Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Surface Characteristics of Polishing Pad by Diamond Conditioner Conditions

다이아몬드 컨디셔너 조건에 따른 폴리싱 패드의 표면 특성

  • 유환수 ((주)실트론 기술연구소) ;
  • 최은석 ((주)실트론 기술연구소) ;
  • 배소익 ((주)실트론 기술연구소) ;
  • 박성일 ((주)신한다이아몬드공업 중앙연구소)
  • Published : 2010.04.01
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Abstract

This research was carried out to observe the structure and characteristics of SUBA pad for silicon wafer polishing. As the diamond size is smaller and shape is rounder, the pad cut rate becomes smaller. From the experimental results, we suggests that the diamond grade should be over 680 when the diamond mesh is between #100 and #170 for SUBA pad.

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