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A Study on Electrostatic Chuck Cooling by Ceramic Dielectric Material and Coolant path  

Kim, Daehyeon (Department of Mechatronics Engineering, Korea University of Technology and Education)
Kim, Kwangsun (Department of Mechatronics Engineering, Korea University of Technology and Education)
Publication Information
Journal of the Semiconductor & Display Technology / v.17, no.3, 2018 , pp. 85-89 More about this Journal
Abstract
Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials and inner coolant path on the chuck surface. Finally this study suggests the best cooling condition of electrostatic chuck.
Keywords
Electrostatic chuck; Temperature uniformity; Etching; CFD;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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