• Transactions on Electrical and Electronic Materials
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• 제15권4호
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• pp.221-225
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• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• 통합자연과학논문집
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• 제9권4호
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• pp.223-227
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• 2016

The Zn, Sn, and ZnSn thin films were deposited on Si(100) substrate using radio frequency (RF) magnetron co-sputtering method. A surface profiler and X-ray photoelectron spectroscopy (XPS) were used to investigate the Zn, Sn, and ZnSn thin films. Thickness of the thin films was measured by a surface profiler. The deposition rates of pure Zn and Sn thin films were calculated with thickness and sputtering time for optimization. From the survey XPS spectra, we could conclude that the thin films were successfully deposited on Si(100) substrate. The chemical environment of the Zn and Sn was monitored with high resolution XPS spectra in the binding energy regions of Zn 2p, Sn 3d, O 1s, and C 1s.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권5호
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• pp.211-215
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• 2001

SBT thin films were etched at different content of $Cl_2$ in $Cl_2$/Ar or $Cl_2/N_2$(80%). As $Cl_2$ gas increased in $Cl_2$/Ar or $Cl_2/N_2$ gas plasma. the etch rate decreased. The result indicates that physical puttering of charged particles is dominant to chemical reaction in etching SBT thin films. To evaluate the etching mechanism of SBT thin films, x-ray photoelectron to chemical reaction in etching SBT thin films. To evaluate the etching mechanism of SBT thin films, x-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometry (SIMS) and atomic force microscopy (AFM) were carried out. From the result of AFM, the rms values of etched samples in Ar only or $Cl_2$ only plasma were higher than that of as-deposited, $Cl_2$/Ar and $Cl_2/N_2$ plasma. This can be illustrated by a decrease of Bi content of nonvolatile etching products (Sr-Cl and Ta-Cl), which are revealed by XPS and SIMS.

• Bulletin of the Korean Chemical Society
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• 제34권5호
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• pp.1445-1453
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• 2013

$Zn_{(1-x)}Ni_xAl_2O_4$ (x = 0.0-1.0) spinels were prepared at $800^{\circ}C$ by co-precipitation method and characterized by infrared spectroscopy, X-ray diffraction, scanning electron microscopy and X-ray photoelectron spectroscopy. The specific surface area was determined by BET. SEM image showed nano sized spherical particles. XPS confirmed the valence states of the metals, showing moderate Lewis character for the surface of materials. The powders were successfully used as new heterogeneous catalysts of Biginelli's reaction, a one-pot three-component reaction, leading to some dihydropyrimidinones (DHPMs). These new catalysts that produced good yields of DHPMs, were easily recovered by simple filtration and subsequently reused with persistent activity, and they are non-toxic and environmentally friendly. The optimum amount of catalyst is 20% by weight of benzaldehyde derivatives, while the doping amount has been found optimal for x = 0.1.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2008년도 추계종합학술대회 B
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• pp.95-99
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• 2008

반도체 소자의 소형화에 따라 낮은 비저항을 가진 구리가 ULSI의 금속배선으로 사용되고 있다. 구리선의 비저항은 RC delay와 집적회로의 신호전달에 영향을 미치게 된다. 본 논문에서는 전기도금 된 구리박막의 비저항에 대해 전해액이 미치는 영향을 조사하였다. 4탐침 표면저항측정기로 비저항을 평가하였고, XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope), XPS (X-ray Photoelectron Spectroscopy)로 박막의 특성을 조사하였다. 실험한 결과, 전해액의 조건이 전기도금으로 증착된 낮은 비저항을 갖는 구리박막의 형성에 있어 중요한 역할을 하는 것을 확인하였다.

• 청정기술
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• 제20권1호
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• pp.28-34
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• 2014

본 연구에서는 나노 크기의 결정 구조를 가진 타이타니아 담체를 용매열합성법(solvothermal method)을 활용하여 합성한 후 팔라듐과 구리를 담지한 촉매를 제조하였다. 제조된 촉매를 수중 질산성 질소 저감 반응에 적용한 결과, 타이타니아 담체의 결정 크기가 반응 활성에 영향을 미치는 것이 확인되었다. 결정 크기가 작은 담체를 활용한 촉매가 더 빠른 속도로 질산성 질소를 저감하였지만, 반응 중 pH가 높게 형성되어 질소 선택도가 매우 낮은 현상을 보였다. 이를 해결하기 위해 pH 완충제인 이산화탄소를 공급하여 질소 선택도를 약 60% 증가시켰다. 상기에 언급한 촉매를 대상으로 질소 흡-탈착, X-ray diffraction (XRD), $H_2$-temperature programmed reduction (TPR), X-ray photoelectron spectroscopy (XPS) 등의 다양한 특성화 분석을 수행하여 촉매의 반응활성과 물성간의 상관관계에 대해 조사하였다.

• 한국입자에어로졸학회지
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• 제9권4호
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• pp.209-219
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• 2013

We have used the modified diffusion flame burner to synthesize silica coated iron oxide nanoparticles having enhanced superparamagnetic property. Silica-encapsulated iron oxide particles were directly observed using a high resolution transmission electron microscope. From the energy dispersive X-ray spectroscopy (EDS) and zeta potential measurements, the iron oxide particles were found to be completely covered by a silica coating layer. X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) measurements revealed that the iron oxide core consists of ${\gamma}-Fe_2O_3$ rather than ${\alpha}-Fe_2O_3$. Our magnetization measurements support this conclusion. Biocompatibility test of the silica-coated iron oxide nanoparticles is also conducted using the protein adsorption onto the coated particle.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.84-87
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• 2003

Carbon nitride ($CN_x$) films were prepared by reactive RF magnetron sputtering system with DC bias at various deposition conditions and the electrical properties were investigated. The films were characterized by fourier transform infrared (FTIR) spectroscopy, and X-ray photoelectron spectroscopy (XPS). The metal-insulator-semiconductor (MIS) capacitor which has $Al/CN_x/Si$ structure was designed and fabricated to investigate the capacitance-voltage (C-V) characteristics. Dielectric constant of carbon nitride films is very small.

• KSTLE International Journal
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• 제4권2호
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• pp.56-59
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• 2003

Boron carbide thin coatings were deposited on silicon wafers by DC magnetron sputtering using a ${B}_4$C target with Ar as processing gas. Various amounts of methane gas (${CH}_4$) were added in the deposition process to better understand their influence on tribological properties of the coatings. Reciprocating wear tests employing an oscillating friction wear tester were performed to investigate the tribological behaviors of the coatings in ambient environment. The chemical characteristics of the coatings and worn surfaces were studied using X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES). It revealed that ${CH}_4$addition to Ar processing gas strongly affected the tribologcal properties of sputtered boron carbide coating. The coefficient of friction was reduced approximately from 0.4 to 0.1, and wear resistance was improved considerably by increasing the ratio of ${CH}_4$gas component from 0 to 1.2 vol %. By adding a sufficient amount of ${CH}_4$(1.2 %) in the deposition process, the boron carbide coating exhibited lowest friction and highest wear resistance.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2003년도 학술대회지
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• pp.78-84
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• 2003

Boron carbide thin coatings were deposited on silicon wafers by DC magnetron sputtering using a $B_4C$ target with As as processing gas. Various amounts of methane gas $(CH_4)$ were added in the deposition process to better understand their influence on tribological properties of the coatings. Reciprocating wear tests employing an oscillating friction wear tester were performed to investigate the tribological behaviors of the coatings in ambient environment. The chemical characteristics of the coatings and worn surfaces were studied using X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES). It revealed that $CH_4$ addition to As processing gas strongly affected the tribologcal properties of sputtered boron carbide coating. The coefficient of friction was reduced approximately from 0.4 to 0.1, and wear resistance was improved considerably by increasing the ratio of $CH_4$, gas component from 0 to $1.2\;vol\;\%$. By adding a sufficient amount of $CH_4\;(1.2\%)$ in the deposition process, the boron carbide coating exhibited lowest friction and highest wear resistance.