• Proceedings of the Korea Concrete Institute Conference
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• 2006.05a
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• pp.222-225
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• 2006

Pull-off test is widely used to evaluate bond performance between concrete and FRP composite. However, reliability of experiment result declines due to many difference between test methods of each national standards. This study analyzed problems of various existing test methods for pull-off test and suggested standardized test method. In addition, since tensile strength of concrete is smaller than bond strength of epoxy resin, maximum bond strength of epoxy resin shall be limited within tensile strength of concrete. Alternative testing method, therefore, which decrease FRP adhesion areas than concrete adhesion areas is suggested to widen test range of bond strength in pull-off test. In the experimental results, bond performance can be estimated up to two times of tensile strength of concrete by reducing FRP adhesion areas by 1/3.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.11a
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• pp.226-227
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• 2019

Installation and usage methods are currently different between China and Korea for the same rubber asphalt waterproofing sealant. Quality verification is not properly carried out in this situation, so it is necessary to secure reliability in order to export domestic materials to China. In this study, rubber asphalt waterproofing sealant used as injection-type leakage repair material was tested in accordance to adhesion strength quality test method outlined in the JC/T2428 Chinese Industrial Standard to confirm the basic performance is compliant or not.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.4
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• pp.244-248
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• 2018

We propose a method for improving the reliability of a solar cell by applying a fluorinated surface coating to protect the cell from the outdoor environment using an atmospheric pressure plasma (APP) treatment. An APP source is operated by radio frequency (RF) power, Ar gas, and $O_2gas$. APP treatment can remove organic contaminants from the surface and improve other surface properties such as the surface free energy. We determined the optimal APP parameters to maximize the surface free energy by using the dyne pen test. Then we used the scratch test in order to confirm the correlation between the APP parameters and the surface properties by measuring the surface free energy and adhesive characteristics of the coating. Consequently, an increase in the surface free energy of the cover glass caused an improvement in the adhesion between the coating layer and the cover glass. After treatment, adhesion between the coating and cover glass was improved by 35%.

• Korean Journal of Materials Research
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• v.15 no.7
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• pp.458-464
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• Korean Journal of Materials Research
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• v.15 no.1
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• pp.42-46
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.31-35
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• 2022

Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.41-47
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• 2020

The effect of Co interlayer on the interfacial reliability of SiN_x/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiN_x/Cu thin film structure was 0.90 J/㎡. This value of the SiN_x/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiN_x/Co/Cu structure was around 10 times higher than SiN_x/Cu structure due to CoSi₂ reaction layer formation at SiN_x/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiN_x/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiN_x/Co interface. Therefore, it is required to control the CoO and Co₃O₄ formation during the environmental storage of the SiN_x/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

• Journal of Adhesion and Interface
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• v.11 no.4
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• pp.168-173
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• 2010

Flame retardant halogen containing compounds have been replaced as environmentally safe material which does not contain hazardous materials generating toxic gas. Self-extinguishing epoxy resin compositions have been studied in order to produce eco-friendly epoxy molding compound, which is used as insulating materials in semiconductor. We developed self-extinguishing epoxy resin compositions which do not contain halogen compounds with new epoxy resin (E3). The new epoxy molding compound (EMC-1) showed high flame resistance (UL-V0) and high thermal resistance ($451.9^{\circ}C$ at 5 wt% loss) enough to use as eco-friendly material.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.24-27
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• 2006

International standards claim the best possible reliability in industrial manufacturing processes. This is also essential for the application with manual applicators. The application of adhesives with manual applicators is one of the most frequently used application techniques. The range of application reaches from the building of prototypes in the automobile industry over the use in single or small-batch manufacturing up to applications in crafts enterprises. Conventional manual applicators for adhesives and sealants don't fulfill the demands in international standards for the best possible reliability. Only the worker is able to control the quality and the quantity of the bond. A velocity-controlled manual applicator solves these restrictions. Special sensors and micro controllers calculate the flow-rate, the velocity and the location of the manual applicator. This leads to stable and repeatable application processes which are claimed in international standards. The location of the bond can be compared with the nominal value, so that it is possible to check the quality of the bond during application. Furthermore there is the potential to document the data of the manufacturing process.

• Journal of Adhesion and Interface
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• v.12 no.4
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• pp.138-143
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• 2011

Recently epoxy resin compositions having backbone of novolac derivatives with biphenylene compounds have been used as materials of eco-freindly EMC (Epoxy Molding Compound), because the cured epoxy resin compositions show the self-extinguishing without flame retardant additives. In this study, epoxy resin compositions were prepared and cured using novolac derivateves with biphenylene. Their propeties - structures of phenol derivatives and reactivity, thermal expansion, modulus, and thermal degradation - were obtained by DSC, DMA, TMA, TGA method. When both epoxy resin and hardenr had the biphenyl novolac structure, epoxy resin compositions showed low thermal expansion, good mechanical property, and combustion retardation.