• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.296-300
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• 2002

Thin films of Hydrogenated amorphous carbon(a-C:H) are generally exhibited by high electrical resistivities from 10$^2$ to 10$\^$16/ Ω$.$cm, resulting in an interesting material for high power, high temperature MIS devices applications. The hydrogenated amorphous carbon(a-C:H) films were deposited on silicon and glass using an rf plasma enhanced CVD method. The resultant film properties were evaluated in the respect of material based on r.f. power variation. The hydrogenated amorphous carbon(a-C:H) films of thickness ranging from 30 to 50 m were deposited at the pressure of 1 ton with the mixture of methane and hydrogen. We have used rf-IR( courier transform IR) and AFM(Atomic force microscopy) for determining physical properties and current-voltage(I-V) measurement for electrical Properties.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.196-196
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• 2008

We have investigated that the effect of post annealing on the structural and electrical properties of $Ba_{0.5}Sr_{0.5}TiO_3$ thin films. The BST thin films were deposited on n-type 4H-silicon carbide(SiC) using pulsed laser deposition (PLD). The deposition was carried out in oxygen ambient 100mTorr for 5 minutes, which results in about 300nm-thick BST films. For the BST/4H-SiC, 200nm thick silver was deposited on the BST films bye-beam evaporation. The X-ray diffraction patterns of the BST films revealed that the crystalline structure of BST thin films has been improved after post-annealing at $850^{\circ}C$ for 1 hour. The root mean square (RMS) surface roughness of the BST film measured by using a AFM was increased after post-annealing from 5.69nm to 11.49nm. The electrical properties of BST thin film were investigated by measuring the capacitance-voltage characteristics of a silver/BST/4H-SiC structure. After the post-annealing, dielectric constant of the film was increased from 159.67 to 355.33, which can be ascribed to the enhancement of the crystallinity of BST thin films.

• 한국진공학회지
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• 제16권2호
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• pp.122-127
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• 2007

본 연구에서는 비정질 탄소박막들(a-C, a-C:H, a-C:N)을 흑연타겟이 부착되어진 비대칭 마그네트론 스퍼터링법을 이용하여 증착하였으며, 음의 DC 바이어스 전압의 효과를 알아보기 위해 증착가스 압력내에서 200 V를 인가하여 탄소박막들을 제작하였다. 수소화된 비정질 탄소박막과 질화탄소박막은 각각 스퍼터링 가스로써 아세틸렌과 질소를 주입하여 제작하였다. 결과적으로 26.5 GPa의 높은경도와 0.1 nm의 낮은 거칠기 그리고 접착력은 30.5 N를 가지는 수소화된 비정질 탄소박막을 합성하였으며, 32 N의 좋은 접착 특성을 나타내는 질화 탄소 박막을 합성하였다. 본 논문에서는 아세틸렌과 질소 가스의 효과와 음의 DC 바이어스 전압에 따른 비정질 탄소박막들의 구조적 특성과 물리적 특성과의 관계를 규명하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 춘계학술발표회 초록집
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• pp.53-53
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• 2003

Plasma polymerized organic thin films were deposited on Si(100) glass and metal substrates using thiophene and ethylcyclohexane precursors by PECVD method. In order to compare electrochemical properties of the as-grown thin films, the effects of the RF plasma power in the range of 30~100 W. AFM showed that the polymer films with smooth surface and sharp interface could be grown under various deposition conditions. Impedance analyzer was utilized for the determination of I-V curve for leakage current density and C-V for dielectric constants, respectively. To obtain C-V curve, we used a MIM structure of metal(Al)-insulator(plasma polymerized thin film)-metal(Pt) structure. Al as the electrode was evaporated on the thiophene films that grew on Pt coated silicon substrates, and the dielectric constants of the as-grown films were then calculated from C- V data measured at 1MHz. From the electrical property measurements such as I-V and C-V characteristics, the minimum dielectric constant and the best leakage current of thiophene thin films were obtained to be about 3.22 and $1{\;}{\times}10^{-11}{\;}A/cm^2$. However, in case of ethylcyclohexane thin films, the minimum dielectric constant and the best leakage current were obtained to be about 3.11 and $5{\;}{\times}10^{-12}{\;}A/cm^2$.

• 한국재료학회지
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• 제21권2호
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• pp.78-82
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• 2011

Mono- and few-layer graphenes were grown on Ni thin films by rapid-thermal pulse chemical vapor deposition technique. In the growth steps, the exposure step for 60 s in $H_2$ (a flow rate of 10 sccm (standard cubic centimeters per minute)) atmosphere after graphene growth was specially established to improve the quality of the graphenes. The graphene films grown by exposure alone without $H_2$ showed an intensity ratio of $I_G/I_{2D}$ = 0.47, compared with a value of 0.38 in the films grown by exposure in H2 ambient. The quality of the graphenes can be improved by exposure for 60 s in $H_2$ ambient after the growth of the graphene films. The physical properties of the graphene films were investigated for the graphene films grown on various Ni film thicknesses and on 260-nm thick Ni films annealed at 500 and $700^{\circ}C$. The graphene films grown on 260-nm thick Ni films at $900^{\circ}C$ showed the lowest $I_G/I_{2D}$ ratio, resulting in the fewest layers. The graphene films grown on Ni films annealed at $700^{\circ}C$ for 2 h showed a decrease of the number of layers. The graphene films were dependent on the thickness and the grain size of the Ni films.

• 한국결정성장학회지
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• 제13권1호
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• pp.36-40
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• 2003

$CH_4/(C_2H_5O)_4Si/H_2$/Ar가스 혼합물을 출발 반응원료로 하여 플라즈마 화학기상증착법으로 Si 기판 위에 유사 다이아몬드 나노복합체(diamond-like nanocomposite, DLN) 박막을 증착하였다. 성장된 막의 화학구조와 미세구조를 확인하였으며 막의 마모특성을 평가하였다. 증착된 DLN 막은 다이아몬드와 유사한 a-C:H 구조와 실리카와 유사한 a-Si:O 구조가 네트워크 형태로 구성되어 있음을 확인하였으며 극도로 낮은 마모계수와 마모속도를 나타내어 내마모 코팅용 보호막으로 의 응용에 적합한 것으로 나타났다.

• 한국진공학회지
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• 제10권1호
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• pp.104-111
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• 2001

$SiH_4$, $CH_4$, $B_2H_6$ 혼합기체를 이용하여 플라즈마 화학증착법으로 비정질 탄화실리콘(a-SiC:H) 박막을 증착하였다. 기상 doping 농도를 0에서 $2.5\times10^{-2}$ 범위에서 변화시켜 얻은 박막의 물성을 SEM, XRD, Raman 분광법, FTIR, SIMS, 광흡수도와 전기전도도 분석을 통하여 살펴보았다. $B_2H_6$/($CH_4+SiH_4$) 기체유량비가 증가할수록 붕소의 도핑효율와 미세결정성은 감소하였다. 증착 중 $B_2H_6$ 기체가 첨가됨에 따라 비정질 탄화실리콘 박막의 Si-C-H 결합기의 강도는 감소하였으며, 이의 영향으로 박막내의 수소함량은 $B_2H_6/(SiH_4+CH_4$) 기체 유량비가 증가함에 따라 16.5%에서 7.5%로 단조감소하였다. $B_2H_6(CH_4+SiH_4$) 기체유량비가 증가할수록 a-SiC:H 박막의 광학적 밴드갭과 전기활성화 에너지는 감소하였고, 전기전도도는 증가하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.93-96
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• 2002

In this study, PZT thin films were fabricated using sol-gel processing onto Si/$SiO_2$/Ti/Pt substrates. PZT sol with different Zr/Ti ratio(20/80, 30/70, 40/60, 52/48) were prepared, respectively. The films were fabricated by using the spin-coating method on substrates. The films were heat treated at $450^{\circ}C$, $650^{\circ}C$ by rapid thermal annealing(RTA). The preferred orientation of the PZT thin films were observed by X-ray diffraction(XRD), and Scanning electron microscopy(SEM). All of the resulting PZT thin films were crystallized with perovskite phase. The fine crystallinity of the films were fabricated. Also, we found that the ferroelectric properties from the dielectric constant of the PZT thin films were over 600 degrees, P-E hysteresis constant. And the leakage current densities of films were lower than $10^{-8}A/cm^2$. It is concluded that the PZT thin films by sol-gel process to be convinced of application for ferroelectric memory device.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2002년도 추계종합학술대회
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• pp.477-480
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• 2002

ULSI(ultra large scaled integrated circuits)의 고집적화와 고속화를 위한 다층 배선 기술 중에서 층간 절연막의 특성을 향상시켜주는 것은 매우 중요한 요소이다. 소자의 소형화에 따른 절연층의 용량에 의한 신호의 지연을 방지하고 금속배선간의 상호간섭을 막아주기 위해서 현재 요구되는 0.13$\mu\textrm{m}$급 소자의 경우에서는 유전율이 매우 낮은 k$\leq$2.0인 층간 절연막이 필요하게 된다. 이러한 차세대 반도체 소자의 층간 절연물질로서 사용될 유력한 저유전 물질로 Nanoporous silica(k=1.3~2.5)를 적용하려는 연구가 진행되고 있다(1)-(3). 그러한 물질 중에 하나가 organosilicate films이 있는데 carbon-doped oxides, silicon-oxicarbides, carbon-incorporated silicon oxide film, organic-inorganic hybrid type Si-O-C thin films 혹은 organic-inorganic hybrid silica materials 등으로 불린다. 이에 본 연구에서는 nano-pore를 갖는 유무기 하이브리드 구조의 저유전 박막을 BTMSM/O$_2$의 혼합된 precursor를 사용하여 ICPCVD 방법에 의해 형성하였다. 총 유량을 20sccm이 되도록 하여 $O_2$:BTMSM(Ar)의 유량비를 변화시키며, 작업진공도는 300mTorr였다. 기판은 가열하지 않고, p-type Si(100) 위에 Si-O-C-H 박막을 형성하였다. 열적안정성을 조사하기 위하여 30$0^{\circ}C$, 40$0^{\circ}C$, 50$0^{\circ}C$에서 30분간 열처리하여 비교 분석하였다. 형성된 박막의 특성은 XPS로 분석하여 유전상수와의 상관관계를 조사하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1414-1416
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• 2001

Crack-free and homogeneous compact and epitaxial lead zirconate titanate(PZT) ferroelectric thin films with perovsikte structure have been prepared by sol-eel method. Tetrabutyl titanate, lead acetate and zirconium nitrate are used as raw materials. Glacial acetic acid is used as a catalyst. Ethylene glycol monoethyl ether is used as a solvent. The annealing temperatures of th thin films are 600~900$^{\circ}C$. The values of the remanent polarization Pr, and the coercive field $E_c$, of the PZT ceramic thin films are 46, 35 ${\mu}C/cm^2$ respectively.