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Development of Nanofluidic Thermosyphon Heat Sink  

Rhi Seok-Ho (School of Mechanical Engineering, Chungbuk National University)
Shin Dong-Ryun (School of Mechanical Engineering, Mongil University)
Lim Taek-Kyu (School of Mechanical Engineering, Chungbuk National University)
Lee Chung-Gu (School of Mechanical Engineering, Chungbuk National University)
Park Gi-Ho (Korea Institute of Energy Research, Building Energy Research Center)
Lee Wook-Hyun (Korea Institute of Energy Research, Building Energy Research Center)
Publication Information
Korean Journal of Air-Conditioning and Refrigeration Engineering / v.18, no.10, 2006 , pp. 826-834 More about this Journal
Abstract
A heat sink system using nanofluidic thermosyphon for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150 W at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. In the experimental study, the volume concentration of nano particles affect the system performance. Nanofluidic thermosyphon with 0.5% volume concentration showed the best performance. Nanofluid can increase CHF of the system compared with water as a working fluid. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.
Keywords
Thermosyphon; Heat sink; Nanofluid;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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