• 한국입자에어로졸학회지
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• 제11권4호
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• pp.93-98
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• 2015

Particles which generated from plasma enhanced chemical vapor deposition (PECVD) during thin film deposition process can affect to the process yield. By using light extinction method, ISPM can measure particles in the large-diameter pipe (${\leq}300mm$). In our research, in-situ particle monitor (ISPM) sensor was installed at the 300 mm diameter exhaust-line to count the particles in each size. In-house flange for mounting the transmitting and receiving parts of ISPM was carefully designed and installed at a certain point of exhaust line where no plasma light affect to the light extinction measurement. Measurement results of trend changes on particle count in each size can confirm that ISPM is suitable for real-time monitoring of vacuum process.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.171-171
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• 2012

Neutral beam assisted chemical vapor deposition (NBa-CVD) process has been developed as a nove,l room temperature deposition process for the light-soaking free nano-crystalline silicon (nc-Si) thin films including intrinsic and n-type doped thin film. During formation of nc-Si thin films by the NBa-CVD process with silicon reflector at room temperature, the energetic particles enhance doping efficiency and crystalline phase in nc-Si thin films without additional heating at substrate. The effects of incident NB energy controlled by the reflector bias have been confirmed by Raman spectra analysis. Additionally, TEM images show uniform nc-Si grains which imbedded amorphous phase without incubation layer. The nc-Si films by the NBa-CVD are hardly degenerated by light soaking; the degradations of photoconductivity were just a few percents before and after light irradiation.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2003년도 High Temperature Superconductivity Vol.XIII
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• pp.89-89
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• 2003

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.29-32
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• 2002

This paper describes a novel structure of NMOSFET with elevated SiGe source/drain region and ultra-shallow source/drain extension(SDE)region. A new ultra-shallow junction formation technology. Which is based on damage-free process for rcplacing of low energy ion implantation, is realized using ultra-high vacuum chemical vapor deposition(UHVCVD) and excimer laser annealing(ELA).

• Carbon letters
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• 제14권3호
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• pp.145-151
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• 2013

Graphene is a fascinating material with excellent electrical, optical, mechanical, and chemical properties. Remarkable progress has been made in the development of methods for synthesizing large-area, high-quality graphene. Recently, the chemical vapor deposition method has opened up the possibility of using graphene for electronic devices and other applications. This review covers simple and inexpensive methods to grow graphene using polymers as solid carbon sources; which do not require an additional process to transfer graphene from the growth substrate to the receiver substrate.

• 세라미스트
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• 제9권6호
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• pp.24-29
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• 2006

Electron beam physical vapor deposition (EB-PVD) process has currently been applied to thermal barrier coatings (TBCs) for aircraft engines. Due to unique columnar structure, EB-PVD TBCs have advantages in resistances to thermal shock and thermal cycle for their applications, compared to films prepared by plasma spray By the EB-PVD equipment, we successfully obtained yttria-stabilized zirconia (YSZ) layer which has columnar and feather like structure including a large amount of nano size pores and gaps. The EB-PVD technique has been developed for coating functional perovskite type oxides such as (La, Sr)MnO3. Electrode properties have been improved by interface and structural control.

• 대한화학회지
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• 제48권6호
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• pp.663-666
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• 2004

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.33-36
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for deep sub-micron technology. The rise throughput and the stability in the device fabrication can be obtained by applying of CMP process to STI structure in 0.18$\mu\textrm{m}$ m semiconductor device. The reverse moat process has been added to employ in of each thin films in STI-CMP was not equal, hence the devices must to be effected, that is, the damage was occurred in the device area for the case of excessive CMP process and the nitride film was remained on the device area for the case of insufficient CMP process, and than, these defects affect the device characteristics. Also, we studied the High Selectivity Slurry(HSS) to perform global planarization without reverse moat step.

• 반도체디스플레이기술학회지
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• 제3권1호
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• pp.9-13
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• 2004

Carbon nanofibers (CNFs) with uniform diameter and controlled size were prepared from catalytic decomposition of $\textrm{C}_{2}\textrm{H}_{2}$ with Ni-MgO catalyst treated by mechanochemical (MC) process. The properties of Ni catalyst, such as size, distribution and morphology, can be governed by tuning grinding time in MC process. As a result, size and structure of CNFs can be tailored. The effect of grinding time to the as-grown CNFs was studied. CNFs with diameter from 10-70 nm were synthesized. CNFs with bundle formation sharing one tip and twisted CNFs were also synthesized with catalyst treated by MC process.

• 한국초전도ㆍ저온공학회논문지
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• 제4권2호
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• pp.5-10
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• 2002

Deposition condition of NiO that is one of Possible buffer layers for YBCO coated conductors was studied. NiO was deposited on textured Ni substrates by a MOCVD (metal-organic chemical vapor deposition) method. The degree of texture, and the surface roughness were analyzed by X-ray Pole figure, atomic force microscope and scanning electron microscope. The (111) and (200) textures were competitively developed , depending on an oxygen partial Pressure(PO2) and deposition temperature (Tp). The (200) textured NiO layer was deposited at Tp=450~47$0^{\circ}C$ and PO2= 1.67 Torr Out-of-Plane ($\omega$-scan) and in-plane ($\Phi$-scan) textures of the (200) NiO films were as good as 10.34$^{\circ}$ and 10.00$^{\circ}$ respectively The AFM surface roughness of NiO was in the range of 3~4.5 nm at PO2=0.91~3.34 Torr and at Tp=47$0^{\circ}C$ , and in the range of 3~13 nm at TP=450~53$0^{\circ}C$ and at PO2=1.67 Torr.