• 제목/요약/키워드: Welding Device

검색결과 128건 처리시간 0.019초

용접부 품질향상을 위한 지능형 용접 와이어 공급 장치 개발 (Development of Intelligent Filler Wire Feeding Device for Improvement of Weld quality)

  • 이재석;손영일;박기영;이경돈
    • 한국정밀공학회지
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    • 제23권7호
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    • pp.59-66
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    • 2006
  • In laser welding, automatic seam tracking is important to adjust the laser head position in real time as it moves along the seam. Also if the joint gap is occurred, filling the missing material into the joint gap is necessary to prevent welding defects and bad welding quality. In general, the joint gap width is not constant along the seam due to a variety of reason. So it is essential to control the filler wire speed into the joint gap to acquire good welding quality. This paper describes an intelligent filler wire feeding device which can control 3-dimensional seam tracking and the filler wire speed by measuring the gap position and the joint gap width in laser welding. We call this device as Smart Micro Control system(SMC). To achieve this objective, we assessed weld quality in 2mm sheets of A16061 which had various gap width by using the developed device. From the experimental results, It was found the possibility that the developed device could be used in welding various 3-dimensional structures.

가속기 저장링 삽입장치 진공 챔버의 용접 (The welding Characteristics of the Insertion Device Vacuum Chamber of PLS Storage Ring)

  • 최만호;한영진;김창균;정진화;권영각
    • Journal of Welding and Joining
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    • 제17권4호
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    • pp.32-38
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    • 1999
  • PAL(Pohang Accelerator Laboratory) designed and manufactured a 5m-long straight vacuum chamber to adopt U7 undulator that is the first insertion device. Top and bottom plates of the vacuum chamber were made of Al alloy A5083-H321, and welded together by the GTAW welding. The leak rate is less than 1×{TEX}$10^{-10}${/TEX} torr·ℓ/s with negligible welding deformation. The pressure has been maintained below {TEX}$10^{-10}${/TEX} torr after installation. This paper reports the welding process and the method applied to achieve ultimate vacuum performance and t satisfy integrity of welds.

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Wire Feeding Speed Control for Improving Welding Performances in Inverter Arc Welding Machine

  • Gho, J.S.;Chae, Y.M.;Chae, J.W.;Mok, H.S.;Choe, G.H.;Shin, W.S.
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 1998년도 Proceedings ICPE 98 1998 International Conference on Power Electronics
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    • pp.464-469
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    • 1998
  • In the conventional wire feeder drives of welding machine, one thyristor or MOSFET device was used for half-wave phase control circuit and direct EMF measurement was used for sensing the wire feed rate. But the method using one switching device has poor response for sudden disturbance and it has latent speed ripple. It can affect some welding performance such as spatter generation and irregular bead formming. Therefore, the welding performance using full-bridge PWM speed control scheme was compared with conventional driving scheme was compared with conventional driving scheme and experimented in this paper. The results of experiment confirm the posibility of welding performance improvement by proposed constant speed control scheme in wire feeding drive of welding machine.

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전자기기 케이스를 위한 마그네슘 판재 스터드 용접 기술에 관한 연구 (A study for CD stud welding of Magnesium alloy for electric device case)

  • 이목영;류충선;장웅성;최상운
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2007년 추계학술발표대회 개요집
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    • pp.53-56
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    • 2007
  • Magnesium sheet used in electrical device due to mobility and EMF shielding characteristics. Magnesium case by press forming was advantageous compare with conventional die casting process, because of its thin gauge of wall and surface quality. But it need to makes the boss to fix inner part or assemble the case. CD stud welding was effective way for joining the boss to the thin gauge case of the electrical devices. In this study, we investigated the performances of the magnesium boss welder To measure the process parameters such as the force and the weld current, we design the monitoring system for CD stud welding. We test the characteristics of CD stud welding for AZ31 sheets at some variables. Finally we select the optimum welding range of magnesium sheets in CD stud welding process.

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선박외판 문자 자동용접 시스템의 개발 (Development of a Automatic Welding System for Various Marks on the Hull of Vessels)

  • 윤훈성;양종수;김호경;최영달
    • 대한조선학회 특별논문집
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    • 대한조선학회 2008년도 특별논문집
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    • pp.90-95
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    • 2008
  • The letters and marks on the hull of vessels are marked by welding bead or steel plate to resist the corrosion environment. It has done by manual work. So, it cause deterioration of welding quality and process delay and so on. The automated welding device for draft mark has developed partially in the field of shipbuilding. But it can be used for draft mark only. And it has caused a few problems about that workablity and movablity are decreased owing to the size and weight of device. So we developed the automated welding device that can be used for most letters and marks on the hull. It designed to 3 axises mobile robot include to ratoation axis and stand alone type controller with multi GUI base on imbedded windows.

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Development of Optical Device Housing Compacted Using SUS304L Granulated Powders

  • Suzuki, Hironori;Hara, Toshihiro;Ogino, Yukinobu;Sato, Yasushi;Tomota, Yo
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.754-755
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    • 2006
  • In order to develop the SUS304L housing by powder metallurgy for an optical device useful for the FTTH communication system, the optimum compacting pressure and sintering temperature were investigated using granulated powder as the material to satisfy high air-tightness and high laser-weldability. Then the laser-welding test of specimen made under the optimum condition was carried out to observe welding sputters.

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디바이스 내장형 플렉시블 전자 모듈 제조 및 신뢰성 평가 (Fabrication and Reliability Test of Device Embedded Flexible Module)

  • 김대곤;홍성택;김덕흥;홍원식;이창우
    • Journal of Welding and Joining
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    • 제31권3호
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    • pp.84-88
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    • 2013
  • These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.