Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2005.09a
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- Pages.231-247
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- 2005
Wafer-Level MEMS Packaging : Fundamentals, Reliability Issues and Applications
- Ham S. J. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Jeong B. G. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Lim J. H. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Choi M. S. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Lee S. W. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Jung K. D. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Hwang J. S. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Lee M. C. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Kwon J. O. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Wang Q. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Kim W. B. (Packaging Center, Samsung Advanced Institute of Technology) ;
- Moon C. Y. (Packaging Center, Samsung Advanced Institute of Technology)
- Published : 2005.09.01
Abstract
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