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Inverse Estimation of Viscoplastic Properties of Solder Alloy Using Moir$\acute{e}$ Interferometry and Computer Model Calibration  

Gang, Jin-Hyuk (한국항공대학교 항공우주 및 기계공학과)
Lee, Bong-Hee (충북대학교 기계공학과)
Joo, Jin-Won (충북대학교 기계공학부)
Choi, Joo-Ho (한국항공대학교 항공우주 및 기계공학부)
Publication Information
Journal of the Computational Structural Engineering Institute of Korea / v.24, no.1, 2011 , pp. 97-106 More about this Journal
Abstract
In this study, viscoplastic material properties of solder alloy which is used in the electronics packages are inversely estimated. A specimen is fabricated to this end, and an experiment is conducted to examine deformation by Moir$\acute{e}$ interferometry. As a result of the experiment, bending displacement of the specimen and shear strain of the solder are obtained. A viscoplastic finite element analysis procedure is established, and the material parameters are determined to match closely with the experiments. The uncertainties which include inherent experimental error and insufficient data of experiments are addressed by using the method of computer model calibration. As a result, material parameters are identified in the form of confidence interval, and the displacements and strains using these parameters are predicted in the form the prediction interval.
Keywords
moir$\acute{e}$ interferometry; computer model calibration; viscoplasticity; material property identification; inverse estimation;
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Times Cited By KSCI : 2  (Citation Analysis)
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