1 |
Chen, C.-F.; Chen, S.-H.; Hong, T.-M.; Ko, H.-W.; Sheu, S. E. Thin Solid Films 1993, 236, 120.
DOI
ScienceOn
|
2 |
Kim, S.-H.; Kim, B. New Diamond & Frontier CarbonTech. 2003, 13, 333.
|
3 |
Park, S.S.; Lee, J.Y. J. Mater. Sci. 1993, 28, 1799.
DOI
|
4 |
Park, Y.S.; Kim, S.-H.; Jung, S.K.; Shinn, M.N.; Lee,J.-W.; Hong, S.K.; Lee, J.Y. Mater. Sci. Eng. A 1996,209, 414.
DOI
ScienceOn
|
5 |
Chen, C.-F.; Huang, Y.C.; Hosomi, S.; Yoshida, I.Mater. Res. Bull. 1989, 24, 87.
DOI
ScienceOn
|
6 |
Liou, Y.; Ma, Y.-R. Diamond Relat. Mater. 1994, 3,573.
DOI
ScienceOn
|
7 |
Kim, S.-H.; Bae, E.-J.; Park, J.C.; Kim, T.-G.; Lee,S.K.; Hosomi, T.; Maki, T.; Kobayashi, T. Thin SolidFilms 2003, 425, 282.
DOI
ScienceOn
|
8 |
Park, B.S.; Baik, Y.-J. Diamond Relat. Mater. 1997, 6,1716.
DOI
ScienceOn
|
9 |
Schelz, S.; Martin, L.; Moisan, M. Diamond Relat.Mater. 1998, 7, 1291.
DOI
ScienceOn
|
10 |
Ravi, K.V.; Joshi, A. Appl. Phys. Lett. 1991, 58, 246.
DOI
|