• 펄프종이기술
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• 제31권2호
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• pp.25-33
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• 1999

A great difference in drainage time was observed from the recycled stocks between corrugated container board and its component papers, liner and medium paper. It could be assumed that the different drainage property should be caused from a starch adhesive present in the corrugated board. Thus, three types of starch such as dried Stein-Hall adhesive, cooked starch solution, and its dried film were added to linerboard stock in order to investigate the mechanism of drainage reduction. The water-swollen starch particles derived from Stein-Hall adhesive were drastically deteriorated the drainage time, even though the amount of starch is very small (2% or below). The drainage time of OCC was improved by 25% when amylase was used a new biological treatment. The results from the lab and mill test showed that the starch-degradable enzymatic treatment improves the drainage property as well as the reduction of calcium hardness.

• 한국재료학회지
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• 제9권1호
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• pp.65-72
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• 1999

In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

• 대한치과보철학회지
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• 제30권3호
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• pp.437-443
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• 1992

This study was performed to investigate the availability of adhesive resin cement for luting agent of cast crown. The resin cements used in this study were Panavia-Ex(Kuraray Co., Japan) and C & B-Metabond (Parkell Bio-Materials U.S.A.). Zinc phosphate cement was Flecks zinc cement(Mizzy Inc., U.S.A.) The film thickness of cast crown at gingival margin, lateral wall and occlusal surface was observed with measuring microscope(Modek MXT 70 Matsuzawa Seiki Co., Japan) and the retention of cast crown was measured with Instron Universal Test Machine (Instron Engineering Co., U.S.A.) The results were as follows : 1. The value of retention of cast crown was the highest in the use of Panavia-EX, followed by C & B-Metabond and 2inc phosphate cement, respectively. 2. There was no difference in film thickness among the three cements, but the film thickness in all cements was highest at occlusal surface.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1088-1092
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• 1995

In this paper, we evaluated the sputter-deposited Cr/Cu thin film fuses on $Al_2O_3$ substrates by the adhesive, breaking and repetitive over-current test as a function of temperature on them. Each Cr and Cu was deposited $1700{\pm}300{\AA},\;3700{\pm}300{\AA}$ using RF sputtering unit. The electroplated Cu of $25{\mu}m$ thickness was added in order to make sensitive thin film fuse of the normal current 15[A]. The adhesive strength and the number of repetition were Increasing and then decreasing with the temperature. The maximum adhesive strength of over $9kgf/9mm^2$ was obtained at $400^{\circ}C$. In the breaking test, the post-arc time characteristic was better than any other factor.

• Tribology and Lubricants
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• 제22권5호
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• pp.243-251
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• 2006

Molecular dynamics simulations of nanoimprint lithography NIL) are performed in order to investigate effects of process parameters, such as stamp shape, imprinting temperature and adhesive energy, on nanoimprint lithography process and pattern transfer. The simulation model consists of an amorphous $SiO_{2}$ stamp with line pattern, an amorphous poly-(methylmethacrylate) (PMMA) film and an Si substrate under periodic boundary condition in horizontal direction to represent a real NIL process imprinting long line patterns. The pattern transfer behavior and its related phenomena are investigated by analyzing polymer deformation characteristics, stress distribution and imprinting force. In addition, their dependency on the process parameters are also discussed by varying stamp pattern shapes, adhesive energy between stamp and polymer film, and imprinting temperature. Simulation results indicate that triangular pattern has advantages of low imprinting force, small elastic recovery after separation, and low pattern failure. Adhesive energy between surface is found to be critical to successful pattern transfer without pattern failure. Finally, high imprinting temperature above glass transition temperature reduces the imprinting force.

• 한국가시화정보학회지
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• 제5권1호
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• pp.3-8
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• 2007

We present simple methods for fabricating high aspect-ratio polymer nanostructures on a solid substrate by rigiflex lithography with tailored capillarity and adhesive force. In the first method, a thin, thermoplastic polymer film was prepared by spin coating on a substrate and the temperature was raised above the polymer's glass transition temperature ($T_g$) while in conformal contact with a poly(urethane acrylate) (PUA) mold having nano-cavities. Consequently, capillarity forces the polymer film to rise into the void space of the mold, resulting in nanostructures with an aspect ratio of ${\sim}4$. In the second method, very high aspect-ratio (>20) nanohairs were fabricated by elongating the pre-formed nanostructures upon removal of the mold with the aid of tailored capillarity and adhesive force at the mold/polymer interface. Finally, these two methods were further used to fabricate micro/nano hierarchical structures by sequential application of the molding process for mimicking nature's functional surfaces such as a lotus leaf and gecko foot hairs.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2008년도 제30회 춘계학술대회논문집
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• pp.203-206
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• 2008

본 연구는 고체 추진기관에 적용되는 내열재를 autoclave 방식이 아닌 hot press molding으로 제작하여 연소관에 접착 가능한 상태의 내열재로 제작하는데 초점을 두고 있다. EPDM/kevlar를 기본 조성으로 내열재 원료가 구성되고, 미가류 sheet 상태로 공급된다. 전방 내열재는 금형을 사용하여 preform 상태로 1차 제작하고, boots를 구형하기 위해 두개의 preform 사이에 modified nylon film을 사용하여 제작 하였다. 실린더 부위를 포함하고 있는 후방 내열재는 특별히 설계된 하나의 금형으로 제작되었고, boots 부위는 초경합금 칼날을 가지고 있는 장비에 의해 실현되었다.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2023년도 봄 학술논문 발표대회
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• pp.85-86
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• 2023

This study confirmed the improvement of the Composite Waterproof Method in which the sheet layer is partially attached with perforated film and the joint is FRP-treated.

• Transactions on Electrical and Electronic Materials
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• 제17권3호
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• pp.168-171
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• 2016

There has been growing interest and rapid development in transparent electrode films, which are flexible and light and used in mobile, simple information, and electronic devices, and based on recent advancements in nano technology, information technology, and display technology. In particular, studies on developing such films with both high conductivity and high transmittance of visible rays are highly in demand for commercialization. In this study, transparent electrode films were developed for IT using micro patterns that show sheet resistance less than 10 Ω/□, adhesive strength more than 98%, and light transmittance more than 90%. The results of applying a surface emission gradient minimization (Honey Comb) technology to the films was the verification of the sheet resistance, adhesive strength, and light transmittance satisfying the target level of this study through Imprinting and Remolding processes.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.55-58
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• 1996

A new type CuN/Cu/CuN thin film electrode material with high adhesion to glass was developed by the dc reactive planar magnetron sputtering system for the PDP(Plasma Display Panel). The adhesive force of the CuxN thin film was in the range of 20∼40(N) under the conditions of the N$_2$ partial pressure of 15%, discharge current of 70mA, discharge voltage of 450v and substrate bias voltage of -100V. The adhesive force was depended on the N$_2$ partial Pressure, discharge current and substrate bias voltage.