1 |
A. D. G. Stewart, Ph. D. Thesis, Cambridge (1962) and Proc. V. Int. Cong. on Electron Microscopy, Philadelphia, Academic press, New York, D12 (1962)
|
2 |
C. A. Chang, J. E. E. Baglin, A. G. Schrott and K. C. Lin, Appl. Phys. Lett., 51(2), 103-105 (1987)
DOI
|
3 |
Y. Suzuki, M. Kusakabe, and M. Iwaki, Nuclear Instrument and Methods in Physics Research, B80/81, 1067-1071 (1993)
DOI
ScienceOn
|
4 |
S. Han : Surface Modification of Polymers by Ion beam Irradiation, Yonsei Univ, Seoul (1999)
|
5 |
J. H. Lau : Handbook of Tape Automated Bonding, VNR, New York 1 (1992)
|
6 |
B. Chapman, Glow Discharge Processes, John Wiley & Sons, New York (1980)
|
7 |
B. Navinlek, V. Marinkovic, M. Osredkar and G. Carter, Rad. Effects, 3, 115 (1970)
DOI
|
8 |
C. J. Beevers and R. S. Nelson, Phil. Mag., 8, 1189 (1963)
DOI
|
9 |
C. W. Ho, D. A. Chance, C. H. Bajorek and R. E. Acosta : IBM J. Res. Develop., 26, 286 (1982)
DOI
ScienceOn
|
10 |
D. A Doane and P. D. Franzon : Multichip Module Technologies and Alternatives, VNR, New York 403 (1993)
|
11 |
R. R. Tummala and E. J. Rymaszewski (eds) : Microelectronics Packaging Handbook, VNR, New York 673 (1989)
|
12 |
C. C. Chao, K. S. Scholz, J. Leibovitz, M. Cobarruiaz and C. C. Chung : IEEE Trans. Comp. Hybrids Manuf. Tech, 12, 180 (1989)
DOI
ScienceOn
|
13 |
W. J. Lee, Y. S. Lee, S. K. Rha, Y. J. Lee, K. Y. Lim, Y. D. Chung and C. N. Whang, Adhesion and interface chemical reactions of Cu/Polyimide and Cu/TiN by XPS, Appl. Surf. Sci., 205, 130 (2003)
DOI
ScienceOn
|
14 |
T. K. Jung, Y. H. Kim and J. Yu. K. Vac. Sci., 26(2), 71 (1993)
|
15 |
M. L. Kaplan. S. R. Forrest. P. H. Schmidt and T. Vankatesan, J. Appl. Phys., 55, 732 (1984)
DOI
ScienceOn
|
16 |
R. J. Good, Contact Angle, Wettability and Adhesion, ed. K. L. Mittal (VSP BV, Urecht, Netherlands, 1993) p. 3-36
|
17 |
J. Kim, K. S. Kim and Y. H. Kim, J. Adhension Sci. Tech., 3, 175 (1989)
DOI
|
18 |
G. Beamson, D. Briggs, High Resolution XPS of Organic Polymers, John Wiley & Sons, New York (1992)
|
19 |
H. Y. Lee, KAIST, Mat. Sci. Eng., A311, 217 (2001)
|