Microstructural Study of Creep-Fatigue Crack Propagation for Sn-3.0Ag-0.5Cu Lead-Free Solder |
Woo, Tae-Wuk
(Department of Mechanical Engineering, Pohang University of Science and Technology)
Sakane, Masao (Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University) Kobayashi, Kaoru (Advanced Packaging Laboratory, Kyocera SLC Technologies Corporation) Park, Hyun-Chul (Department of Mechanical Engineering, Pohang University of Science and Technology) Kim, Kwang-Soo (Department of Mechanical Engineering, Pohang University of Science and Technology) |
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