• International Journal of Automotive Technology
• /
• v.7 no.3
• /
• pp.337-343
• /
• 2006

Numerical calculations are made in order to find a possible correlation between the J-integral and the crack mouth opening displacement(CMOD) in dynamic nonlinear fracture experiments of 3-point bend(3PB) specimens. Both elastic-plastic and elastic-viscoplastic materials are considered at different impact velocities. The J-integral may be estimated from the crack mouth opening displacement which can be measured directly from photographs taken during dynamic experiments.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1994.03a
• /
• pp.71-79
• /
• 1994

Strip drawing of strain-hardening, viscoplastic materials with damage is analyzed by a rigid plastic finite element method. A process model is formulated using two state variables, one for strain hardening from slip dominated plastic distortion and the other for damage from growth of microvoids. Application of the model to steady state drawing is given via implementation in a consistent penalty finite element formulation. The predicted density changes as a result of void growth are compared to those from experiments reported in the literature. The effects of drawing conditions such as drawing speed and die angle on the mechanical property changes are studied.

• Journal of the Korean Society for Precision Engineering
• /
• v.11 no.2
• /
• pp.134-140
• /
• 1994

Numerical caiculations are made in order to find a possible relation between the J-integral and the crack mouth opening displacement(CMOD) in dynamic nonlinear fracture experiments. Both elastic-plastic and elastic-viscoplastic materials are considered at different impact velocities. The J-integral may be estimated from the crack mouth opening displacement which can be measured directiy from photographs taken during dynamic experiments.

• Journal of the Computational Structural Engineering Institute of Korea
• /
• v.24 no.1
• /
• pp.97-106
• /
• 2011

In this study, viscoplastic material properties of solder alloy which is used in the electronics packages are inversely estimated. A specimen is fabricated to this end, and an experiment is conducted to examine deformation by Moir$\acute{e}$ interferometry. As a result of the experiment, bending displacement of the specimen and shear strain of the solder are obtained. A viscoplastic finite element analysis procedure is established, and the material parameters are determined to match closely with the experiments. The uncertainties which include inherent experimental error and insufficient data of experiments are addressed by using the method of computer model calibration. As a result, material parameters are identified in the form of confidence interval, and the displacements and strains using these parameters are predicted in the form the prediction interval.

• Transactions of Materials Processing
• /
• v.3 no.1
• /
• pp.120-132
• /
• 1994

Strip drawing of strain-hardening, viscoplastic materials with damage is analyzed by a rigid plastic finite element method. A process model is formulated using two state variables, one for strain hardening from slip dominated plastic distortion and the other for damage from growth of microvoids. Application of the model to aluminum strip drawing is given via implementation in a consistent penalty finite element formulation. The predicted density changes as a result of void growth are compared to those from experiments reported in the literature. The effects of drawing conditions such as drawing speed and die angle on the mechanical property chages are studied.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.23 no.7 s.166
• /
• pp.1120-1128
• /
• 1999

An elastic-viscoplastic finite element analysis is performed to investigate detailed growth behavior of creep cracks and the numerical results are compared with experimental results. In Cr-Mo steel stress fields obtained from the crack growth method by mesh translation were compared with both cases that the secondary creep rate is only used as creep material property and the primary creep rate is included. Analytical stress fields, Riedel-Rice(RR) field, Hart-Hui-Riedel(HR) field and Prime(named in here) field, and the results obtained by numerical method were evaluated in details. Time vs. stress at crack tip was showed and crack tip stress fields were plotted. These results were compared with analytical stress fields. There is no difference of stress distribution at remote region between the case of 1st creep rate+2nd creep rate and the case of 2nd creep rate only. In case of slow velocity of crack growth, the effect of 1st creep rate is larger than the one of fast crack growth rate. Stress fields at crack tip region we, in order, Prime field, HR field and RR field from crack tip.

• Geomechanics and Engineering
• /
• v.25 no.3
• /
• pp.195-205
• /
• 2021

Time effect on the deformation and strength characteristics of geogrid reinforced sand retaining wall has become an important issue in geotechnical and transportation engineering. Three physical model tests on geogrid reinforced sand retaining walls performed under various loading conditions were simulated to study their rate-dependent behaviors, using the presented nonlinear finite element method (FEM) analysis procedure. This FEM was based on the dynamic relaxation method and return mapping scheme, in which the combined effects of the rate-dependent behaviors of both the backfill soil and the geosynthetic reinforcement have been included. The rate-dependent behaviors of sands and geogrids should be attributed to the viscous property of materials, which can be described by the unified three-component elasto-viscoplastic constitutive model. By comparing the FEM simulations and the test results, it can be found that the present FEM was able to be successfully extended to the boundary value problems of geosynthetic reinforced soil retaining walls. The deformation and strength characteristics of the geogrid reinforced sand retaining walls can be well reproduced. Loading rate effect, the trends of jump in footing pressure upon the step-changes in the loading rate, occurred not only on sands and geogrids but also on geogrid reinforced sands retaining walls. The lateral earth pressure distributions against the back of retaining wall, the local tensile force in the geogrid arranged in the retaining wall and the local stresses beneath the footing under various loading conditions can also be predicted well in the FEM simulations.

• Journal of Pharmaceutical Investigation
• /
• v.39 no.3
• /
• pp.185-199
• /
• 2009

Using a strain-controlled rheometer [Advanced Rheometric Expansion System (ARES)], the steady shear flow properties and the dynamic viscoelastic properties of $Antiphlamine-S^{(R)}$ lotion have been measured at $20^{\circ}C$ (storage temperature) and $37^{\circ}C$ (body temperature). In this article, the temperature dependence of the linear viscoelastic behavior was firstly reported from the experimental data obtained from a temperature-sweep test. The steady shear flow behavior was secondly reported and then the effect of shear rate on this behavior was discussed in detail. In addition, several inelastic-viscoplastic flow models including a yield stress parameter were employed to make a quantitative evaluation of the steady shear flow behavior, and then the applicability of these models was examined by calculating the various material parameters. The angular frequency dependence of the linear viscoelastic behavior was nextly explained and quantitatively predicted using a fractional derivative model. Finally, the strain amplitude dependence of the dynamic viscoelastic behavior was discussed in full to elucidate a nonlinear rheological behavior in large amplitude oscillatory shear flow fields. Main findings obtained from this study can be summarized as follows : (1) The linear viscoelastic behavior is almostly independent of temperature over a temperature range of $15{\sim}40^{circ}C$. (2) The steady shear viscosity is sharply decreased as an increase in shear rate, demonstrating a pronounced Non-Newtonian shear-thinning flow behavior. (3) The shear stress tends to approach a limiting constant value as a decrease in shear rate, exhibiting an existence of a yield stress. (4) The Herschel-Bulkley, Mizrahi-Berk and Heinz-Casson models are all applicable and have an equivalent validity to quantitatively describe the steady shear flow behavior of $Antiphlamine-S^{(R)}$ lotion whereas both the Bingham and Casson models do not give a good applicability. (5) In small amplitude oscillatory shear flow fields, the storage modulus is always greater than the loss modulus over an entire range of angular frequencies tested and both moduli show a slight dependence on angular frequency. This means that the linear viscoelastic behavior of $Antiphlamine-S^{(R)}$ lotion is dominated by an elastic nature rather than a viscous feature and that a gel-like structure is present in this system. (6) In large amplitude oscillatory shear flow fields, the storage modulus shows a nonlinear strain-thinning behavior at strain amplitude range larger than 10 % while the loss modulus exhibits a weak strain-overshoot behavior up to a strain amplitude of 50 % beyond which followed by a decrease in loss modulus with an increase in strain amplitude. (7) At sufficiently large strain amplitude range (${\gamma}_0$>100 %), the loss modulus is found to be greater than the storage modulus, indicating that a viscous property becomes superior to an elastic character in large shear deformations.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.10
• /
• pp.1377-1384
• /
• 2010

The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the room temperature to $125^{\circ}C$. An experiment is conducted to examine deformation by Moire interferometry. Three different constitutive equation models are used in the finite element analysis (FEA) of the thermal cycle. In order to minimize the difference between the FEA results and the experimental results, the material parameters of the solder alloy are considered to be unknown and are determined by conducting optimization. As a result of the study, the Anand model is found to represent the deformation behavior of the solder most accurately.