• 제목/요약/키워드: Wet $SiO_2$

검색결과 164건 처리시간 0.02초

$SiO_2$막의 습식식각 방법별 균일도 비교 (Comparison of Etching Rate Uniformity of $SiO_2$ Film Using Various Wet Etching Method)

  • 안영기;김현종;성보람찬;구교욱;조중근
    • 반도체디스플레이기술학회지
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    • 제5권2호
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    • pp.41-46
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    • 2006
  • Wet etching process in recent semiconductor manufacturing is devided into batch and single wafer type. Batch type wet etching process provides more throughput with poor etching uniformity compared to single wafer type process. Single wafer process achieves better etching uniformity by boom-swing injected chemical on rotating wafer. In this study, etching characteristics of $SiO_2$ layer at room and elevated temperature is evaluated and compared. The difference in etching rate and uniformity of each condition is identified, and the temperature profile of injected chemical is theoretically calculated and compared to that of experimental result. Better etching uniformity is observed with single wafer tool with boom-swing injection compared to single wafer process without boom-swing or batch type tool.

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습식 직접합성법을 이용한 PTCR 소자개발 연구 (Fabrication of $BaTiO_3-PTCR$ Ceramic Resister Prepared by Direct Wet Process)

  • 이경희;이병하;이희승
    • 한국세라믹학회지
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    • 제22권4호
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    • pp.61-65
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    • 1985
  • $BaTiO_3$ powders doped with $BaTiO_3$ and $Nb_2O_5$ at 9$0^{\circ}C$ for 1hr. were synthesized by Direct Wet Process. These powders were very homogeneous and fine particle size. To obtain the highe PTCR effect AST($1/3Al_2O_3$.$3/4SiO_2$.$1/4TiO_2$) and $MnO_2$ were added in the semiconduc-ting $BaTiO_3$. In this case $Bi_2O_3$ and $MnO_2$ were used in the form of $Bi(NO)_3$ and $MnCl_2$.$4H_2O$ solution for Direct Wet Process. $BaTiO_3$ doped Nb2O5 and $MnO_2$ demostrated greater PTCR effect than $BaTiO_3$ doped $Nn_2O_5$ only.

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SiC CMOS 게이트 산화막에 관한 연구 (Study of The SiC CMOS Gate Oxide)

  • 최재승;이원선;신동현;김영석;이형규;박근형
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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    • pp.29-32
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    • 2001
  • In this paper, the thermal oxidation behaviors and the electrical characteristics of the thermal oxide grown on SiC are discussed. For these studies the oxide layers with various thickness were on SiC in wet $O_2$ or dry $O_2$ at l15$0^{\circ}C$ and the MOS capacitors using the 350$\AA$ gate oxide grown in wet $O_2$ were fabricated and electrically characterized. It was found from the experimental results that the oxidation rate of SiC with the Si-face and with the carbon-face were about 10% and 50% of oxidation rate of Si. The C-V measurement results of the SiC oxide showed abnormal hysterisis properties which had ever been not observed for the Si oxide. And the hysterisis behavior was seen more significant when initial bias voltage was more negative or more positive. The hysterisis property of the SiC oxide was believed to be due the substantial amount of the deep level traps to exist at the interface between the oxide and the SiC substrate. The leakage of the SiC oxide was found to be one order larger than the Si oxide, but the breakdown strength was almost equal to that of the Si oxide.

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Development of sacrificial layer wet etch process of TiNi for nano-electro-mechanical device application

  • Park, Byung Kyu;Choi, Woo Young;Cho, Eou Sik;Cho, Il Hwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제13권4호
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    • pp.410-414
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    • 2013
  • We report the wet etching of titanium nickel (TiNi) films for the production of nano-electro-mechanical (NEM) device. $SiO_2$ and $Si_3N_4$ have been selected as sacrificial layers of TiNi metal and etched with polyethylene glycol and hydrofluoric acid (HF) mixed solution. Volume percentage of HF are varied from 10% to 35% and the etch rate of the $SiO_2$, $Si_3N_4$ and TiNi are reported here. Within the various experiment results, 15% HF mixed polyethylene glycol solution show highest etch ratio between sacrificial layer and TiNi metal. Especially $Si_3N_4$ films shows high etch ratio with TiNi films. Wet etching results are measured with SEM inspection. Therefore, this experiment provides a novel method for TiNi in the nano-electro-mechanical device.

졸 겔 법을 이용한 Cao-SiO2계 겔의 합성 및 구조분석 (Preparation and Structural Analysis of Cao-SiO2 Gel by Sol-Gel Method)

  • 이태형;이수정;황연;김일용;;조성백
    • 한국세라믹학회지
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    • 제45권10호
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    • pp.644-650
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    • 2008
  • It has been proposed that the Cao-$SiO_2$ binary system can be good basic composition of bioactive glasses and glass-ceramics. In the present study, various kinds of Cao-$SiO_2$ gels were prepared by sol-gel method in order to control the microstructure which are related to their dissolution rate, induction period of apatite formation in body environment. Characterization of the gels were done by wet chemical analysis, SEM observation, FT-IR spectroscopy and XRD. The gelation time decreased with CaO content. However, the volume of all the dried gel decreased to 50% of the wet gels irrespective of increasement of CaO content. All the Cao-$SiO_2$ gels were amorphous and contained a large amount of silanol groups on their surfaces after heat treatment up to $800^{\circ}C$. The interconnected structure of the gel changed to agglomerated spherical powders when Ca content exceed to 20 mol%. Most of the Cao-$SiO_2$ gel showed amorphous when heat-treated up to $900^{\circ}C$. However, quartz and cristobalite was produced when heat-treated at $1000^{\circ}C$ and resultant microstructure of the gel contained microporous structure.

La 및 Si 첨가에 의한 알루미나의 열안정화 효과 (Effect of La and Si Addition on Thermal Stabilization of Alumina)

  • 이채현;임대영;김종옥;서두원;한문희
    • 공학논문집
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    • 제3권1호
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    • pp.215-222
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    • 1998
  • 촉매 연소용 촉매 담체인 $\gamma-Al_2O_3$ 분말의 열안정화에 미치는 La과 Si의 첨가 효과에 대하여 연구하였다. 첨가제의 첨가는 습식 impregnation방법으로 행하였고, 출발 물질은 $La(NO_3)_3{\cdot}6H_2O$$Si(OC_2H_5)_4$를 사용하였다. 열안정화 효과는 혼합분말을 고온에서 열처리 한 후 비표면적을 측정하여 고찰하였다. 첨가제로 첨가한 La과Si는 모두 순수한 $\gamma-Al_2O_3$분말에 비하여 소결을 억제함으로써 열 안정화 효과가 있음이 확인되었으며, 특히 Si 첨가한 경우에는 $\alpha-Al_2O_3$의 생성을 현저히 억제한다는 것을 확인하였다. 이들 첨가제에 의한 열안정화 효과는 첨가제에 의한 새로운 상의 생성과 표면 확산의 억제등이 주된 요인으로 판단되었다.

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ZnO-SnO2 투명박막트랜지스터의 동작에 미치는 게이트 절연층의 영향 (Effects of Gate Insulators on the Operation of ZnO-SnO2 Thin Film Transistors)

  • 천영덕;박기철;마대영
    • 한국전기전자재료학회논문지
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    • 제26권3호
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    • pp.177-182
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    • 2013
  • Transparent thin film transistors (TTFT) were fabricated on $N^+$ Si wafers. $SiO_2$, $Si_3N_4/SiO_2$ and $Al_2O_3/SiO_2$ grown on the wafers were used as gate insulators. The rf magnetron sputtered zinc tin oxide (ZTO) films were adopted as active layers. $N^+$ Si wafers were wet-oxidized to grow $SiO_2$. $Si_3N_4$ and $Al_2O_3$ films were deposited on the $SiO_2$ by plasma enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD), respectively. The mobility, $I_{on}/I_{off}$ and subthreshold swing (SS) were obtained from the transfer characteristics of TTFTs. The properties of gate insulators were analyzed by comparing the characteristics of TTFTs. The property variation of the ZTO TTFTs with time were observed.

SiC 표면 거칠기에 미치는 습식식각의 영향 (The Effect of Surface Roughness on SiC by Wet Chemical Etching)

  • 김재관;조영제;한승철;이혜용;이지면
    • 대한금속재료학회지
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    • 제47권11호
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    • pp.748-753
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    • 2009
  • The surface morphology and the surface roughness of n-type SiC induced by wet-treatment using 45% KOH and buffered oxide etchant (BOE-1HF : $6H_2O$) were investigated by atomic force microscopy (AFM). While Si-face of SiC could be etched by alkali solutions such as KOH, acidic solutions such as BOE were hardly able to etch SiC. When the rough SiC samples were used, the surface roughness of etched sample was decreased after wet-treatment regardless of etchant, due to the planarization the of surface by widening of scratches formed by mechanical polishing. It was observed that the initial etching was affected by the energetically unstable sites, such as dangling bond and steps. However, when a relatively smooth sample was used, the surface roughness was rapidly increased after treatment at $180^{\circ}C$ for 1 hr and at room temperature for 4 hr by using KOH solution, resulting from the nano-sized structures such as pores and bumps. This indicates that porous SiC surface can be achieved by using purely chemical treatment.

Verneuil법에 의한 $SiO_2$를 첨가한 Sapphire 단결정 성장 (SiO2 Doped Sapphire single Crystal Growth by Verneuil Method)

  • 조현;오근호;최종건;박한수
    • 한국세라믹학회지
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    • 제29권10호
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    • pp.822-826
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    • 1992
  • SiO2 doped sapphire single crystals were grown by Verneuil method using feed material which prepared by adding SiO2 in Al2O3. Crystal growing were attempted with varing doping amount of SiO2 from 0.01 to 1.0 wt% and when the doping amount of SiO2 were 0.01~0.04 wt%, single crystals could be attained. Starting materials for feed powder were 99.99% purity alumina and extra pure SiO2 powder. Mixing these two materials by wet milling for 24 hours and drying the mixture and then was calcined at 900~110$0^{\circ}C$ for 2~4 hours. The grown crystals had yellowish color and were somewhat transparent. During growing process the flow range of oxygen was 5~7.5ι/min and of hydrogen was 13~25ι/min, the average growth rate was 7.0~11 mm/hr. The pressure of gases were fixed at 5psi. The color of crystal was appeared and mechanical property of sapphire was developed by doping of SiO2.

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