• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.55-56
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• 2006

This research was carried out to observe the structure and characteristics of SUBA pad for silicon wafer polishing. As the diamond size is smaller and shape is rounder, the pad cut rate becomes smaller. From the experimental results, we suggests that the diamond grade should be over 680 when the diamond mesh is between #100 and #170 for SUBA pad.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.116-120
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• 2017

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.85-89
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• 2018

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials and inner coolant path on the chuck surface. Finally this study suggests the best cooling condition of electrostatic chuck.

• Design & Manufacturing
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• v.16 no.3
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• pp.9-15
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• 2022

In order to reduce the manufacturing costs of the glass lens, it is necessary to manufacture a lens using a UV curable resin or a thermosetting resin, which is a curable material, in order to replace a glass lens. In the case of forming a lens using a thermosetting material, it is necessary to form several lenses at once using the wafer-level lens manufacturing technologies due to the long curing time of the material. When a lens is manufactured using a curable material, an error in the shape of the lens due to the shrinkage of the material during the curing process is an important cause of defects. The major factors for these shape errors and deformations are the shrinkage and the change of mechanical properties in the process of changing from a liquid material during curing to a solid state after complete curing. Therefore, it is necessary to understand the curing process of the material and to examine the shrinkage rate and change of physical properties according to the degree cure. In addition, it is necessary to proceed with CAE for lens molding using these and to review problems in lens manufacturing in advance. In this study, the viscoelastic properties of the material were measured during the curing process using a rheometer. Using the results, Rheological investigation of cure kinetics was performed. At the same time, The shrinkage of the material was measured and simple mathematical models were created. And using the results, the molding process of a single lens was analyzed using Comsol, a commercial S/W. In addition, the experiment was conducted to compare and verify the CAE results. As a result, it was confirmed that the shrinkage rate of the material had a great influence on the shape precision of the final product.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.161-161
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• 2008

The oxide film of silicon wafer has been mainly polished by fumed silica, colloidal silica or ceria slurry. Because colloidal silica slurry is uniform and highly dispersed composed of spherical shape particles, by which the oxide film polished remains to be less scratched in finishing polishing process. Even though the uniformity and spherical shape is advantage for reducing the scratch, it may also be the factor to decrease the removal rate. We have studied the correlation of silica abrasive particles and CMP characteristics by varying pH, down force, and table rotation rate in polishing. It was found that the CMP polishing is dependent on the morphology, aggregation, and the surface property of the silica particles.

• Journal of Surface Science and Engineering
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• v.31 no.1
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• pp.45-53
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• 1998

Sharp tips are commonly used for applications in fields as diverse as nanolithography, lowvoltage field emitters, emitters, nanoelectroniecs, electrochemisty, cell biology, field-ion and electron microscopy. tungsten wire, mater만 used in this experiment, which test the chip of wafer has been used to the needle of probe card. Tungsten wire was sharpened by electrochemical etching methode to get a typical tip shape.

• Current Photovoltaic Research
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• v.8 no.1
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• pp.17-26
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• 2020

It is clear that monocrystalline Silicon (Si) ingots are the key raw material for semiconductors devices. In the present industries markets, most of monocrystalline Silicon (Si) ingots are made by Czochralski Process due to their advantages with low production cost and the big crystal diameters in comparison with other manufacturing process such as Float-Zone technique. However, the disadvantage of Czochralski Process is the presence of impurities such as oxygen or carbon from the quartz and graphite crucible which later will resulted in defects and then lowering the efficiency of Si wafer. The heat transfer plays an important role in the formation of Si ingots. However, the heat transfer generates convection in Si molten state which induces the defects in Si crystal. In this study, a crystal growth simulation software was used to optimize the Si crystal growth process. The furnace and system design were modified. The results showed the melt-crystal interface shape can affect the Si crystal growth rate and defect points. In this study, the defect points and desired interface shape were controlled by specific crystal growth rate condition.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.882-884
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• 2005

A new rectangular shape microlens array having high sag for solid-state lighting is presented. Proposed microlens, which has high sag, over $375{\mu}m$ and large diameter, over 3 mm can enormously enhance output optical extraction efficiency. Rectangular shape of microlens can maximize the fill factor of light-emitting-diode (LED) package and minimize the optical loss at the same time. This wafer level microlens array is fabricated on LED package. It has many advantages in optical properties, low cost, high aligning accuracy, and mass production.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.25 no.1
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• pp.36-44
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• 2015

Objectives: This study aimed to elucidate the physicochemical properties of silica powder and airborne particles as by-products generated from fabrication processes to reduce unknown risk factors in the semiconductor manufacturing work environment. Materials and Methods: Sampling was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. Thirty-two powder and airborne by-product samples, diffusion(10), chemical vapor deposition(10), chemical mechanical polishing(5), clean(5), etch process(2), were collected from inner chamber parts from process and 1st scrubber equipment during maintenance and process operation. The chemical composition, size, shape, and crystal structure of silica by-product particles were determined by using scanning electron microscopy and transmission electron microscopy techniques equipped with energy dispersive spectroscopy, and x-ray diffractometry. Results: All powder and airborne particle samples were composed of oxygen(O) and silicon(Si), which means silica particle. The by-product particles were nearly spherical $SiO_2$ and the particle size ranged 25 nm to $50{\mu}m$, and most of the particles were usually agglomerated within a particle size range from approximately 25 nm to 500 nm. In addition, the crystal structure of the silica powder particles was found to be an amorphous silica. Conclusions: The silica by-product particles generated from the semiconductor manufacturing processes are amorphous $SiO_2$, which is considered a less toxic form. These results should provide useful information for alternative strategies to improve the work environment and workers' health.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.81-85
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• 2005

In this paper, the structural design optimization of a wafer grinding machine using a multi-step optimization with genetic algorithm is presented. The design problem, in this study, is to find out the optimum configuration and dimensions of structural members which minimize the static compliance, the dynamic compliance, and the weight of the machine structure simultaneously under several design constraints. The first design step is shape optimization, in which the best structural configuration is found by getting rid of structural members that have no contributions to the design objectives from the given initial design configuration. The second and third steps are sizing optimization. The second design step gives a set of good design solutions having higher fitness for lightweight and minimum static compliance. Finally the best solution, which has minimum dynamic compliance and weight, is extracted among those good solution set. The proposed design optimization method was successfully applied to the structural design optimization of a high precision wafer grinding machine. After optimization, both static and dynamic compliances are reduced more than $92\%\;and\;93\%$ compared with the initial design, which was designed empirically by experienced engineers. Moreover the weight of the optimized structure are also slightly reduced than before.