Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Study on Temperature Characteristics according to Ceramic Material Stacking Sequence of Electrostatic Chuck Surface

정전척 표면의 세라믹물질 적층 순서에 따른 온도 특성에 관한 연구

  • 장경민 (한국기술교육대학교 대학원 메카트로닉스공학과) ;
  • 김광선 (한국기술교육대학교 메카트로닉스공학부)
  • Received : 2017.09.15
  • Accepted : 2017.09.25
  • Published : 2017.09.30
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Abstract

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.

Keywords

References

  1. K. Asano, F. Hatakeyama, and K. Yatsuzuka, "Fundamental Study of an electrostatic chuck for silicon wafer handling", IEEE Transaction On Industry Application, Vol. 38, No. 3, 2002.
  2. L.D. Hartsough, "Electrostatic Wafer Holding", Solid State Tech. 35, No. 1, pp. 87-90, 1993.
  3. S. A. Khomyakov, "Attraction and Accuracy Characteristic of Electrostatic Chucks", Machines and Tooling 50, No. 3, pp.24-24, 1979.
  4. Tretheway, D. and Aydil, E.S., "Modeling of Heat Transport and Wafer Healing Effects during Plasma Etching", J. Electrochem. Soc., Vol. 143, pp.3674-3680, 1996. https://doi.org/10.1149/1.1837270
  5. Suhas V. Patankar (1980), Numerical Heat Transfer and Fluid Flow, McGrow-Hill Book Company.