• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.566-569
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• 2002

The $(Sr_{0.9}Ca_{0.1})TiO_3$(SCT) thin films are deposited on Pt-coated electrode (Pt/TiN/$SiO_2$/Si) using RF sputtering method. The maximum dielectric constant of SCT thin film is obtained by annealing at $600[^{\circ}C]$. The temperature properties of the dielectric loss have a value within 0.02 in temperature ranges of $-80{\sim}+90[^{\circ}C]$. The capacitance characteristics had a stable value within ${\pm}4[%]$. The drastic decrease of dielectric constant and increase of dielectric loss in SCT thin films is observed above 200[kHz].

• 한국표면공학회지
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• 제49권1호
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• pp.40-45
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• 2016

Recently, $Bi_2Te_3$-based alloys are the best thermoelectric materials near to room temperature, so it has been researched to achieve increased figure of merit(ZT). Ternary compounds such as Bi-Te-Se and Bi-Sb-Te have higher thermoelectric property than binary compound Bi-Te and Sb-Te, respectively. Compared to DC plating method, pulsed electrodeposition is able to control parameters including average current density, and on/off pulse time etc. Thereby the morphology and properties of the films can be improved. In this study, we electrodeposited n-type ternary Cu-doped $Bi_2(Te-Se)_3$ thin film by modified pulse technique at room temperature. To further enhance thermoelectric properties of $Bi_2(Te-Se)_3$ thin film, we optimized Cu doping concentration in $Bi_2(Te-Se)_3$ thin film and correlated it to electrical and thermoelectric properties. Thus, the crystal, electrical, and thermoelectric properties of electrodeposited $Bi_2(Te-Se)_3$ thin film were characterized the XRD, SEM, EDS, Seebeck measurement, and Hall effect measurement, respectively. As a result, the thermoelectric properties of Cu-doped $Bi_2(Te-Se)_3$ thin films were observed that the Seebeck coefficient is $-101.2{\mu}V/K$ and the power factor is $1412.6{\mu}W/mK^2$ at 10 mg of Cu weight. The power factor of Cu-doped $Bi_2(Te-Se)_3$ thin film is 1.4 times higher than undoped $Bi_2(Te-Se)_3$ thin film.

• 마이크로전자및패키징학회지
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• 제8권1호
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• pp.39-43
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• 2001

$SiC_{x}N$_{y}$ film is deposited by electron cyclotron resonance plasma chemical vapor deposition system using $SiH_4$(5% in Ar), $CH_4$ and $N_2$. Ternary phase $SiC_{x}N$_{y}$ thin film deposited at the microwave power of 600 W and substrate temperature of 700 contains considerable amount of strong C-N bonds. Change in $CH_4$flow rate can effectively control the residual film stress, and typical surface roughness of 34.6 (rms) was obtained. Extreme]y high hardness (3952 Hv) and optical transmittance (95% at 633 nm) was achieved, which is suitable for a LIGA mask membrane application.

• 열처리공학회지
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• 제6권2호
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• pp.70-78
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• 1993

The presence of a residual stress in a thin film affects the properties and performances of the film, so the study of stress in a film must be very important. In this study, therefore, considering the characteristics of PECVD process, it was discussed that the residual stress, measured by $sin^2{\Psi}$ method, fo TiN films deposited on substrates with different TECs (thermal expansion coefficients) changed with film thickness. As a results, it was obtained that the residual stress of TiN film was compressive stress about all kinds of substrates and increased with film thickness. Also, the compressive residual stresses of TiN films increased in Si, Ti, STS304 order. According to the above results, we confirmed that the changes of residual stress of TiN film with substrates were due to the thermal stress originated form the difference in the TECs of the film and substrates, and that the intrinsic stress had dominating effect on the residual stress of TiN film deposited by PECVD. And in this study, the intrinsic stress of TiN film was compressive stress in spite of the Zone 1 structure. It is due to the entrapment of impurities in grain boundary or void.

• 마이크로전자및패키징학회지
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• 제12권4호통권37호
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• pp.345-349
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• 2005

300 mW-cm의 낮은 비저항을 갖는 카본-질소$\_$텅스텐 (W-C-N) 확산방지막을 원자층 증착법으로 제조하였으며, 반응기체로 $WF_6-N_2-CH_4$를 사용하였다. $N_2$ 및 $CH_4$ 반응기체를 주입 할 때는 고주파 펄스를 인가하여 플라즈마에 의한 반응물의 분리가 일어나도록 하였다. 다층금속배선에 사용하는 층간 절연층 (TEOS) 위에서 W-C-N 박막은 원자층 증착기구를 따르며, 10에서 100 사이클 동안 증착율이 0.2nm/cycles 로 일정한 값을 가진다. 또한 Cu 배선을 위한 확산방지막으로써 W-C-N 박막은 비정질 상을 가지며, $800^{\circ}C$에서 30분간 열처리해도 Cu의 확산을 충분히 방지할 수 있음을 확인하였다.

• 전기학회논문지
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• 제59권11호
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• pp.2016-2020
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• 2010

Indium-zinc-oxide (IZO) films were deposited at room temperature via RF sputtering with varying the flow rate of additive nitrogen gas ($N_2$). Thin film transistors (TFTs) with an inverted staggered configuration were fabricated by employing the various IZO films, such as $N_2$-added and pure (i.e., w/o $N_2$-added), as active channel layers. For all the deposited IZO films, effects of additive $N_2$ gas on their deposition rates, electrical resistivities, optical transmittances and bandgaps, and chemical structures were extensively investigated. Transfer characteristics of the IZO-based TFTs were measured and characterized in terms of the flow rate of additive $N_2$ gas. The experimental results indicated that the transistor action occurred when the $N_2$-added (with $N_2$ flow rate of 0.4-1.0 sccm) IZO films were used as the active layer, in contrast to the case of using the pure IZO film.

• 대한환경공학회지
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• 제27권1호
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• pp.59-66
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• 2005

[ $TiO_2$ ]박막은 DC 마그네트론 스퍼터링법을 이용하여 다양한 스퍼터링 파라미터(전력 $0.6{\sim}5.2\;kw$, 기판온도 실온${\sim}350^{\circ}C$, 산소량 $0{\sim}50\;sccm$($O_2+Ar$ 90 sccm, 압력은 약 1 mtorr))를 통하여 증착되었다. TiO-N박막도 가스의 유량비를 제외하고는 $TiO_2$박막과 같은 스퍼터링 조건하에서 증착되었다. 이러한 스퍼터링 파라미터에서 증착된 박막의 전기적 특성을 분석하기 위하여 시트저항을 측정하였고, 박막의 두께(${\alpha}$-step), 표면 거칠기(AFM), 형성 조직(FE-SEM, XRD)을 분석하여 최적 스퍼터링 파라미터를 도출하였다. 최적 스퍼터링 파라미터에서 제조된($TiO_2$, TiO-N)박막을 이용하여 광활성도를 평가하기 위하여 VOCs물질 중 toluene, 반응성 염료인 Suncion Yellow를 대상 물질로 선정하여 적용성 연구를 수행하였다. 실험에서 광촉매 박막은 적용물질에 대해서 광활성을 양호하게 보였으며, 특히 TiO-N광촉매 박막은 가시광 영역에서도 최대 33%의 톨루엔(5 ppm) 제거 효율을 나타내었다.

• 한국전기전자재료학회논문지
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• 제21권12호
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• pp.1135-1140
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• 2008

Bismuth-telluride based thin film materials are grown by Metal Organic Chemical Vapor Deposition(MOCVD). A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_2Te_3$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $4{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_2Te_3$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_2Te_3$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the sample was heated by heating block and the voltage output measured. As expected for a thermoelectric generator, the voltage decreases linearly, while the power output rises to a maximum. The highest estimated power of $1.3{\mu}W$ is obtained for the temperature difference of 45 K. we provide a promising procedure for fabricating thin film thermoelectric generators by using MOCVD grown thermoelectric materials which may have nanostructure with high thermoelectric properties.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.67-74
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• 2018

두께가 $20{\mu}m$이며, 직경이 각기 $100{\mu}m$, $300{\mu}m$, $500{\mu}m$인 p형 $Sb_2Te_3$와 n형 $Bi_2Te_3$ 박막레그들을 전기도금하여 열전박막모듈을 형성한 후, 박막레그의 직경에 따른 출력전압과 출력전력을 비교하였다. $100{\mu}m$ 직경 박막레그들로 구성된 모듈은 ${\Delta}T=36.7K$에서 365 mV, $300{\mu}m$ 직경 박막레그들로 형성한 모듈은 ${\Delta}T=37.5K$에서 142 mV, $500{\mu}m$ 직경 박막레그들로 제작한 모듈은 ${\Delta}T=36.1K$에서 53 mV의 open circuit 전압을 나타내었다. $100{\mu}m$ 직경 박막레그 모듈은 ${\Delta}T=36.7K$에서 $845{\mu}W$, $300{\mu}m$ 직경 박막레그 모듈은 ${\Delta}T=37.5K$에서 $631{\mu}W$, $500{\mu}m$ 직경 박막레그 모듈은 ${\Delta}T=36.1K$에서 $276{\mu}W$의 최대출력전력을 나타내었다.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.33-38
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• 2012

유리기판에 n형 Bi-Te 열전박막과 p형 Sb-Te 열전박막을 진공증착하여 in-plane 열전센서를 형성한 후, 열전센서의 감지특성을 분석하였다. 열전센서를 구성하는데 사용한 n형 Bi-Te 증착박막은 -165 ${\mu}V$/K의 Seebeck 계수와 $80{\times}10^{-4}W/K^2-m$의 출력인자를 나타내었으며, p형 Sb-Te 증착박막은 142 ${\mu}V$/K의 Seebeck 계수와 $51.7{\times}10^{-4}W/K^2-m$의 출력인자를 나타내었다. 이와 같은 n형 Bi-Te 및 p형 Sb-Te 박막 15쌍으로 구성된 열전센서는 2.8 mV/K의 감지도를 나타내었다.