• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.231-247
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• 2005

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.249-272
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• 2005

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2007.04a
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• pp.129-146
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• 2007

[ ${\square}$ ] A mathematical model has been developed and used to analyze the limits of He fine leak test. ${\square}$ Uncertainties inherent in using the MIL-STD-883 guidelines for hermeticity evaluation of small packages have been demonstrated. ${\square}$ A new methodology to quantitatively characterize hermeticity has been developed.

• Electronics and Telecommunications Trends
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• v.39 no.3
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• pp.1-12
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• 2024

As the demand for high-performance semiconductors, such as chips for artificial intelligence and high-bandwidth memory devices, increases along with the limitations of ultrafine processing technology in the semiconductor in-line process, advanced packaging becomes an increasingly important breakthrough technology for further improving semiconductor performance. Major countries, including Korea, the United States, Taiwan, and China, and large companies are strengthening their technological industry capabilities through the development of advanced packaging technology and policy support. Nevertheless, Korea has a lower level of development of related technologies by approximately 66% compared with the most advanced countries. Therefore, we aim to discover the needs for an advanced packaging research and development (R&D) policy through written expert interviews and importance satisfaction analysis. As a result, various implications for R&D policy directions are suggested to strengthen the technological capabilities and R&D ecosystem of the Korean advanced packaging technology.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.65-89
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• 2003

Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.

• Electronics and Telecommunications Trends
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• v.39 no.3
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• pp.98-106
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• 2024

Advanced packaging is emerging as a core technology owing to the increasing demand for multifunctional and highly integrated semiconductors to achieve low power and high performance following digital transformation. It may allow to overcome current limitations of semiconductor process miniaturization and enables single packaging of individual devices. The introduction of advanced packaging facilitates the integration of various chips into one device, and it is emerging as a competitive edge in the industry with high added value, possibly replacing traditional packaging that focuses on electrical connections and the protection of semiconductor devices.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.213-230
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• 2005

• Laser Solutions
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• v.9 no.3
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• pp.15-21
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• 2006

A Polypropylene (PP) film was ablated using a femtosecond laser with a center wavelength of 785 nm, a pulse width of 184 fs and a repetition rate of 1 kHz. Increments of both pulse energy and the shot number of pulses lead to co-occurrence of photochemical and thermal effect, demonstrated by the spatial expansion of rim on the surface of PP. The shapes of the laser-ablated PP films were imaged by a scanning electron microscope (SEM) and measured a 3D optical measurement system (NanoFocus). And, the oxygen transmission rate (ORT) of periodically laser-ablated PP film were characterized by oxygen permeability tester for modified atmosphere packaging (MAP) of fresh fruit and vegetable. Our results demonstrate that femtosecond pulsed laser is efficient tools for breathable packaging films in modifying the flow of air and gas into and out of a fresh produce container, where the micropatterns are specifically tailored in size, location and number which are easily controlled by laser pulse energy and pulse patterning system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.