• Journal of Korea Society of Digital Industry and Information Management
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• v.6 no.2
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• pp.71-80
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• 2010

This thesis is purposed on developing security product co-evaluation statistics administrate program which is can administrate or analysis CC accreditation product using by DEVS modeling via portal site of member of CCRA. Via developing security product evaluation statistics administrate program, it can analysis the trend of all countries of the world in many ways, and noticed the ways of evaluation and accreditation of most countries via scheme analysis. Except this, it can analysis the situation of accreditation trend of any countries via data analysis of ICCC 2009. Also, For trend analysis to evaluation technique of CCRA member, it analyzed up to date technology and policy of the evaluation organization and the Certification Authority of most countries. And it peformed analysis the most trend of information security of evaluation authorization in CCRA member countries. In this program, It provide the function of trend statistics analysis which can statically analyzed the evaluation accreditation trends of most countries and automatical statistics by categorization ( by Product, Class and statistics in national) and report creation functions which can easily extraction and use the needed data. It has been updated the related informations until latest accredited product using by CC(Common Criteria) portal home page's data.

• Journal of the Korean Institute of Intelligent Systems
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• v.22 no.2
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• pp.161-167
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• 2012

This research deals with generating via points for autonomous navigation on a roadway for unmanned vehicles. When a vehicle plans a path from a starting point to a goal point, it should be able to map out which lane on which road it passes by. For this purpose, we should organize positional information of roads and save it as a database. This paper presents methods to save the database and to plan a shortest path to the goal by generating via points in consideration of the moving direction and the lane directions. Then we prove that the proposed algorithm can find the optimal path on the road through simulations.

• BMB Reports
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• v.40 no.1
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• pp.82-87
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• 2007

Our heterologous expression system of the human ferritin H-chain gene (hfH) allowed us to characterize the cellular effects of ferritin in yeasts. The recombinant Saccharomyces cerevisiae (YGH2) evidenced impaired growth as compared to the control, which was correlated with ferritin expression and with the formation of core minerals. Growth was recovered via the administration of iron supplements. The modification of cellular iron metabolism, which involved the increased expression of high-affinity iron transport genes (FET3 and FTR1), was detected via Northern blot analysis. The findings may provide some evidence of cytosolic iron deficiency, as the genes were expressed transcriptionally under iron-deficient conditions. According to our results examining reactive oxygen species (ROS) generation via the fluorescence method, the ROS levels in YGH2 were decreased compared to the control. It suggests that the expression of active H-ferritins reduced the content of free iron in yeast. Therefore, present results may provide new insights into the regulatory network and pathways inherent to iron depletion conditions.

• Journal of Convergence Society for SMB
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• v.6 no.3
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• pp.37-41
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• 2016

In this paper, we propose a fire alarm system that utilizes Wi-Fi to alarm multiple people at once. This system, based on Arduino, uses smoke, flame and temperature sensor units to sense fire and send detection data to a server via wireless communication system. The server uses stored data to relay current fire situations gathered from nearby sensors to smartphones. It also automatically reports the fire using location data from sensors. Using this system, we were able to retrieve fire alarm from sensors via push notification of our smartphone. We also confirmed the establishment of linkage with sensors and automatic report of fire via SMS. From this result, the possibility of sending real-time notifications via the Internet toward nearby smartphones about disasters such as conflagration has been proven to be feasible.

• ETRI Journal
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• v.35 no.4
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• pp.571-577
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• 2013

The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.9
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• pp.56-64
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• 1992

Because of a small bandgap energy, a high doping density, and a low operating temperature, the dark current in HgCdTe photodiode is almost composed of a tunneling current. The tunneling current is devided into an indirect tunneling current via traps and a band-to-band direct tunneling current. The indirect tunneling current dominates the dark current for a relatively high temperature and a low reverse bias and forward bias. For a low temperature and a high reverse bias the direct tunneling current dominates. In this paper, to verify the tunneling currents in HgCdTe photodiode, the new tunneling-recombination equation via trap is introduced and tunneling-recombination current is calculated. The new tunneling-recombination equation via trap have the same form as SRH (Shockley-Read-Hall) generation-recombination equation and the tunneling effect is included in recombination times in this equation. Chakrabory and Biswas's equation being introduced, band to band direct tunneling current are calculated. By using these equations, HgCdTe (mole fraction, 0.29 and 0.222) photodiodes are analyzed. Then the temperature dependence of the tunneling-recombination current via trap and band to band direct tunneling current are shown and it can be known what is dominant current according to the applied bias at athe special temperature.

• Biomaterials and Biomechanics in Bioengineering
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• v.3 no.1
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• pp.59-69
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• 2016

A surface resisting protein adsorption and cell adhesion is highly desirable for many biomedical applications such as diagnostic devices, biosensors and blood-contacting devices. In this study, a surface conjugated with sulfobetaine molecules was fabricated via the click reaction for the anti-fouling purpose. An alkyne-containing substrate (Alkyne-PPX) was generated by chemical vapor deposition of 4-ethynyl-[2,2]paracyclophane. Azide-ended mono-sulfobetaine molecules were synthesized and then conjugated on Alkyne-PPX via the click reaction. The protein adsorption from 10% serum was reduced by 57%, while the attachment of L929 cells was reduced by 83% onto the sulfobetaine-PPX surface compared to the protein adsorption and cell adhesion on Alkyne-PPX. In conclusion, we demonstrate that conjugation of mono-sulfobetaine molecules via the click chemistry is an effective way for reduction of non-specific protein adsorption and cell attachment.

• Journal of Information Display
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• v.12 no.1
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• pp.47-50
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• 2011

Highly stable amorphous indium.gallium.zinc-oxide (a-IGZO) thin-film transistors (TFTs) were fabricated with an etchstopper and via-hole structure. The TFTs exhibited 40 $cm^2$/V s field-effect mobility and a 0.21 V/dec gate voltage swing. Gate-bias stress induced a negligible threshold voltage shift (${\Delta}V_{th}$) at room temperature. The excellent stability is attribute to the via-hole and etch-stopper structure, in which, the source/drain metal contacts the active a-IGZO layer through two via holes (one on each side), resulting in minimized damage to the a-IGZO layer during the plasma etching of the source/drain metal. The comparison of the effects of the DC and AC stress on the performance of the TFTs at $60^{\circ}C$ showed that there was a smaller ${\Delta}V_{th}$ in the AC stress compared with the DC stress for the same effective stress time, indicating that the trappin of the carriers at the active layer-gate insulator interface was the dominant degradation mechanism.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.4 s.95
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• pp.402-409
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• 2005

In analog and digital electronic systems, crosstalk between transmission lines on the printed circuit board can degrade the performance of equipment operations. This paper presents a technique to analyze the effects of via fence, which is based on additional transmission lines grounded by vias. The technique is composed of a circuit concept approach for transmission line sections md an impedance modeling of via hole sections. All sections are represented by ABCD parameters and they are cascaded. Finally, this technique was verified by comparing the measurement results with the simulation ones.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.