• International Journal of Quality Innovation
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• v.6 no.3
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• pp.70-94
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• 2005

The IC packaging industry heavily relies on shop floor information, necessitating the development of a model to flexibly define shop floor information and timely handle manufacturing data. This study presents a novel data model of product manufacturing flow to define shop floor information to effectively respond to accelerated developments in IC package industry. The proposed data model consists of four modules: operation template setup, general process setup, enhanced bill of manufacture (EBOMfr) setup, and work-order process setup. The data model can flexibly define the required shop floor information and decision rules for shop floor product manufacturing flow, allowing one to easily adopt changes of the product and on the shop floor. However, to handle floor dynamics of the IC packaging industry, this work also proposes a WIP (i.e. work-in-process) system for monitoring and controlling the product manufacturing flow on the shop floor. The WIP system integrates the data model with a WIP execution module. Furthermore, an illustrative example, the MIRL WIP System, developed by Mechanical Industrial Research Laboratories of Industrial Technology Research Institute, demonstrates the effectiveness of the proposed model.

• Korean Journal of Construction Engineering and Management
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• v.1 no.4 s.4
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• pp.82-90
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• 2000

An integrated cost and schedule control is a noteworthy alternative of the separate control method which is commonly used in the domestic construction industry. In Korea, some cost and schedule integration models have been applied partly by construction managers. But, these models have not been customized yet because they did not reflect the characteristics of the domestic construction industry. This study investigates the characteristics of domestic integration models analyzed through interviews with experts who have the experiences in applying cost-schedule integration models. Based on these surveys, this study suggests the strategy for the improvement of work packaging model in the domestic construction industry.

• Journal of Welding and Joining
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• v.21 no.5
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• pp.534-539
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• 2003

An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.3
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• pp.107-113
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• 2015

This work focused on the study of thermal properties and kinetic behavior of LDPE-nanoclay composite films. The effect of nanoclay content (0.5, 1, 3, and 5 wt%) on thermal stability and crystallization characteristics of the nanocomposites were investigated by Thermogravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). The results from endothermic curve showed that the nanoclay played an important role in the crystallization of nanocomposites by acting as nucleating agent. From exothermic curve, there was a crystallization temperature shift which was attributed to crystallization process induced by nanoclay. The TGA results showed that the addition of nanoclay significantly increased the thermal stability of LDPE matrix, which was likely due to the characteristic of layered silicates/clays dispersed in LDPE matrix as well as the formation of multilayered carbonaceous-silicate char. A well-known Coats-Redfern method was used to evaluate the decomposition activation energy of nanocomposite. It was demonstrated that introducing of nanoclay to LDPE matrix escalated the activation energy of nanocomposite decomposition resulting in thermal stability improvement.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.168-172
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• 2013

In 3D wafer-stacking technology, one of the major issues is wafer warpage. Especially, The important reason of warpage has been known due to CTE(Coefficient of Thermal Expansion) mismatch between materials. It was too hard to choose how to make the FE model for blanket structured wafer level 3D packaging, because the thickness of each layer in wafer level 3D packaging was too small (micro meter or nano meter scale) comparing with diameter of wafer (6 or 8 inches). In this study, the FE model using the shell element was selected and simulated by the ANSYS WorkBench to investigate effects of the CTE on the warpage. To verify the FE model, it was compared by experimental results.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.67-70
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• 2022

In the present work, we have designed to optimize the optical filter structures of the 1-dimensional photonic quasicrystals (1D PQCs) characteristic for the COVID-19 UV sterilization. The simulator using MATLAB program and ourselves manufacturing calculation codes. After making the aperiodic (and complexed) multi-layer structure model, we establish the transfer matrix method (TMM) for model by the operator conversion. By the using the MATLAB, we derive a matrix for the designed complexed multi-layer structure by applying the equations to the model by obtaining the reflectance and transmittance from the matrix. We also prove the possibility of application in optical filter for UV sterilization.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.46 no.1
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• pp.23-31
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• 2023

Research and interest in sustainable printing are increasing in the packaging printing industry. Currently, predicting the amount of ink required for each work is based on the experience and intuition of field workers. Suppose the amount of ink produced is more than necessary. In this case, the rest of the ink cannot be reused and is discarded, adversely affecting the company's productivity and environment. Nowadays, machine learning models can be used to figure out this problem. This study compares the ink usage prediction machine learning models. A simple linear regression model, Multiple Regression Analysis, cannot reflect the nonlinear relationship between the variables required for packaging printing, so there is a limit to accurately predicting the amount of ink needed. This study has established various prediction models which are based on CART (Classification and Regression Tree), such as Decision Tree, Random Forest, Gradient Boosting Machine, and XGBoost. The accuracy of the models is determined by the K-fold cross-validation. Error metrics such as root mean squared error, mean absolute error, and R-squared are employed to evaluate estimation models' correctness. Among these models, XGBoost model has the highest prediction accuracy and can reduce 2134 (g) of wasted ink for each work. Thus, this study motivates machine learning's potential to help advance productivity and protect the environment.

• Journal of Information Processing Systems
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• v.6 no.4
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• pp.609-620
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• 2010

In order to provide a tailored education for learners within the ubiquitous environment, it is critical to undertake an analysis of the learning activities of learners. For this purpose, SCORM (Sharable Contents Object Reference Model), IMS LD (Instructional Management System Learning Design) and other standards provide learning design support functions, such as, progress checks. However, in order to apply these types of standards, contents packaging is required, and due to the complicated standard dimensions, the facilitation level is lower than the work volume when developing the contents and this requires additional work when revision becomes necessary. In addition, since the learning results are managed by the server there is the problem of the OS being unable to save data when the network is cut off. In this study, a system is realized to manage the actions of learners through the event interception of a web-browser by using event hooking. Through this technique, all HTMLbased contents can be facilitated again without additional work and saving and analysis of learning results are available to improve the problems following the application of standards. Furthermore, the ubiquitous learning environment can be supported by tracking down learning results when the network is cut off.

• Korean Journal of Organic Agriculture
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• v.16 no.3
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• pp.239-258
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• 2008

This study identifies the spectrum of different forms of sharing labor in farm houses following the increase in the production of organic produce and deals with the gender division of labor and every day life of the farm households. The increased labor burdens of organic farming give more work opportunities to wives, weakening the gender barriers. However, some of the farm households seeking for economic feasibility are strengthening the gender barriers by specialized work divisions, leading to outside order labor of harvest, sorting, and packaging in order to increase efficiency in agricultural management in extreme cases. Even in the alternative distribution system, farm households has become subject to the distribution system as it is shown that coop claimed the segmentation of sorting work. This is because the convenience of the customers goes before the advantages of producers. Jinju, seeking for economic feasibility, has established the springboard for growth by greenhouse through monoculture and specialization and are operating economic growth stably. Farm couples with this condition, where their incomes are relatively high, are attempting to recharge their energy during low seasons. It is expected that this will be a model case of conventionalization of organic farming. Significance of organic farming in this matter is discussed.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.224-227
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• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.