• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.4 no.2
• /
• pp.131-133
• /
• 1994

Deposition of silicon on pretreated sapphire substrates has been investigated by the liquid phase epitaxy method at low temperatures. An average 14 $\mu\textrm{m}$ thickness of silicon was grown over a large area on sapphire substrate originally coated with a much thinner silicon layer $[0.5 \mu\textrm{m} (100) Si/(1102) sapphire]$ at low temperatures from $(380^{\circ}C to 460^{\circ}C)$.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
• /
• 1995.05a
• /
• pp.60-68
• /
• 1995

This work wes performed to investigate the photocatalytic decolorization of waste water from textile industries. Methyl orange was used as a target dye with suspended Hombikat TiO$_2$ photocatalyst with a recirculating annular photoreactor. 1 wt % Pt-doped Hombikat thin film tubular reactor with parabolic reflector also wes usedin this experiment. The pH effect and flow rate effect on photobleaching of 0.012 g/l methyl orange solution, AtpH=3 Colour of methyl orange was completely bleached in 30 min with a 20 W UV lamp.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2005.07a
• /
• pp.616-619
• /
• 2005

OLED display are extremely sensitive to water and oxygen. Developing a thin film encapsulation for this technology has for a long time been elusive. Vitex has developed a multilayer barrier consisting of alternating inorganic and organic layers which can meet the requirements for a successful protection for such displays. In this paper we will discuss the basic process, the model, the results on top and bottom emission OLED displays as well as the application of Barix layers on plastic to create flexible OLED displays. We will show that for displays all the requirement for the telecommunication industry can be met and that the we can scale up to a mass manufacturing process.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2015.05a
• /
• pp.95-95
• /
• 2015

IGZO (Indium Gallium Zinc Oxide) 물질은 기존에 사용되던 Amorphous Silicon에 비해 전자 이동도가 더욱 빠르기 때문에 차세대 디스플레이 재료로서 각광받고 있으며, 이러한 빠른 전자 이동도는 디스플레이 소자에 있어서 매우 중요한 요소 중 하나이다. 이를 향상시키기 위하여 본 연구에서는 ICP(inductively coupled plasma) antenna를 이용하여 rf power와 requency를 변화함으로써 박막 증착 시 발생되는 플라즈마의 특성을 조절하여, 박막의 특성을 조절하고자 했다. 이렇게 증착된 IGZO 박막은 Hall Effect Measurement를 이용하여 전기적 특성을 분석하였으며, XPS(x-ray photoelectron spectroscopy)를 이용하여 박막의 조성을 분석하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.4 no.2
• /
• pp.119-130
• /
• 1994

To deposit silicon on borosilicate glass substrates, 18 different substrate combinations were investigated because of the difficulty of direct deposition of silicon. Sucessful results were obtained from Al-and Mg-treated glass and furnace annealed sputtered silicon deposited glass substrates. A continuous silicon thin film on a large area substrates was obtained in the temperatures ranges from $420^{\circ}C to 520^{\circ}C$. These thin films might be applied to lower the cost of solar cells and solar cell modules.

• Journal of the Korean Society for Heat Treatment
• /
• v.15 no.3
• /
• pp.118-126
• /
• 2002

TiCN thin films were deposited on tool steels at $510^{\circ}C$ by PECVD from a $TiCl_4+N_2+CH_4+H_2+Ar$ gaseous mixture. The microstructures and preferred orientation were investigated. The micro-scratch tests were performed using a system equipped with an acoustic emission sensor. Critical loads were determined to evaluate the adhesion of TiCN to substrate. The influences of the microstructures of substrates, double layered coatings, and coatings after nitriding(duplex coating) were investigated. The experimental results showed that the microstructures of substrates and double layered coating did not affect the critical loads considerably. By the duplex coating, critical loads were not always increased. In some cases, duplex coatings decreased critical loads significantly despite of absence of black layer. In this study, we tried to relate the results of scratch test to the residual stress analysis. Nitriding before the coating reduces the tensile residual stress in the film, which gives rise to low critical load in scratch test.

• Korean Journal of Materials Research
• /
• v.15 no.3
• /
• pp.149-154
• /
• 2005

Teflon like fluorocarbon thin films have been deposited on silicon and oxide molds as an antistiction layer for the hot embossing process by an inductively coupled plasma (ICP) chemical vapor deposition (CVD) method. The process was performed at $C_4F_8$ gas flow rate of 2 sccm and 30 W of plasma power as a function of substrate temperature. The thickness of film was measured by a spectroscopic ellipsometry. These films were left in a vacuum oven of 100, 200 and $300^{\circ}C$ for a week. The change of film thickness, contact angle and adhesion and friction force was measured before and after the thermal test. No degradation of film was observed when films were treated at $100^{\circ}C$. The heat treatment of films at 200 and $300^{\circ}C$ caused the reduction of contact angles and film thickness in both silicon and oxide samples. Higher adhesion and friction forces of films were also measured on films treated at higher temperatures than $100^{\circ}C$. No differences on film properties were found when films were deposited on either silicon or oxide. A 100 nm silicon template with 1 to $500\;{\mu}m$ patterns was used for the hot embossing process on $4.5\;{\mu}m$ thick PMMA spun coated silicon wafers. The antistiction layer of 10 nm was deposited on the silicon mold. No stiction or damages were found on PMMA surfaces even after 30 times of hot embossing at $200^{\circ}C$ and 10 kN.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.29 no.4
• /
• pp.290-298
• /
• 2018

Herein, an S-band internally-matched power amplifier that shows a power capability of 300 W in a Long Term Evolution(LTE) band 7 is designed and fabricated using a CGHV40320D GaN HEMT from Wolfspeed. Based on the nonlinear model, the optimum source and load impedance are extracted from the source-pull and load-pull simulations at the fundamental and harmonic frequencies, and the harmonic impedance tuning circuits are implemented inside a ceramic package. The internally matched power amplifier, which is fabricated using a thin-film substrate with a high relative permittivity of 40 and an RF35TC PCB substrate, is measured at the pulsed condition with a pulse period of 1 ms and a duty cycle of 10%. The measured results show a maximum output power of 257~323 W, a drain efficiency of 64~71%, and a power gain of 11.5~14.0 dB at 2.62~2.69 GHz. The LTE-based measurement shows a drain efficiency of 42~49% and an ACLR of less than -30 dBc(excluding 2.62 GHz) at an average power of 79 W.

• Journal of Sensor Science and Technology
• /
• v.3 no.1
• /
• pp.68-77
• /
• 1994

Grid type 70Ni-30Co thin films on slide glass at $250^{\circ}C$ has been fabricated to develope. From fabricated sensors using above process, we investigated the relation of temperature, resistivity, line width to magnetoresistance and we obtained the following results after observation of coercive force, saturated magnetization, maxium usable sensitivity, delay time, slew rate, white noise, resolution of the sensors. We confirmed that the $600{\AA}$ thin film at $250^{\circ}C$ formed crystalized magnetic anisotropy spontaneously and the sensor using the thin film had capability of detecting magnetic field with sensitivity of 230 nT. In these devices, the magnetoresistance change was increased linearly in ${\pm}10$ Oe range, and the magnetoresistance effect was increased when the ratio between line width and length was increased. When the devices was soldered using indium, the temperature-resistivity coefficient showed $8{\times}10^{-3}/deg$ and increased during the specific properties as magnetic field sensor were weakened. In this studies, the coercive forces of the films were about 5.1 A/cm and saturated magnetizations were 0.64 T, and the delay time in these devises was $5{\mu}s$ and slew rate showed 0.39 $Oe/{\mu}s$ and white noise was -120 dB.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.37 no.1
• /
• pp.88-93
• /
• 2024

To evaluate the possibility as a multi-level memory medium for the Ge₂Sb₂Te₅/TiN/W-doped Ge₂Sb₂Te₅ cell structure, the crystallization rate and stabilization characteristics according to voltage (V)- and current (I)- pulse sweeping were investigated. In the cell structures prepared by a magnetron sputtering system on a p-type Si (100) substrate, the Ge₂Sb₂Te₅ and W-doped Ge₂Sb₂Te₅ thin films were separated by a barrier metal, TiN, and the individual thicknesses were varied, but the total thickness was fixed at 200 nm. All cell structures exhibited relatively stable multi-level states of high-middle-low resistance (HR-MR-LR), which guarantee the reliability of the multilevel phase-change random access memory (PRAM). The amorphousto-multilevel crystallization rate was evaluated from a graph of resistance (R) vs. pulse duration (T) obtained by the nanoscaled pulse sweeping at a fixed applied voltage (12 V). For all structures, the phase-change rates of HR→MR and MR→LR were estimated to be approximately t<20 ns and t<40 ns, respectively, and the states were relatively stable. We believe that the doublestack structure of an appropriate Ge-Sb-Te film separated by barrier metal (TiN) can be optimized for high-speed and stable multilevel PRAM.