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Development of Thermal Design Program for an Electronic Telecommunication System Using Heat Sink

히트싱크를 이용한 전자통신 시스템의 방열설계 프로그램 개발

  • 이정환 (성균관대학교 대학원 기계공학부) ;
  • 김종만 (성균관대학교 대학원 기계공학부) ;
  • 전지환 (성균관대학교 대학원 기계공학부) ;
  • 배철호 (성균관대학교 대학원 기계공학부) ;
  • 서명원 (성균관대학교 기계공학부)
  • Published : 2007.03.01

Abstract

The purpose of this study is to investigate the cooling performance of heat sinks for an electronic telecommunication system by adequate natural convection. Heat generation rates of electronic components and the temperature distributions of heat sinks and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system a program is developed. The program used the graphic user interface environment to determine the arrangement of heat sources, interior fan capacity, and heat sink configuration. The simulation results showed that the heat sinks were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $19^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared. The design program gave good prediction of the effects of various parameters involved in the design of a heat sinks for an electronic telecommunication system.

Keywords

References

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Cited by

  1. Effects of Symmetrically Arranged Heat Sources on the Heat Release Performance of Extruded-Type Heat Sinks vol.40, pp.2, 2016, https://doi.org/10.3795/KSME-B.2016.40.2.119