Journal of the Korean Society for Heat Treatment (열처리공학회지)
- Volume 6 Issue 2
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- Pages.70-78
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- 1993
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- 1225-1070(pISSN)
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- 2508-4046(eISSN)
The Residual Stress of TiN Thin Film Deposited by PECVD
PECVD에 의해 증착된 TiN 박막의 잔류응력
- Song, K.D. (Department of Metallurgical Engineering, Yonsei University) ;
- Nam, D.H. (Department of Metallurgical Engineering, Yonsei University) ;
- Lee, I.W. (Department of Heat Treatment, Suwon Industrial College) ;
- Lee, G.H. (Thin Film Technology Lab., Korea Institute of Machinery & Metals) ;
- Kim, M.I. (Department of Metallurgical Engineering, Yonsei University)
- Published : 1993.06.30
Abstract
The presence of a residual stress in a thin film affects the properties and performances of the film, so the study of stress in a film must be very important. In this study, therefore, considering the characteristics of PECVD process, it was discussed that the residual stress, measured by
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