive decay heat removal system (APDHR) was proposed to provide the ultimate heat sink for non-LOCA accidents. The APDHR is a modified one of Passive Auxiliary Feed-water system (PAFS) installed in APR+. The PAFS has a heat exchanger in the Passive Condensate Cooling Tank (PCCT) and can remove decay heat for 8 h. After that, the heat transfer rate through the PAFS drastically decreases because the heat transfer condition changes from water to air. The APDHR with a vertical heat exchanger in PCCT will be able to remove the decay heat by air if it has sufficient natural convection in PCCT. We conducted the thermal-hydraulic simulation by the MARS code to investigate the behavior of the APR + selected as a reference plant for the simulation. The simulation contains two phases based on water depletion: the early phase and the late phase. In the early phase, the volume of water in PCCT was determined to avoid the water depletion in three days after shutdown. In the late phase, when the number of the HXs is greater than 4089 per PCCT, the MARS simulation confirmed the long-term cooling by air is possible under extended Station Blackout (SBO).

히트싱크를 이용한 전자통신 시스템의 방열설계 프로그램 개발 (Development of Thermal Design Program for an Electronic Telecommunication System Using Heat Sink)

  • 이정환;김종만;전지환;배철호;서명원
    • 대한기계학회논문집B
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    • 제31권3호
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    • pp.256-263
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    • 2007
  • The purpose of this study is to investigate the cooling performance of heat sinks for an electronic telecommunication system by adequate natural convection. Heat generation rates of electronic components and the temperature distributions of heat sinks and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system a program is developed. The program used the graphic user interface environment to determine the arrangement of heat sources, interior fan capacity, and heat sink configuration. The simulation results showed that the heat sinks were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $19^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared. The design program gave good prediction of the effects of various parameters involved in the design of a heat sinks for an electronic telecommunication system.

수평형 지열 히트펌프 시스템의 냉난방 성능 분석 (Performance Analysis of Ground-Coupled Heat Pump System with Slinky-Type Horizontal Ground Heat Exchanger)

  • 손병후
    • 설비공학논문집
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    • 제24권3호
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    • pp.230-239
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    • 2012
  • Ground-coupled heat pump (GCHP) systems utilize the immense renewable storage capacity of the ground as a heat source or sink to provide space heating, cooling, and domestic hot water. The main objective of the present study is to investigate the cooling and heating performance of a small scale GCHP system with horizontal ground heat exchanger (HGHE). In order to evaluate the performance, a water-to-air ground-source heat pump unit connected to a test room with a net floor area of 18.4 m2 and a volume of 64.4 m3 in the Korea Institute of Construction Technology ($37^{\circ}39'N$, $126^{\circ}48'E$) was designed and constructed. This GCHP system mainly consisted of slinky-type HGHE with a total length of 400 m, indoor heat pump, and measuring devices. The peak cooling and heating loads of the test room were 5.07 kW and 4.12 kW, respectively. The experimental results were obtained from March 15, 2011 to August 31, 2011 and the performance coefficients of the system were determined from the measured data. The overall seasonal performance factor (SPF) for cooling was 3.31 while the system delivered heating at a daily average performance coefficients of 2.82.

나노유체를 이용한 열사이폰 히트싱크 (Development of Nanofluidic Thermosyphon Heat Sink)

  • 이석호;신동륜;임택규;이충구;박기호;이욱현
    • 설비공학논문집
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    • 제18권10호
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    • pp.826-834
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    • 2006
  • A heat sink system using nanofluidic thermosyphon for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150 W at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. In the experimental study, the volume concentration of nano particles affect the system performance. Nanofluidic thermosyphon with 0.5% volume concentration showed the best performance. Nanofluid can increase CHF of the system compared with water as a working fluid. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.

다중 PCB 적층 모듈구조의 정보통신용 캐비넷 강제대류 냉각특성 연구 (Forced Convective Cooling Characteristics with Stacked Modules of Multi-PCBs' in Telecommunication Cabinet)

  • 김원태;김광수
    • 설비공학논문집
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    • 제8권2호
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    • pp.230-239
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    • 1996
  • A multi-faceted experimental investigation has been carried out to study the cooling performance for stacked modules in arrays of heat generating rectangular modules deployed along PCB's in the enclosed cabinet. The main parameters which have an important effect on cooling characteristics are flow velocity, channel spacing, installation of fan unit, attachment of heat sink, and acoustic noise. The results of individual effect are very helpful for the electronic packaging designer. In order to improve the cooling performance, it is certain that the enlargement of channel space is obviously effective, while this id disadvantageous in high density electronic packaging. Each of the paameters is quantitatively examined as cooling performance and the correlation of Reynolds number to Nusselt number is compared with previous study.

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포접화합물의 열물성에 미치는 첨가제의 효과 (III) - TMA 물계 포접화합물에 Acetone을 첨가한 경우 - (The Effects of an Additive on the Thermal Properties of a Clathrate Compound (III) - The Case of TMA Clathrate Compound with Acetone -)

  • 김진흥;정낙규;김석현;김창오;강승현
    • 설비공학논문집
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    • 제16권12호
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    • pp.1183-1189
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    • 2004
  • An experimental investigation is conducted to measure phase change temperature and supercooling when acetone is added to TMA 30 wt% clathrate during cooling process in heat source. Also rate of volume change is investigated when acetone is added to TMA 30 wt% clathrate during the cooling process in heat source -8$^{\circ}C$. The results show that phase change temperature is about 4.5~5.5$^{\circ}C$ when acetone is added to TMA 30 wt% clathrate during the cooling process for heat sink temperature of -6, -7$^{\circ}C$ and -8$^{\circ}C$. Supercooling is repressed about 2~1$0^{\circ}C$ when 0.08 wt% acetone is added to it and rate of volume change is decreased about 2.9% when 0.1 wt% acetone is added for the heat sink temperature of -8$^{\circ}C$.

열전소자 및 열전냉각장치의 성능에 관한 연구 (A Study on the Performance of Thermoelectric Module and Thermoelectric Cooling System)

  • 유성연;홍정표;심우섭
    • 설비공학논문집
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    • 제16권1호
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    • pp.62-69
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    • 2004
  • Thermoelectric module is a device that can produce cooling in a direct manner using the electrical energy. The purpose of this study is to investigate the performance of thermoelectric module and cooling system equipped with the thermoelectric module. The performance of a thermoelectric module is estimated using two methods; theoretical analysis based on one-dimensional energy equations and experimental tests using heat source, heat sink and brass conduction extenders. For the thermoelectric cooling system, the temperatures in the chamber are recorded and then compared with those of lumped system analysis. The results show that the cooling capacity and COP of the thermoelectric module increases as the temperature difference between hot and cold surface decreases, and there is particular current at which cooling capacity reaches its maximum value. The experimental results for the thermoelectric cooling system are similar to those of lumped system analysis.