• Journal of the Korean institute of surface engineering
• /
• v.36 no.1
• /
• pp.74-78
• /
• 2003

The corrosion failure of electronic devices has been a major reliability concern lately. This failure is an ongoing concern because of miniaturization of integrated circuits (IC) and the increased use of polymers in electronic packaging. Recently, plasma-polymerized cyclohexane films were considered as a possible candidate for a interlayer dielectric for multilever metallization of ultra large scale integrated (ULSI) semiconductor devices. In this paper the protective ability of above films as a function of deposition temperature and RF power in an 3.5 wt.% NaCl solution were examined by polarization measurement. The film was characterized by FTIR spectroscopy and contact angle measurement. The protective efficiency of the film increased with increasing deposition temperature and RF power, which induced the higher degree of cross-linking and hydrophobicity of the films.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.2
• /
• pp.41-48
• /
• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.4
• /
• pp.53-58
• /
• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• Proceedings of the Korean Fiber Society Conference
• /
• 2003.04a
• /
• pp.52-55
• /
• 2003

Poly (ethylene 2, 6-naphthalate) (PEN) has been used for a high performance engineering plastics such as fiber, film, and packaging, because of excellent physical properties and outstanding gas barrier characteristics [1-2]. However, the application of PEN is limited because PEN exhibits a relatively high melt viscosity. Recently, many researches for organic/inorganic composites by applying nano-particles to the polymer matrix have been carried out [3], and the nano-particles exhibited greatly improved mechanical and rheological properties [4]. (omitted)

• Textile Coloration and Finishing
• /
• v.23 no.4
• /
• pp.227-232
• /
• 2011

Zein is a hydrophobic protein produced from maize and has great potential in a number of industrial applications, such as food, food coating and food packaging. To obtain suitable electrospinning conditions for thinner and uniform zein nanofiber mats, a series of experiments was conducted on various volume ratios (v/v) of ethanol/water solutions with different zein concentrations. The prepared zein nanofiber mats were characterized by field emission scanning electron microscopy and contact angle measurements. Uniform zein fibers with a average diameter in the nanometer scale (300~500 nm) could be prepared from 30 wt.% zein in 7/3 (v/v) ethanol/water solutions.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.844-845
• /
• 2006

For microelectronic circuits, the main type of failure is thermal fatigue. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers to meet these requirements. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.10a
• /
• pp.39-45
• /
• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.33-41
• /
• 2010

Crack propagation mechanisms of Sn-3.0Ag-0.5Cu solder were studied in strain controlled push-pull creepfatigue conditions using the fast-fast (pp) and the slow-fast (cp) strain waveforms at 313 K. Transgranular cracking was found in the pp strain waveform which led to the cycle-dominant crack propagation and intergranular cracking in the cp strain waveform that led to the time-dominant crack propagation. The time-dominant crack propagation rate was faster than the cycle-dominant crack propagation rate when compared with J-integral range which resulted from the creep damage at the crack tip in the cp strain waveform. Clear recrystallization around the crack was found in the pp and the cp strain waveforms, but the recrystallized grain size in the cp strain waveform was smaller than that in the pp strain waveform. The cycle-dominant crack propagated in the normal direction to the specimen axis macroscopically, but the time-dominant crack propagated in the shear direction which was discussed in relation with shear micro cracks formed at the crack tip.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.20 no.1
• /
• pp.135-145
• /
• 1996

Order of stress singularities at bonded Edge Corners with two or three dissimilar isotropic Materials is analyzed. The problem is formulated by Mellin transform and characteristic equation is obtained as a determinant of matrix considering boundary conditions. Roots of characterictic equation are determinde by numerical calculations with ward method, from which the order of stress sigularities is obtained. Applying the results to the electronic packaging, the order of stress singularities is obtained. Applying the results to the electronic packaging, the order of stress singularities at bounded edge corners is calculated as a various bouned edge angle with given material combinations. Comparing the results, the optimal material combinaitons of bounded edge corners and bouned edge angle to reduce stress singularity could be determined. It suggests that the results are used to the basic design of electronic packaging reducing the stress singularity.

• The monthly packaging world
• /
• s.251
• /
• pp.112-123
• /
• 2014

세계적인 어획량 감소와 부패하기 쉽고 보관이 어렵다는 수산물의 특성에 따라 수산물의 적절한 가공과 이에 따른 수산물의 포장은 수산물의 상품성과 부가가치를 높일 수 있는 방법으로 최근 새롭게 부각되어 지고 있다. 이러한 환경에서 부산의 수산가공선진화 단지는 수산가공업의 경쟁력 제고 및 활성화를 목적으로 정책적으로 추진되고 있다. 수산가공선진화 단지는 식품 위생 안전시설(HACCP)을 통한 수산식품의 신뢰성 확보, 원재료 및 제품의 공급 체계 확보를 통한 비용절감 및 물류 효율화 등 수산가공업체의 운영 환경구축과 함께 가공수산물의 포장디자인 관련 연구 지원시설인 포장디자인센터도 단지 내에 구축될 예정이다. 본 연구에서는 수산가공선진화 단지 내 구축될 포장디자인센터의 역할과 거시적 운영목표를 설정하고 효율적인 운영방향을 제시하고자 하는 목적으로 진행되었다. 포장디자인센터는 공공의 자산으로서 수산가공선진화단지의 입주기업 뿐 아니라 지역의 수산물 가공산업 전반에 대한 발전을 이끌어야 하며, 디자인산업과의 융합으로 새로운 디자인 수요를 창출하고 특성화하여 지역디자인산업의 진흥을 목적으로 운영되어야 한다. 이러한 목적의 달성을 위해 산업화, 지식화, 융합화, 차별화의 4가지의 비젼을 운영 컨셉으로 도출하였고 이를 바탕으로 포장디자인센터의 효율적인 운영을 위한 전략적 추진사업으로 6가지 사업을 제시하였다. 이러한 과정을 통해 디자인산업과 가공수산물산업의 융 복합이 성공적으로 운영되어 국 내외 시장에서 경쟁력을 확보하고 산업간 융합을 통한 새로운 활력 창출의 성공적인 모델이 될 수 있기를 기대한다. 본 원고는 한국브랜드디자인학회 통권 제28호에 실린 논문에서 발췌했다