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http://dx.doi.org/10.3740/MRSK.2005.15.7.458

A Study on the Improvement of Adhesion according to the Process Variables of Ion Beam in the Cu/Polyimide Thin Film  

Shin Youn-Hak (Department of Materials Engineering, Chungbuk National University)
Kim Myung-Han (Department of Materials Engineering, Chungbuk National University)
Choi Jae-Ha (Department of Materials Engineering, Chungbuk National University)
Publication Information
Korean Journal of Materials Research / v.15, no.7, 2005 , pp. 458-464 More about this Journal
Abstract
In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.
Keywords
polyimide; contact angle; peel strength test; adhesion;
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  • Reference
1 A. D. G. Stewart, Ph. D. Thesis, Cambridge (1962) and Proc. V. Int. Cong. on Electron Microscopy, Philadelphia, Academic press, New York, D12 (1962)
2 C. A. Chang, J. E. E. Baglin, A. G. Schrott and K. C. Lin, Appl. Phys. Lett., 51(2), 103-105 (1987)   DOI
3 Y. Suzuki, M. Kusakabe, and M. Iwaki, Nuclear Instrument and Methods in Physics Research, B80/81, 1067-1071 (1993)   DOI   ScienceOn
4 S. Han : Surface Modification of Polymers by Ion beam Irradiation, Yonsei Univ, Seoul (1999)
5 J. H. Lau : Handbook of Tape Automated Bonding, VNR, New York 1 (1992)
6 B. Chapman, Glow Discharge Processes, John Wiley & Sons, New York (1980)
7 B. Navinlek, V. Marinkovic, M. Osredkar and G. Carter, Rad. Effects, 3, 115 (1970)   DOI
8 C. J. Beevers and R. S. Nelson, Phil. Mag., 8, 1189 (1963)   DOI
9 C. W. Ho, D. A. Chance, C. H. Bajorek and R. E. Acosta : IBM J. Res. Develop., 26, 286 (1982)   DOI   ScienceOn
10 D. A Doane and P. D. Franzon : Multichip Module Technologies and Alternatives, VNR, New York 403 (1993)
11 R. R. Tummala and E. J. Rymaszewski (eds) : Microelectronics Packaging Handbook, VNR, New York 673 (1989)
12 C. C. Chao, K. S. Scholz, J. Leibovitz, M. Cobarruiaz and C. C. Chung : IEEE Trans. Comp. Hybrids Manuf. Tech, 12, 180 (1989)   DOI   ScienceOn
13 W. J. Lee, Y. S. Lee, S. K. Rha, Y. J. Lee, K. Y. Lim, Y. D. Chung and C. N. Whang, Adhesion and interface chemical reactions of Cu/Polyimide and Cu/TiN by XPS, Appl. Surf. Sci., 205, 130 (2003)   DOI   ScienceOn
14 T. K. Jung, Y. H. Kim and J. Yu. K. Vac. Sci., 26(2), 71 (1993)
15 M. L. Kaplan. S. R. Forrest. P. H. Schmidt and T. Vankatesan, J. Appl. Phys., 55, 732 (1984)   DOI   ScienceOn
16 R. J. Good, Contact Angle, Wettability and Adhesion, ed. K. L. Mittal (VSP BV, Urecht, Netherlands, 1993) p. 3-36
17 J. Kim, K. S. Kim and Y. H. Kim, J. Adhension Sci. Tech., 3, 175 (1989)   DOI
18 G. Beamson, D. Briggs, High Resolution XPS of Organic Polymers, John Wiley & Sons, New York (1992)
19 H. Y. Lee, KAIST, Mat. Sci. Eng., A311, 217 (2001)